JPS58212199A - Electromagnetically shielding material - Google Patents

Electromagnetically shielding material

Info

Publication number
JPS58212199A
JPS58212199A JP9548682A JP9548682A JPS58212199A JP S58212199 A JPS58212199 A JP S58212199A JP 9548682 A JP9548682 A JP 9548682A JP 9548682 A JP9548682 A JP 9548682A JP S58212199 A JPS58212199 A JP S58212199A
Authority
JP
Japan
Prior art keywords
synthetic resin
shielding material
electromagnetic shielding
base material
thin piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9548682A
Other languages
Japanese (ja)
Other versions
JPH0245359B2 (en
Inventor
佐藤 行夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Aluminum KK
Original Assignee
Toyo Aluminum KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Aluminum KK filed Critical Toyo Aluminum KK
Priority to JP9548682A priority Critical patent/JPS58212199A/en
Publication of JPS58212199A publication Critical patent/JPS58212199A/en
Publication of JPH0245359B2 publication Critical patent/JPH0245359B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 この発明は、電子機器のハウジング等に用いる電磁シー
ルド材料に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electromagnetic shielding material used for housings of electronic devices and the like.

電子装置は、テレビ、ラジオ等の周辺機器にノイズなど
の悪い影響を及ぼす高周波を発生するため、このような
障害電波を遮蔽すること、即ち電磁シールドすることか
必要である。
Since electronic devices generate high frequencies that adversely affect peripheral devices such as televisions and radios, such as noise, it is necessary to shield such interfering radio waves, that is, to provide electromagnetic shielding.

特に最近の電子機器には、合成樹脂ハウジングが多(用
いられており、この材料は上記のような障害電波を透過
してしまうため、これを電磁シールドする種々の方法が
採用されている。
In particular, synthetic resin housings are often used in recent electronic devices, and since this material transmits the above-mentioned interference radio waves, various methods have been adopted to electromagnetically shield them.

例えば亜鉛溶射、銀、銅、ニッケルなどの導電性塗料の
塗装、真空蒸着、或は導電性フィラーの混入方法などで
ある。
Examples include zinc spraying, coating with conductive paint such as silver, copper, or nickel, vacuum deposition, or mixing of conductive filler.

亜鉛溶射の特徴は、すぐれたシールド効果をもっている
が、コストが高くまた前処理としての表面処理が必要で
あって量産性に乏しく、また労働環境が悪いという欠点
がある。
Zinc thermal spraying has an excellent shielding effect, but has the disadvantages of high cost, requiring surface treatment as a pretreatment, poor mass production, and poor working environment.

導電性塗料は、簡単な装置で容易に塗装できる長所を有
するが耐久性、価格、生産性等、現時点においては問題
がある。
Although conductive paints have the advantage of being easy to apply using simple equipment, they currently have problems such as durability, cost, and productivity.

また、真空蒸着は、合成樹脂との密着性をよ(するため
ベースコートが必要であり、さらに表面を保護するため
のコート層も必要で、バッチ処理を行う為生産性か悪い
こともあって、コスト的番こ高くつき、均一な蒸着膜を
得ることも困難である。
Additionally, vacuum evaporation requires a base coat to improve adhesion to the synthetic resin, and a coating layer to protect the surface, and because it involves batch processing, productivity may be poor. The cost is high and it is difficult to obtain a uniform deposited film.

一方、導電性のフィラーを混入する方法は、上記のよう
な表面処理方法と異なり、剥離や腐食、クランクの発生
などの心配がなく、特に、既存の工程で生産できる利点
を有し、成形後ただちに組立等を行なうことができる長
所がある。しがし、充分なシールド効果を得るためには
多量のフィラーを混入する必要かあり、多量のフィラー
を加えると合成樹脂の物性を損うという問題か生じる。
On the other hand, unlike the surface treatment methods mentioned above, the method of mixing conductive filler has the advantage of not having to worry about peeling, corrosion, or occurrence of cranks, and can be produced using existing processes. It has the advantage of being able to be assembled immediately. However, in order to obtain a sufficient shielding effect, it is necessary to mix a large amount of filler, and if a large amount of filler is added, the problem arises that the physical properties of the synthetic resin will be impaired.

この発明の目的は、合成樹脂に薄片を混入して、樹脂の
基本物性を損うことなく、しかも充分な電磁シールド効
果を有する電磁シールド材料を得ることにある。
An object of the present invention is to obtain an electromagnetic shielding material having a sufficient electromagnetic shielding effect without impairing the basic physical properties of the resin by mixing flakes into a synthetic resin.

以下、この発明を添付図面に基いて説明する。Hereinafter, the present invention will be explained based on the accompanying drawings.

第1図及び第2図は、この発明に用いる導電性薄片の構
造を示している。図示の1.ように、前記薄片1は、合
成樹脂基材2の両面に同種又は異種の金属層3を設けた
ものであって、例えば合成樹脂フィルムに金属箔を貼り
合せた後、薄片に裁断して製造する。あるいは合成樹脂
基材2の両面に金属蒸着を施した後薄片にしてもよい。
FIGS. 1 and 2 show the structure of the conductive flake used in this invention. 1. The thin piece 1 is made by providing metal layers 3 of the same type or different types on both sides of a synthetic resin base material 2, and is manufactured by, for example, laminating a metal foil onto a synthetic resin film and then cutting it into thin pieces. do. Alternatively, the synthetic resin base material 2 may be formed into thin pieces after metal vapor deposition on both sides thereof.

上記金属としては、アルミニウム、銅、錫、ニッケル、
鉛、金、銀などから選択することかできる。
The above metals include aluminum, copper, tin, nickel,
You can choose from lead, gold, silver, etc.

箔を用いる場合には、価格、重置の点から、アルミニウ
ムか最も好ましく、導電性、耐久性等がら5〜lOμ程
度の厚みが適当である。
When using foil, aluminum is most preferable from the viewpoint of cost and placement, and a thickness of about 5 to 10 μm is appropriate from the viewpoint of conductivity, durability, etc.

なお、金属層3の酸化を防止し、接触抵抗を減少せしめ
るため、第2図に示すように、他の金属蒸着膜3′を設
けてもよい。
Note that in order to prevent oxidation of the metal layer 3 and reduce contact resistance, another metal vapor deposition film 3' may be provided as shown in FIG.

次に、上記基材2に用いる樹脂としては、フィルム化可
能な樹脂を選択するのがよい。例えばポリイミド、ポリ
スチレン、アクリル、塩化ビニル、スチレン、ナイロン
、ポリプロピレン、ポリエチレンなどである。
Next, as the resin used for the base material 2, it is preferable to select a resin that can be formed into a film. Examples include polyimide, polystyrene, acrylic, vinyl chloride, styrene, nylon, polypropylene, and polyethylene.

上のような材料を用、:イて形成した薄片1の形状は、
種々選択可能である□が、方形状、即し正方形、長方形
が一般的である。また、後述する合成樹脂への混入の際
に、均一に分散すること、成形作業か容易であること等
を考慮すると、薄片1の厚みは、20〜150.μ、中
0.1〜3 am、′長さ0.1〜4馴程度のものか適
当である。
The shape of the thin piece 1 formed using the above material is as follows:
Various choices are possible, but rectangular shapes, ie, squares and rectangles, are common. In addition, considering the need for uniform dispersion and ease of molding when mixed into a synthetic resin, which will be described later, the thickness of the thin piece 1 is 20 to 150 mm. μ, medium 0.1 to 3 am, and length 0.1 to 4 am or so.

なお、第3図に明らかなように、薄片1の端面及び側面
は、金属層によって被われておらず、基材2の端面及び
側面が露出している。
As is clear from FIG. 3, the end and side surfaces of the thin piece 1 are not covered with the metal layer, and the end and side surfaces of the base material 2 are exposed.

上記のような薄片1をフィラーとして、第4図のように
、合成樹脂4に混入すると、この発明の電磁シールド材
料が得られる。前記合成樹脂4としては、射出成形可能
なものであれば任意に選択できるが、例えばポリイミド
、ポリスチル、アクリル、塩化ビニル、スチレン、ナイ
ロン、ポリプロピレン、ポリエチレンなどがある。
The electromagnetic shielding material of the present invention can be obtained by mixing the thin piece 1 described above as a filler into a synthetic resin 4 as shown in FIG. The synthetic resin 4 can be arbitrarily selected as long as it can be injection molded, and examples thereof include polyimide, polystil, acrylic, vinyl chloride, styrene, nylon, polypropylene, and polyethylene.

前述のように、薄片1の端面及び側面には、基材2か露
出しているので、上記のような合成樹脂4に混入すると
密着性に優れ、シールド材料の機械的物性を損うことか
少いか、密着性をより向上させるため、基材2と同一の
樹脂を選択するのが好ましい。
As mentioned above, the base material 2 is exposed on the end and side surfaces of the thin piece 1, so if it is mixed into the synthetic resin 4 as described above, it will have excellent adhesion and may impair the mechanical properties of the shielding material. It is preferable to select the same resin as the base material 2 in order to improve adhesion.

さらに、電磁シールド材料の物性を向上させるためには
、薄片1をできるだけ少量混入することが好ましい。し
かしそれでは充分なシールド性が得られない問題がある
Furthermore, in order to improve the physical properties of the electromagnetic shielding material, it is preferable to mix as little flake 1 as possible. However, there is a problem in that sufficient shielding performance cannot be obtained.

ここで、一般に導電性フィラーによるシールド性は、個
々のフィラー間の連結、即ち連続性の良否に依存してい
るから、できるだけ少い薄片1でも、第4図のように、
それらがそれぞれ住に接触し合った状態になるよう混入
することかできれは、シールド性を向上させることが可
能となる。そのためには、薄片1の基材2となる′合成
樹脂の曲げ強さか一定以上のものを混入するのがよい。
Here, since the shielding property of conductive fillers generally depends on the connection between individual fillers, that is, the quality of continuity, even if the number of thin pieces 1 is as small as possible, as shown in FIG.
If they can be mixed so that they are in contact with each other, it is possible to improve the shielding properties. To this end, it is preferable to mix in a material that has a bending strength higher than a certain level of the synthetic resin that will become the base material 2 of the thin piece 1.

混練や成形の際に、しわになったり折れ曲ったりするも
のは、合成樹脂の物性を損い脆弱にしてしまう上に、他
の薄片との接触の機会が少くなるが、一定以上の曲げ強
さを有すると、それ自体屈曲し難り。
Materials that wrinkle or bend during kneading or molding not only impair the physical properties of the synthetic resin and make it brittle, but also reduce the chances of contact with other flakes; If it has a hardness, it will be difficult to bend.

かつ他の薄片との連結性を維持するのに役立つ。and helps maintain connectivity with other flakes.

なお、基材の曲げ強さの大きい薄片だけを混入する必要
はなく、曲げ強さの大きいものを通常のものに混入して
も当然連結性を向上させることができる。
Note that it is not necessary to mix only thin pieces of the base material with high bending strength, and even if a thin piece with high bending strength is mixed into a normal base material, the connectivity can naturally be improved.

合成樹脂4に対する薄片1の混合割合は、10〜80重
量%であるか、そのうち10%以上は500χ10−6
グイン/ Caの曲は強さを有する薄片であることか望
ましい。
The mixing ratio of flake 1 to synthetic resin 4 is 10 to 80% by weight, or more than 10% of it is 500χ10-6
Guin/Ca's songs are preferably thin pieces with strength.

さらに、電磁シールド効果を高めるため、薄片の大きさ
の異なるものを種々混合するのかよい。
Furthermore, in order to enhance the electromagnetic shielding effect, it is a good idea to mix various flakes with different sizes.

以上のようにして得られた電磁シールド材料は、体積固
有抵抗で10−3〜10Ω・印となり、充分な電磁遮蔽
効果を有するが、それと同時に磁気遮蔽効果を兼ね備え
ているとさらに製品価値が上昇する。
The electromagnetic shielding material obtained in the above manner has a volume resistivity of 10-3 to 10Ω, and has a sufficient electromagnetic shielding effect, but if it also has a magnetic shielding effect at the same time, the product value will further increase. do.

そこで、基材2となる樹脂中に、予め透磁率の高い金属
粉を練り込んでお(と目的を達することかできる。この
金属粉としては鉄粉、フェライト粉などがあり、遮蔽効
果をあけるには50重量%以キ混合する必要がある。但
し80%を超えると樹脂をフィルム化するのが困難とな
る。
Therefore, it is possible to achieve the objective by kneading metal powder with high magnetic permeability into the resin that becomes the base material 2 in advance.This metal powder includes iron powder, ferrite powder, etc. It is necessary to mix 50% by weight or more. However, if it exceeds 80%, it becomes difficult to form the resin into a film.

この発明によれば、以上のよう1に、曲げ強さの大きい
導電性薄片を混入することにより、シールド材料となる
樹脂の物性を損わずに充分な電磁遮蔽効果が得られ、さ
らに薄片の端面、側面に基材樹脂を露出させであるので
シールド材料の樹脂との密着性に優れ、この点ても物性
のよいシールド材料が得られる。
According to the present invention, as described above, by mixing conductive thin pieces with high bending strength into 1, a sufficient electromagnetic shielding effect can be obtained without impairing the physical properties of the resin serving as the shielding material, and furthermore, the thin pieces Since the base resin is exposed on the end and side surfaces, it has excellent adhesion to the resin of the shielding material, and in this respect as well, a shielding material with good physical properties can be obtained.

また、樹脂フィルムに薄い金属層を設けた薄片を用いて
いるので、銀や銅、カーボン繊維、アルミニウムフレー
クなどに比し軽量丁ある。
Additionally, since it uses a thin piece of resin film with a thin metal layer, it is lighter than silver, copper, carbon fiber, aluminum flakes, etc.

そのほか、薄片の基材中に鉄粉などを混入することによ
り、磁気シールド効果も同時にあけることができる利点
がある。
In addition, by mixing iron powder or the like into the base material of the flakes, there is an advantage that a magnetic shielding effect can be achieved at the same time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図はこの発明のシールド材料に用いる薄
片の構造を示す断面図、第3図は同上の薄片の斜視図、
第4図はこの発明のシールド材料を示す断面図である。 1・・・導電性薄片、2・・・基材、3・・・金属層、
3′・・・金属蒸着j換、4・・・合成樹脂 ′11
1 and 2 are cross-sectional views showing the structure of a thin piece used in the shielding material of the present invention, and FIG. 3 is a perspective view of the same thin piece as above.
FIG. 4 is a sectional view showing the shielding material of the present invention. DESCRIPTION OF SYMBOLS 1... Conductive thin piece, 2... Base material, 3... Metal layer,
3'...Metal vapor deposition j conversion, 4...Synthetic resin'11

Claims (1)

【特許請求の範囲】 +11  合成樹脂基材の両面に金属層を有する導電性
薄片を10〜80重量%の割合で合成樹脂中に混入して
成る電磁シールド材料。 (2)  前記合成樹脂基材中に、透磁率の高い金属粉
を50〜80重量%混入した特許請求の範囲第1項記載
の電磁シールド材料。 (31+iiJ記薄片は、その厚みが20〜150μで
あり、r1]が0.1〜3 mm 、長さが0.1〜4
 mmである特許請求の範囲第1項記載の電磁シールド
材料。 (4)  前記合成樹脂基材と、薄片を混入する樹脂が
同種の合成樹脂である特許請求の範囲第1項記載の電磁
シールド材料。
[Claims] +11 An electromagnetic shielding material comprising a synthetic resin base material and a conductive thin piece having metal layers on both sides mixed in a synthetic resin at a ratio of 10 to 80% by weight. (2) The electromagnetic shielding material according to claim 1, wherein 50 to 80% by weight of metal powder with high magnetic permeability is mixed into the synthetic resin base material. (31+iiJ thin piece has a thickness of 20 to 150μ, r1] of 0.1 to 3 mm, and a length of 0.1 to 4
The electromagnetic shielding material according to claim 1, which is mm. (4) The electromagnetic shielding material according to claim 1, wherein the synthetic resin base material and the resin in which the flakes are mixed are the same type of synthetic resin.
JP9548682A 1982-06-02 1982-06-02 Electromagnetically shielding material Granted JPS58212199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9548682A JPS58212199A (en) 1982-06-02 1982-06-02 Electromagnetically shielding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9548682A JPS58212199A (en) 1982-06-02 1982-06-02 Electromagnetically shielding material

Publications (2)

Publication Number Publication Date
JPS58212199A true JPS58212199A (en) 1983-12-09
JPH0245359B2 JPH0245359B2 (en) 1990-10-09

Family

ID=14138928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9548682A Granted JPS58212199A (en) 1982-06-02 1982-06-02 Electromagnetically shielding material

Country Status (1)

Country Link
JP (1) JPS58212199A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923595A (en) * 1982-07-30 1984-02-07 東芝ケミカル株式会社 Electromagnetic shielding material
JPS59215799A (en) * 1983-05-24 1984-12-05 宗和化学株式会社 Electromagnetic shield material
JPS59225593A (en) * 1983-06-06 1984-12-18 株式会社フジクラ Electromagnetic disturbance shielding material
JPS59225592A (en) * 1983-06-06 1984-12-18 株式会社フジクラ Electromagnetic disturbance shielding material
JPS60178128U (en) * 1984-05-07 1985-11-26 株式会社ケンウッド Magnetic shield decorative sheet
JPS6127299U (en) * 1984-07-20 1986-02-18 日立エーアイシー株式会社 conductive sheet
JPS61190199U (en) * 1985-05-21 1986-11-27
JPS62192700U (en) * 1986-05-27 1987-12-08
JPH0221700A (en) * 1987-12-30 1990-01-24 Sooken:Kk Electronic equipment having function of preventing generation of static electricity and penetration of electromagnetic wave noise

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456200A (en) * 1977-10-13 1979-05-04 Toray Industries Electromagnetic wave shielding material

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5456200A (en) * 1977-10-13 1979-05-04 Toray Industries Electromagnetic wave shielding material

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923595A (en) * 1982-07-30 1984-02-07 東芝ケミカル株式会社 Electromagnetic shielding material
JPS59215799A (en) * 1983-05-24 1984-12-05 宗和化学株式会社 Electromagnetic shield material
JPS59225593A (en) * 1983-06-06 1984-12-18 株式会社フジクラ Electromagnetic disturbance shielding material
JPS59225592A (en) * 1983-06-06 1984-12-18 株式会社フジクラ Electromagnetic disturbance shielding material
JPS60178128U (en) * 1984-05-07 1985-11-26 株式会社ケンウッド Magnetic shield decorative sheet
JPS6127299U (en) * 1984-07-20 1986-02-18 日立エーアイシー株式会社 conductive sheet
JPH0223039Y2 (en) * 1984-07-20 1990-06-21
JPS61190199U (en) * 1985-05-21 1986-11-27
JPH0517920Y2 (en) * 1985-05-21 1993-05-13
JPS62192700U (en) * 1986-05-27 1987-12-08
JPH0234880Y2 (en) * 1986-05-27 1990-09-19
JPH0221700A (en) * 1987-12-30 1990-01-24 Sooken:Kk Electronic equipment having function of preventing generation of static electricity and penetration of electromagnetic wave noise

Also Published As

Publication number Publication date
JPH0245359B2 (en) 1990-10-09

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