JPS58212199A - 電磁シ−ルド材料 - Google Patents
電磁シ−ルド材料Info
- Publication number
- JPS58212199A JPS58212199A JP9548682A JP9548682A JPS58212199A JP S58212199 A JPS58212199 A JP S58212199A JP 9548682 A JP9548682 A JP 9548682A JP 9548682 A JP9548682 A JP 9548682A JP S58212199 A JPS58212199 A JP S58212199A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- shielding material
- electromagnetic shielding
- base material
- thin piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims description 35
- 229920003002 synthetic resin Polymers 0.000 claims description 20
- 239000000057 synthetic resin Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9548682A JPS58212199A (ja) | 1982-06-02 | 1982-06-02 | 電磁シ−ルド材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9548682A JPS58212199A (ja) | 1982-06-02 | 1982-06-02 | 電磁シ−ルド材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58212199A true JPS58212199A (ja) | 1983-12-09 |
| JPH0245359B2 JPH0245359B2 (enrdf_load_stackoverflow) | 1990-10-09 |
Family
ID=14138928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9548682A Granted JPS58212199A (ja) | 1982-06-02 | 1982-06-02 | 電磁シ−ルド材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58212199A (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923595A (ja) * | 1982-07-30 | 1984-02-07 | 東芝ケミカル株式会社 | 電磁波シ−ルド材料 |
| JPS59215799A (ja) * | 1983-05-24 | 1984-12-05 | 宗和化学株式会社 | 電磁遮蔽材 |
| JPS59225593A (ja) * | 1983-06-06 | 1984-12-18 | 株式会社フジクラ | 電磁防害遮蔽材 |
| JPS59225592A (ja) * | 1983-06-06 | 1984-12-18 | 株式会社フジクラ | 電磁防害遮蔽材 |
| JPS60178128U (ja) * | 1984-05-07 | 1985-11-26 | 株式会社ケンウッド | 防磁化粧シ−ト |
| JPS6127299U (ja) * | 1984-07-20 | 1986-02-18 | 日立エーアイシー株式会社 | 導電性シ−ト |
| JPS61190199U (enrdf_load_stackoverflow) * | 1985-05-21 | 1986-11-27 | ||
| JPS62192700U (enrdf_load_stackoverflow) * | 1986-05-27 | 1987-12-08 | ||
| JPH0221700A (ja) * | 1987-12-30 | 1990-01-24 | Sooken:Kk | 静電気発生防止と電磁波ノイズ進入防止機能を備えた電子機器 |
| WO2024237202A1 (ja) * | 2023-05-12 | 2024-11-21 | 帝人株式会社 | 繊維強化樹脂層と遮蔽層との一体成形体及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5456200A (en) * | 1977-10-13 | 1979-05-04 | Toray Industries | Electromagnetic wave shielding material |
-
1982
- 1982-06-02 JP JP9548682A patent/JPS58212199A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5456200A (en) * | 1977-10-13 | 1979-05-04 | Toray Industries | Electromagnetic wave shielding material |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923595A (ja) * | 1982-07-30 | 1984-02-07 | 東芝ケミカル株式会社 | 電磁波シ−ルド材料 |
| JPS59215799A (ja) * | 1983-05-24 | 1984-12-05 | 宗和化学株式会社 | 電磁遮蔽材 |
| JPS59225593A (ja) * | 1983-06-06 | 1984-12-18 | 株式会社フジクラ | 電磁防害遮蔽材 |
| JPS59225592A (ja) * | 1983-06-06 | 1984-12-18 | 株式会社フジクラ | 電磁防害遮蔽材 |
| JPS60178128U (ja) * | 1984-05-07 | 1985-11-26 | 株式会社ケンウッド | 防磁化粧シ−ト |
| JPS6127299U (ja) * | 1984-07-20 | 1986-02-18 | 日立エーアイシー株式会社 | 導電性シ−ト |
| JPS61190199U (enrdf_load_stackoverflow) * | 1985-05-21 | 1986-11-27 | ||
| JPS62192700U (enrdf_load_stackoverflow) * | 1986-05-27 | 1987-12-08 | ||
| JPH0221700A (ja) * | 1987-12-30 | 1990-01-24 | Sooken:Kk | 静電気発生防止と電磁波ノイズ進入防止機能を備えた電子機器 |
| WO2024237202A1 (ja) * | 2023-05-12 | 2024-11-21 | 帝人株式会社 | 繊維強化樹脂層と遮蔽層との一体成形体及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0245359B2 (enrdf_load_stackoverflow) | 1990-10-09 |
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