JPH01140800A - Molding for emi shield - Google Patents
Molding for emi shieldInfo
- Publication number
- JPH01140800A JPH01140800A JP62299481A JP29948187A JPH01140800A JP H01140800 A JPH01140800 A JP H01140800A JP 62299481 A JP62299481 A JP 62299481A JP 29948187 A JP29948187 A JP 29948187A JP H01140800 A JPH01140800 A JP H01140800A
- Authority
- JP
- Japan
- Prior art keywords
- shielding effect
- conductive layer
- less
- metal
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 10
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 7
- 239000004917 carbon fiber Substances 0.000 claims abstract description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 abstract description 16
- 239000000835 fiber Substances 0.000 abstract description 8
- 239000000945 filler Substances 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000004299 exfoliation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ＥＭ Ｉ （Ｅ １ｅｃｔｒｏ Ｍａｇｎ
ｅｔｉｃ［ｎｔｅｒｆｅｒｅｎｃｅ ）シールド用成形
物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention is directed to an electromagnetic field
etic [interference] This relates to a molded product for shielding.
本発明により提供される成形物は、事務機器、電子計算
機、ＴＶレシーバなどの電子機器を収納する筐体等の材
料に好適に用いられる。The molded product provided by the present invention is suitably used as a material for housings and the like for housing electronic devices such as office equipment, electronic computers, and TV receivers.
（従来技術および問題点〕
従来、熱可塑性樹脂材料にＥＭＩシールド効果を付与す
る方法として■亜鉛溶射、■導電性塗料の塗装、■導電
性フィラーの混入などの方法がある。(Prior Art and Problems) Conventionally, methods for imparting an EMI shielding effect to thermoplastic resin materials include: (1) zinc spraying, (2) coating with conductive paint, and (2) mixing with conductive filler.
しかし、■亜鉛溶射や■導電性塗料の塗装では、マズキ
ング等の二次加工が必要であり、基材との密着性が不充
分で導電層の剥離によりシールド効果が失なわれるおそ
れがある。■Ｓ電性フィラーを混入する方法では、樹脂
材料にフィラーを多聞に加えなければＥＭ［シールド効
果を充分発揮できないが、フィラーの多量添加は、コス
トアップや成形物外観の低下という問題を招来し、更に
、この場合化粧塗装が必要となるなどの煩雑がある。However, (1) zinc spraying and (2) coating with conductive paint require secondary processing such as masking, and there is a risk that the shielding effect will be lost due to insufficient adhesion to the base material and peeling of the conductive layer. ■In the method of mixing an S-conductive filler, the EM [shielding effect] cannot be fully demonstrated unless a large amount of filler is added to the resin material, but adding a large amount of filler can lead to problems such as increased costs and deterioration of the appearance of the molded product. Furthermore, in this case, there are complications such as the need for decorative painting.
本発明は、かかる欠点の解決を目的とするものであり、
二次加工が不要で、少ないフィラー含有量でＥＭＩシー
ルド効果の優れた成形物を提供するものである。The present invention aims to solve these drawbacks,
This provides a molded product that does not require secondary processing, has a low filler content, and has an excellent EMI shielding effect.
本発明は、下記の通りである。 The present invention is as follows.
金属被覆炭素ＩＭ維を１０〜６０重閤％含む厚さＯ、２
〜１．０ｍｍの導電層と熱可塑性樹脂層とが層状に配置
されていることを特徴とするＥＭｒシールド用成形成形
物発明で金属被覆炭素繊維とは、炭素繊維の表面を金属
で被覆した繊維である。炭素繊維は、通常、直径４〜１
０μｍの単繊維１００本程度以上から構成されるポリア
クリロニトリル系、ビッヂ系、レーヨン系の炭素質及び
黒鉛質の繊維である。Thickness O, 2 containing 10 to 60% metal-coated carbon IM fibers
A molded product for EMR shielding characterized by having a conductive layer of ~1.0 mm and a thermoplastic resin layer arranged in a layered manner.In the invention, metal-coated carbon fiber refers to a fiber whose surface is coated with metal. It is. Carbon fiber usually has a diameter of 4 to 1
It is a polyacrylonitrile-based, vidge-based, rayon-based carbonaceous and graphite fiber composed of about 100 or more single fibers of 0 μm.
金属被覆の方法は、電気めっき、化学めっき、物理蒸着
、化学蒸着、溶射等のいずれでもよいが、単繊維１本１
本に均一な金属被覆が容易にられ、生産性が高い点で電
気めっきが好ましい。The method of metal coating may be electroplating, chemical plating, physical vapor deposition, chemical vapor deposition, thermal spraying, etc.
Electroplating is preferred because it facilitates uniform metal coating on books and has high productivity.
被覆金属の種類は、Ａｕ 、 ＡＱ 、Ｃｕ 、 Ｎｉ
。The types of coating metals are Au, AQ, Cu, Ni.
.
Ａ Ｉ２１Ｃｒ Ｎ Ｚ ｎ −、Ｓ ｎ 、 ｐ ｂ
等ノイスレテモよいが、導電性、価格、耐蝕性の点から
Ｎｉが好ましい。A I21Cr NZ n -, S n , p b
Ni is preferable from the viewpoint of conductivity, cost, and corrosion resistance.
本発明の成形物を製造するには、まず、金属被覆炭素Ｉ
ＢＭを含む導電性となるシートを作製する。このシート
は、既知の材料、例えば、パルプと混抄したベーパーで
もよいし熱可塑性樹脂をバイダン−とした不織布でもよ
いし、また、熱可塑性樹脂を含浸したシート材料でもよ
い。To produce the molded article of the present invention, first, metal-coated carbon I
A conductive sheet containing BM is produced. This sheet may be made of a known material, such as vapor mixed with pulp, a nonwoven fabric made of thermoplastic resin as a binder, or a sheet material impregnated with thermoplastic resin.
次に、かかるシート（導電層）を金型中で熱可塑性樹脂
と層状に配置し成形する。Next, such a sheet (conductive layer) is arranged in a layer with a thermoplastic resin in a mold and molded.
本発明において、導電層は金属被覆炭素繊維を１０〜６
０重量％含むことが必要である。１０重量％未満では、
導電性が不充分で、優れたシールド効果が得られない。In the present invention, the conductive layer consists of 10 to 6 metal coated carbon fibers.
It is necessary to contain 0% by weight. If it is less than 10% by weight,
The conductivity is insufficient, and an excellent shielding effect cannot be obtained.
６０重世％を超えると、シールド効果は向上するが、繊
維の剥離が起るおそれがある。If it exceeds 60%, the shielding effect will be improved, but there is a risk that the fibers will peel off.
また、導電層の厚さは、０．２〜１．Ｏｖ＋＋であるこ
とが必要である。０．２１未満では、シールド効果は不
充分であり、１．０ｍｍ０１を超えると、フィラーの匿
が多くなり、価格が高くなり、更に、シートが剛直とな
り、複雑形状の成形が困難になる。Moreover, the thickness of the conductive layer is 0.2 to 1. It is necessary that Ov++. If it is less than 0.21, the shielding effect will be insufficient, and if it exceeds 1.0 mm01, the filler will be hidden, increasing the price, and furthermore, the sheet will become rigid, making it difficult to mold into complex shapes.
本発明による成形物は、化粧塗装等の二次加工が不要で
あり、少ないフィラー含有量で優れたＥＭＩシールド効
果を有する。The molded product according to the present invention does not require secondary processing such as decorative coating, and has an excellent EMI shielding effect with a small filler content.
実施例１
Ｎｉ被被覆炭素線維東邦レーヨン（株）製ベスフ？イト
薗Ｃチョツプドファイバー（４１１１１１％さＧｍｍ
、 Ｎ ｉ膜厚０．２５ μｍ ） ５０重間％、ポリ
プロピレン繊維チョツプドファイバー（チッソ（株）製
ＥＳＪＭ雑）５０重間％を混抄し、坪量８０（＋ ／
ｒａ ２、厚０．３ＩＩ１１のシートを作製した。Example 1 Ni-coated carbon fiber Besufu? manufactured by Toho Rayon Co., Ltd. Itozono C chopped fiber (411111% Gmm
, Ni film thickness 0.25 μm) 50 wt %, polypropylene chopped fiber (ESJM miscellaneous manufactured by Chisso Corporation) 50 wt % mixed paper, basis weight 80 (+ /
A sheet having an ra of 2 and a thickness of 0.3II11 was produced.
このシートを射出成形機の金型にセットし、更に、ポリ
プロピレン樹脂を射出成形し、第１図に示すような箱型
の成形物を得た。This sheet was set in a mold of an injection molding machine, and polypropylene resin was further injection molded to obtain a box-shaped molded product as shown in FIG.
この成形物は、各内面側に導電層、各外面側に熱可塑性
樹脂層が層状に配置されているので、外観上は、樹脂単
独からなるものと同じである。Since this molded product has a conductive layer on each inner surface and a thermoplastic resin layer on each outer surface, it looks the same as one made of resin alone.
この成形物のＥＭＩシールド効果を測定したところ、全
体に占める金属被覆炭素ＩＩ（ＭＣ）の割合はわずか１
重量％であるが、５００Ｍ ＨＺで５０ｄＢ、！＝ｌ！
ｌれたシールド効果が認められた。When we measured the EMI shielding effect of this molded product, we found that the proportion of metal-coated carbon II (MC) in the whole was only 1.
Weight% is 50dB at 500MHz! =l!
A weak shielding effect was observed.
比較例１
実施例１におけると同じＭＣをポリプロピレン樹脂にコ
ンパウンドしたベレット（ＭＣ含有率８重量％）を用い
、射出成形にて同じ箱型の成形物を（ｑた。Comparative Example 1 Using a pellet (MC content: 8% by weight) in which the same MC as in Example 1 was compounded with polypropylene resin, the same box-shaped molded product was made by injection molding.
このものについてＥＭＩシールド効果を測定したところ
、シールド効果は、５００Ｍ ＨＺで４０ｄＢと実施例
１の場合に比べ低く、また、成形物外観は不良で、化粧
塗装を必要とした。When the EMI shielding effect of this product was measured, the shielding effect was 40 dB at 500 MHz, which was lower than that of Example 1, and the appearance of the molded product was poor, requiring decorative painting.
実施例１と比較例１に関する以上の事項等をまとめて示
すと下表のようになる。The above matters regarding Example 1 and Comparative Example 1 are summarized as shown in the table below.
第 １ 表
第１図は、本発明成形物の１例である箱型のＥＭｒシー
ルド成形物の斜視図、第２図は、第１図のＡ−Ａ断面図
である。Table 1 FIG. 1 is a perspective view of a box-shaped EMr shield molded product, which is an example of the molded product of the present invention, and FIG. 2 is a sectional view taken along the line AA in FIG. 1.
１：１ｊ電層、２：熱可塑性樹脂層1: 1j electric layer, 2: thermoplastic resin layer
Claims (1)
１．０ｍｍの導電層と熱可塑性樹脂層とが層状に配置さ
れていることを特徴とするＥＭＩシールド用成形物。Thickness 0.2~ containing 10~60% by weight of metal coated carbon fiber
A molded article for EMI shielding, characterized in that a 1.0 mm conductive layer and a thermoplastic resin layer are arranged in a layered manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62299481A JPH01140800A (en) | 1987-11-27 | 1987-11-27 | Molding for emi shield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62299481A JPH01140800A (en) | 1987-11-27 | 1987-11-27 | Molding for emi shield |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140800A true JPH01140800A (en) | 1989-06-01 |
Family
ID=17873131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62299481A Pending JPH01140800A (en) | 1987-11-27 | 1987-11-27 | Molding for emi shield |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140800A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06278259A (en) * | 1991-07-29 | 1994-10-04 | Aica Kogyo Co Ltd | Electrically conductive decorative laminated sheet |
| EP2271486B2 (en) † | 2008-03-28 | 2021-01-27 | Hexcel Composites Limited | Improved composite materials |
-
1987
- 1987-11-27 JP JP62299481A patent/JPH01140800A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06278259A (en) * | 1991-07-29 | 1994-10-04 | Aica Kogyo Co Ltd | Electrically conductive decorative laminated sheet |
| EP2271486B2 (en) † | 2008-03-28 | 2021-01-27 | Hexcel Composites Limited | Improved composite materials |
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