JPS6339970A - Electrically conductive resin composition for electromagnetic wave shielding - Google Patents
Electrically conductive resin composition for electromagnetic wave shieldingInfo
- Publication number
- JPS6339970A JPS6339970A JP18463686A JP18463686A JPS6339970A JP S6339970 A JPS6339970 A JP S6339970A JP 18463686 A JP18463686 A JP 18463686A JP 18463686 A JP18463686 A JP 18463686A JP S6339970 A JPS6339970 A JP S6339970A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- conductive resin
- electromagnetic wave
- wave shielding
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 35
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 239000000835 fiber Substances 0.000 claims abstract description 24
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 20
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000010951 brass Substances 0.000 claims abstract description 20
- LRQGFQDEQPZDQC-UHFFFAOYSA-N 1-Phenyl-1,3-eicosanedione Chemical compound CCCCCCCCCCCCCCCCCC(=O)CC(=O)C1=CC=CC=C1 LRQGFQDEQPZDQC-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims abstract description 6
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002482 conductive additive Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229920001890 Novodur Polymers 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 125000003696 stearoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000004697 chelate complex Chemical class 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 150000002085 enols Chemical group 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JGLMVXWAHNTPRF-CMDGGOBGSA-N CCN1N=C(C)C=C1C(=O)NC1=NC2=CC(=CC(OC)=C2N1C\C=C\CN1C(NC(=O)C2=CC(C)=NN2CC)=NC2=CC(=CC(OCCCN3CCOCC3)=C12)C(N)=O)C(N)=O Chemical compound CCN1N=C(C)C=C1C(=O)NC1=NC2=CC(=CC(OC)=C2N1C\C=C\CN1C(NC(=O)C2=CC(C)=NN2CC)=NC2=CC(=CC(OCCCN3CCOCC3)=C12)C(N)=O)C(N)=O JGLMVXWAHNTPRF-CMDGGOBGSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000003348 petrochemical agent Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008030 superplasticizer Substances 0.000 description 1
- 238000003419 tautomerization reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電磁波遮蔽性に優れた電磁波遮蔽用導電性樹脂
組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a conductive resin composition for shielding electromagnetic waves that has excellent electromagnetic wave shielding properties.
（従来の技術）
コンピューター、ＶＴＲなどの電子機器に内蔵された集
積回路（ＩＣ）は１社会的ニーズにより。(Prior Art) Integrated circuits (ICs) built into electronic devices such as computers and VTRs are becoming increasingly popular due to social needs.
小型化・高速化がはかられている。その結果、 ＩＣに
内蔵される電流も微電流となり、そのために外部からの
電磁波による誤作動、映像障害などの電磁波障害が生じ
やすくなり９今日の大きな問題となっている。Efforts are being made to make it smaller and faster. As a result, the current built into the IC becomes a very small current, which makes it easy to cause electromagnetic disturbances such as malfunctions and video disturbances caused by external electromagnetic waves9, which has become a major problem today.
他方、樹脂材料は、軽量であるうえに耐食性・成形性・
量産性などに優れるため、電子機器のハウジング材料と
して用いられている。しかし、樹脂は絶縁性であること
から、電磁波が透過し、そのために、電磁波障害が起こ
りやすい。On the other hand, resin materials are lightweight, corrosion resistant, moldable, and
Due to its excellent mass productivity, it is used as a housing material for electronic devices. However, since resin is insulating, electromagnetic waves can pass through it, and therefore electromagnetic interference is likely to occur.
このような電磁波障害を軽減するために、樹脂材料に導
電性を付与する試みがなされている。In order to reduce such electromagnetic interference, attempts have been made to impart electrical conductivity to resin materials.
例えば、樹脂材料の一部に金属を用いて電磁波を吸収ま
たは反射させ、そのことにより電磁波を遮蔽する方法が
ある。また、樹脂材料の表面に金属を溶射、蒸着、塗装
あるいはメツキを施して電磁波を遮蔽することも行われ
ている。しがし、これらの方法は、得られた材料の比重
が大きい、加工性が困難である。衝撃などにより金属が
剥離するなどの欠点がある。For example, there is a method of absorbing or reflecting electromagnetic waves by using metal as a part of the resin material, thereby shielding the electromagnetic waves. Furthermore, electromagnetic waves are shielded by spraying, vapor depositing, painting, or plating metal on the surface of a resin material. However, with these methods, the material obtained has a high specific gravity and is difficult to process. There are drawbacks such as the metal peeling off due to impact etc.
このような欠点を解決するために、樹脂材料に導電性樹
脂組成物を用いることが提案されている。In order to solve these drawbacks, it has been proposed to use a conductive resin composition as the resin material.
導電性樹脂組成物には、樹脂に、カーボンブラック、炭
素繊維、金属粉、金属フレーク、金属繊維などの導電性
添加剤を配合した組成物がある（「複合導電プラスチッ
クの最近の動向」、プラスチックス、 Ｖｏｌ ３５．
阻９ （１９８４） ；ｒ金属複合導電プラスチック
の開発動向Ｊ、プラスチックエージ、９月号（１９８５
） ） 、特公昭５Ｂ−１４４５７号公報には、熱可塑
性樹脂に、鉄、ニッケル、鉄合金などの金属繊維および
金属粉末を充填した導電性樹脂組成物が開示されている
。しかし、これらの導電性添加剤を少量配合しただけで
は、電磁波遮蔽効果が充分でない。多量に配合すれば、
流動性が悪くなるため成形性が低下する。軽量や耐食性
など樹脂の特性も生かされない。Some conductive resin compositions include resins containing conductive additives such as carbon black, carbon fiber, metal powder, metal flakes, and metal fibers ("Recent Trends in Composite Conductive Plastics", Plastic Su, Vol 35.
9 (1984); Development trends of metal composite conductive plastics J, Plastic Age, September issue (1985
) ), Japanese Patent Publication No. 5B-14457 discloses a conductive resin composition in which a thermoplastic resin is filled with metal fibers and metal powders such as iron, nickel, and iron alloys. However, just adding a small amount of these conductive additives does not provide a sufficient electromagnetic wave shielding effect. If you mix a large amount,
Molding properties deteriorate due to poor fluidity. The properties of resin, such as light weight and corrosion resistance, are not utilized.
これらのことから、導電性添加剤に前処理を施して導電
性を向上させ、それにより、少量の配合でも電磁波遮蔽
効果に優れた導電性樹脂組成物が提案されている。この
樹脂組成物には２例えば。For these reasons, a conductive resin composition has been proposed in which conductive additives are pretreated to improve conductivity, thereby providing an excellent electromagnetic wave shielding effect even when incorporated in a small amount. This resin composition has two examples.
シランカフプリング剤やチタンカップリング剤で被覆さ
れたアルミフレークを含有する組成物（特開昭５９−１
０２９３８号公報に開示）、アクリル酸重合体、メタク
リル酸重合体、アルキルアクリレート重合体などで表面
を被覆した金属箔片を含有する組成物（特開昭５９−１
４５２２６号公報に開示）がある。Composition containing aluminum flakes coated with silane cuff pulling agent and titanium coupling agent (JP-A-59-1
02938), a composition containing a metal foil piece whose surface is coated with an acrylic acid polymer, a methacrylic acid polymer, an alkyl acrylate polymer, etc. (disclosed in JP-A-59-1)
45226).
しかし、これら導電性添加剤の前処理には、カップリン
グ剤や重合体を金属表面に被覆するなどの前処理工程が
必要であり、そのため、工程が複雑となり、得られた導
電性樹脂組成物は高価となる。However, pretreatment of these conductive additives requires a pretreatment process such as coating the metal surface with a coupling agent or polymer, which makes the process complicated and the resulting conductive resin composition is expensive.
（発明が解決しようとする問題点）
本発明は上記従来の問題点を解決するものであり、その
目的とするところは、優れた電磁波遮蔽性を有する電磁
波遮蔽用導電性樹脂組成物を提供することにある０本発
明の他の目的は、簡単な操作により電磁波の遮蔽が効果
的になされ得る電磁波遮蔽用導電性樹脂組成物を提供す
ることにある。(Problems to be Solved by the Invention) The present invention solves the above-mentioned conventional problems, and its purpose is to provide a conductive resin composition for shielding electromagnetic waves having excellent electromagnetic shielding properties. In particular, another object of the present invention is to provide a conductive resin composition for shielding electromagnetic waves that can effectively shield electromagnetic waves through simple operations.
（問題点を解決するための手段）
本発明は、スチレン系樹脂と黄銅繊維とを含有する導電
性樹脂組成物において、さらにベンゾイルステアロイル
メタンを添加することにより、これが黄銅繊維と錯体を
形成するため、従来のような前処理工程を経ることなく
、単に添加するだけで導電性が向上し、従って電磁波遮
蔽性に優れた導電性樹脂組成物が得られる。との発明者
の知見にもとづいて完成された。(Means for Solving the Problems) The present invention provides a conductive resin composition containing a styrene resin and brass fibers, in which benzoylstearoylmethane is further added to form a complex with the brass fibers. , the conductivity can be improved simply by adding it without going through a conventional pretreatment process, and therefore a conductive resin composition with excellent electromagnetic wave shielding properties can be obtained. It was completed based on the inventor's knowledge.
本発明の電磁波遮蔽用導電性樹脂組成物は、スチレン系
樹脂、ベンゾイルステアロイルメタンおよび黄銅繊維を
含有し、そのことにより上記目的が達成される。The electromagnetic wave shielding conductive resin composition of the present invention contains a styrene resin, benzoylstearoylmethane, and brass fibers, thereby achieving the above object.
ベンゾイルステアロイルメタンはβ−ジケトン類の一種
であり、ケト−エノール互変異性によりエノール体とな
り得る。このエノール体は金属イオンとキレート錯体を
形成する。黄銅繊維の表面には酸化などにより銅イオン
や亜鉛イオンが存在し、これら金属イオンがこのキレー
ト錯体の形成に関与する。キレート錯体の形成あるいは
物理的吸着により、黄銅繊維の表面にはステアロイル基
が存在する。このステアロイル基の滑剤的作用により、
黄銅繊維の混練時の繊維折れが減少する。Benzoylstearoylmethane is a type of β-diketone and can become an enol form due to keto-enol tautomerism. This enol forms a chelate complex with metal ions. Copper ions and zinc ions are present on the surface of brass fibers due to oxidation, etc., and these metal ions are involved in the formation of this chelate complex. Stearoyl groups are present on the surface of brass fibers due to the formation of chelate complexes or physical adsorption. Due to the lubricant action of this stearoyl group,
Fiber breakage during kneading of brass fibers is reduced.
ステアロイル基は親油性であり、黄銅繊維の樹脂中での
分散性も向上する。従って、得られた導電性樹脂組成物
の導電性が良好となるため、電磁波遮蔽性が向上する。The stearoyl group is lipophilic and also improves the dispersibility of brass fibers in resin. Therefore, the conductivity of the obtained conductive resin composition is improved, and the electromagnetic wave shielding property is improved.
しかも、ベンゾイルステアロイルメタンは単に添加する
だけでよく、従来のような複雑な前処理工程は要しない
。Moreover, benzoylstearoylmethane can be simply added, and no complicated pretreatment process is required as in conventional methods.
スチレン系樹脂には１例えば、アクリロニトリル−ブタ
ジェン−スチレン樹脂（へ〇Ｓ樹脂）がある。Examples of styrenic resins include acrylonitrile-butadiene-styrene resin (He○S resin).
ベンゾイルステアロイルメタンは、スチレン系樹脂１０
０重量部に対し、０．５〜２０重量部、好ましくは５〜
２０重量部の範囲で含有される。０．５重１部を下まわ
ると、電磁波遮蔽性が向上しない。２０重量部を上まわ
ると、スチレン系樹脂の物性が低下する。Benzoylstearoylmethane is a styrenic resin with 10%
0.5 to 20 parts by weight, preferably 5 to 20 parts by weight
It is contained in a range of 20 parts by weight. If the weight is less than 0.5 parts and 1 part, the electromagnetic wave shielding property will not improve. If it exceeds 20 parts by weight, the physical properties of the styrene resin will deteriorate.
黄銅繊維は、導電性樹脂組成物中において、３０〜７０
重量％、好ましくは４０〜６５重量％の範囲で含有され
る。３０重量％を下まわると、所望の導電性が得られな
い。７０重量％を上まわると、導電性樹脂組成物の流動
性が悪くなり成形性が低下する。The brass fiber has a content of 30 to 70% in the conductive resin composition.
The content is preferably in the range of 40 to 65% by weight. If it is less than 30% by weight, desired conductivity cannot be obtained. When it exceeds 70% by weight, the fluidity of the conductive resin composition deteriorates and moldability decreases.
軽量や耐食性などの樹脂の特性も生かされない。The properties of resin, such as light weight and corrosion resistance, are not taken advantage of.
スチレン系樹脂およびベンゾイルステアロイルメタンは
、導電性樹脂組成物中において、３０〜７０重量％、好
ましくは３５〜６０重景％の重量で含有される。３０重
量％を下まわると、スチレン系樹脂としての優れた物性
が得られない。７０重量％を上まわると、所望の導電性
が得られない。The styrene resin and benzoylstearoylmethane are contained in the conductive resin composition in an amount of 30 to 70% by weight, preferably 35 to 60% by weight. If it is less than 30% by weight, excellent physical properties as a styrenic resin cannot be obtained. If it exceeds 70% by weight, desired conductivity cannot be obtained.
ベンゾイルステアロイルメタンの添加方法には。How to add benzoylstearoylmethane.
例えば、樹脂の混練時に添加する方法；あらかじめ黄銅
繊維とトライブレンドする方法；溶剤に溶解させ、この
溶液に黄銅繊維を浸漬させる方法がある。For example, there are methods of adding it when kneading the resin; methods of tri-blending it with brass fibers in advance; and methods of dissolving it in a solvent and immersing the brass fibers in this solution.
未発明の導電性樹脂組成物には、滑剤、高流動化剤、抗
酸化剤２着色剤などの添加剤が含有されてもよい。The uninvented conductive resin composition may contain additives such as a lubricant, a superplasticizer, an antioxidant, a colorant, and the like.
（実施例） 以下に本発明を実施例について述べる。(Example) The present invention will be described below with reference to examples.
実土斑上
アクリロニトリル−ブタジェン−スチレン樹脂（ＡＢＳ
樹脂、デンカＯＦ、電気化学工業社製） １００重量
部に対し、ベンゾイルステアロイルメタン（カレンズＤ
Ｋ−１．昭和電工社製）５重量部および低分子量ポリエ
チレンワックスｌ剤、 ハイワックス４２０２Ｂ、三井
石油化学社製）０．５重量部を配合した。この配合物（
マトリックス樹脂） ４０重量％に黄銅繊維（メタルフ
ァイバー、 ３０μａｔ Ｘ １．５龍長。Acrylonitrile-butadiene-styrene resin (ABS)
Resin, Denka OF, manufactured by Denki Kagaku Kogyo Co., Ltd.) to 100 parts by weight, benzoylstearoylmethane
K-1. 5 parts by weight (manufactured by Showa Denko K.K.) and 0.5 parts by weight of a low molecular weight polyethylene wax agent Hiwax 4202B (manufactured by Mitsui Petrochemicals) were blended. This formulation (
Matrix resin) 40% by weight and brass fiber (metal fiber, 30 μat x 1.5 dragon length).
神戸鋳鉄社製）６０重量％を加え、２軸混練押出機にて
混練・ペレット化した。このペレット化された導電性樹
脂組成物を射出成形して、３ｍ厚のプレートとした。プ
レートの磁界波３０ＭＨｚに対する透過損失（ｄＢ）を
、関西電子工業会生駒電波測定所にて測定した。この透
過損失により、プレートの電磁波遮蔽性を評価した。こ
れらの結果を下表に示す。60% by weight (manufactured by Kobe Cast Iron Co., Ltd.) was added thereto, and the mixture was kneaded and pelletized using a twin-screw kneading extruder. This pelletized conductive resin composition was injection molded to form a plate with a thickness of 3 m. The transmission loss (dB) of the plate against a magnetic field wave of 30 MHz was measured at the Kansai Electronics Industry Association Ikoma Radio Measurement Station. The electromagnetic wave shielding properties of the plate were evaluated based on this transmission loss. These results are shown in the table below.
ス崖勇１
ベンゾイルステアロイルメタンを１５重量部としたこと
以外は、実施例１と同様にして導電性樹脂組成物のプレ
ートを得た。このプレートの電磁波遮蔽性を実施例１と
同様の方法により評価した。Sugaiyu 1 A plate of a conductive resin composition was obtained in the same manner as in Example 1, except that 15 parts by weight of benzoylstearoylmethane was used. The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1.
これらの結果を下表に示す。These results are shown in the table below.
１隻拠ユ
高流動化剤としてビスフェノールＡ（ビスフェノールＡ
２本州化学社製）を１０重量部添加したこと以外は、実
施例１と同様にして導電性樹脂組成物のプレートを得た
。このプレートの電磁波遮蔽性を実施例１と同様の方法
により評価した。これらの結果を下表に示す。One base uses bisphenol A (bisphenol A) as a highly fluidizing agent.
A plate of a conductive resin composition was obtained in the same manner as in Example 1, except for adding 10 parts by weight of 2 (manufactured by Honshu Kagaku Co., Ltd.). The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1. These results are shown in the table below.
ス星■エ
ベンゾイルステアロイルメタンを樹脂と配合する代わり
に、黄銅繊維とトライブレンドしたこと以外は、実施例
１と同様にして導電性樹脂組成物のプレートを得た。こ
のプレートの電磁波遮蔽性を実施例１と同様の方法によ
り評価した。これらの結果を下表に示す。A plate of a conductive resin composition was obtained in the same manner as in Example 1, except that evenbenzoylstearoylmethane was triblended with brass fibers instead of being blended with the resin. The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1. These results are shown in the table below.
２隻斑エ
ベンゾイルステアロイルメタンを樹脂と配合する代わり
に、ベンゾイルステアロイルメタンのトルエン溶液に黄
銅繊維を浸漬して処理したこと以外は、実施例１と同様
にして導電性樹脂組成物のプレートを得た。このプレー
トの電磁波遮蔽性を実施例１と同様の方法により評価し
た。これらの結果を下表に示す。A plate of a conductive resin composition was obtained in the same manner as in Example 1, except that the brass fibers were treated by immersing them in a toluene solution of benzoylstearoylmethane instead of blending the two-spotted evenbenzoylstearoylmethane with the resin. Ta. The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1. These results are shown in the table below.
１隻■エ
マトリックス樹脂４５重量％に黄銅繊維５５重世％を加
えたこと以外は、実施例１と同様にして導電性樹脂組成
物のプレートを得た。このプレートの電磁波遮蔽性を実
施例１と同様の方法により評価した。これらの結果を下
表に示す。1 Plate of a conductive resin composition was obtained in the same manner as in Example 1 except that 55% by weight of brass fibers was added to 45% by weight of Ematrix resin. The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1. These results are shown in the table below.
、比較ｍ
ベンゾイルステアロイルメタンを配合しなかったこと以
外は、実施例１と同様にして導電性樹脂組成物のプレー
トを得た。このプレートの電磁波遮蔽性を実施例１と同
様の方法により評価した。, Comparison m A plate of a conductive resin composition was obtained in the same manner as in Example 1 except that benzoylstearoylmethane was not blended. The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1.
これらの結果を下表に示す。These results are shown in the table below.
止較±１
ベンゾイルステアロイルメタンを配合しなかったこと以
外は、実施例３と同様にして４電性樹脂組成物のプレー
トを得た。このプレートの電磁波遮蔽性を実施例１と同
様の方法により評価した。Comparison ±1 A plate of a tetraelectric resin composition was obtained in the same manner as in Example 3, except that benzoylstearoylmethane was not blended. The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1.
これらの結果を下表に示す。These results are shown in the table below.
止較桝エ
ベンゾイルステアロイルメタンを配合せず、チタネート
系カップリング剤（プレンアクトＫＲ−９Ｓ。A titanate-based coupling agent (Plenact KR-9S) was used without blending evenbenzoylstearoylmethane.
味の素社製）のトルエン溶液に黄銅繊維を浸漬して処理
したこと以外は、実施例３と同様にして導電性樹脂組成
物のプレートを得た。このプレートの電磁波遮蔽性を実
施例１と同様の方法により評価した。これらの結果を下
表に示す。A plate of a conductive resin composition was obtained in the same manner as in Example 3, except that the brass fibers were treated by immersing them in a toluene solution (manufactured by Ajinomoto Co., Ltd.). The electromagnetic wave shielding properties of this plate were evaluated in the same manner as in Example 1. These results are shown in the table below.
実施例および比較例から明らかなように１本発明の導電
性樹脂組成物は、電磁波遮蔽性に優れている。特に、ベ
ンゾイルステアロイルメタンを１５重量部含有する組成
物は電磁波遮蔽性が良好であり、従来のチタンカップリ
ング剤で処理した組成物よりもさらに電磁波遮蔽性に優
れる。ベンゾイルステアロイルメタンを含有しない組成
物は、同じ割合の黄銅繊維を含む本発明の組成物に比べ
て。As is clear from the Examples and Comparative Examples, the conductive resin composition of the present invention has excellent electromagnetic wave shielding properties. In particular, a composition containing 15 parts by weight of benzoylstearoylmethane has good electromagnetic wave shielding properties, and is even more excellent in electromagnetic wave shielding properties than a composition treated with a conventional titanium coupling agent. Compositions containing no benzoylstearoylmethane compared to compositions of the invention containing the same proportion of brass fibers.
電磁波遮蔽性が不良である。Electromagnetic wave shielding properties are poor.
（以下余白）
（発明の効果）
本発明の電磁波遮蔽用導電性樹脂組成物は、このように
、導電性が良好であるため、電磁波遮蔽性に優れている
。導電性添加剤の添加量が少量であっても、優れた電磁
波遮蔽性を呈する。しかも。(The following is a blank space) (Effects of the Invention) The electroconductive resin composition for shielding electromagnetic waves of the present invention has good conductivity as described above, and thus has excellent electromagnetic wave shielding properties. Even if the amount of conductive additive added is small, it exhibits excellent electromagnetic shielding properties. Moreover.
従来のように前処理工程を要せず、簡単な操作により電
磁波遮蔽性の向上がなされ得る。その結果。The electromagnetic wave shielding property can be improved by a simple operation without requiring a pretreatment process unlike the conventional method. the result.
本発明の電磁波遮蔽用導電性樹脂組成物は、電子機器の
ハウジング材料などに有用である。The electromagnetic wave shielding conductive resin composition of the present invention is useful as a housing material for electronic devices.
以上that's all
Claims (1)
よび黄銅繊維を含有する電磁波遮蔽用導電性樹脂組成物
。 ２、前記スチレン系樹脂が、アクリロニトリル−ブタジ
エン−スチレン樹脂（ＡＢＳ樹脂）である特許請求の範
囲第１項に記載の電磁波遮蔽用導電性樹脂組成物。 ３、前記スチレン系樹脂１００重量部に対し、前記ベン
ゾイルステアロイルメタンが０．５〜２０重量部の範囲
で含有された特許請求の範囲第１項に記載の電磁波遮蔽
用導電性樹脂組成物。 ４、前記黄銅繊維が３０〜７０重量％の範囲で含有され
た特許請求の範囲第１項に記載の電磁波遮蔽用導電性樹
脂組成物。 ５、前記スチレン系樹脂および前記ベンゾイルステアロ
イルメタンが３０〜７０重量％の範囲で含有された特許
請求の範囲第１項に記載の電磁波遮蔽用導電性樹脂組成
物。[Claims] 1. A conductive resin composition for shielding electromagnetic waves containing a styrene resin, benzoylstearoylmethane, and brass fibers. 2. The conductive resin composition for shielding electromagnetic waves according to claim 1, wherein the styrene resin is an acrylonitrile-butadiene-styrene resin (ABS resin). 3. The conductive resin composition for shielding electromagnetic waves according to claim 1, wherein the benzoylstearoylmethane is contained in an amount of 0.5 to 20 parts by weight based on 100 parts by weight of the styrene resin. 4. The conductive resin composition for shielding electromagnetic waves according to claim 1, wherein the brass fiber is contained in a range of 30 to 70% by weight. 5. The conductive resin composition for shielding electromagnetic waves according to claim 1, wherein the styrene resin and the benzoylstearoylmethane are contained in an amount of 30 to 70% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18463686A JPS6339970A (en) | 1986-08-05 | 1986-08-05 | Electrically conductive resin composition for electromagnetic wave shielding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18463686A JPS6339970A (en) | 1986-08-05 | 1986-08-05 | Electrically conductive resin composition for electromagnetic wave shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6339970A true JPS6339970A (en) | 1988-02-20 |
Family
ID=16156700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18463686A Pending JPS6339970A (en) | 1986-08-05 | 1986-08-05 | Electrically conductive resin composition for electromagnetic wave shielding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6339970A (en) |
-
1986
- 1986-08-05 JP JP18463686A patent/JPS6339970A/en active Pending
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