JPH069819A - Resin composition for shielding electromagnetic wave - Google Patents
Resin composition for shielding electromagnetic waveInfo
- Publication number
- JPH069819A JPH069819A JP4164859A JP16485992A JPH069819A JP H069819 A JPH069819 A JP H069819A JP 4164859 A JP4164859 A JP 4164859A JP 16485992 A JP16485992 A JP 16485992A JP H069819 A JPH069819 A JP H069819A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- resin composition
- resin
- fiber
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 22
- 239000000835 fiber Substances 0.000 claims abstract description 30
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 16
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 13
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- 150000001336 alkenes Chemical class 0.000 claims description 13
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 13
- 229920000098 polyolefin Polymers 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 11
- 229920000642 polymer Polymers 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 239000001993 wax Substances 0.000 description 15
- 229920000049 Carbon (fiber) Polymers 0.000 description 11
- 239000004917 carbon fiber Substances 0.000 description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000000654 additive Substances 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229920005668 polycarbonate resin Polymers 0.000 description 4
- 239000004431 polycarbonate resin Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電磁波遮蔽用に好適な樹
脂組成物に関する。更に詳しくは、少添加量の導電性繊
維で優れた電磁波遮蔽効果を有し且つ機械的特性、特に
耐衝撃性の優れた電磁波遮蔽用樹脂組成物に関する。FIELD OF THE INVENTION The present invention relates to a resin composition suitable for electromagnetic wave shielding. More specifically, the present invention relates to a resin composition for electromagnetic wave shielding, which has an excellent electromagnetic wave shielding effect with a small amount of conductive fiber and has excellent mechanical properties, particularly impact resistance.
【０００２】[0002]
【従来の技術】熱可塑性樹脂を導電化する方法として
は、導電塗料、電磁波遮蔽メッキ、亜鉛溶射等の表面処
理による方法、熱可塑性樹脂中に金属粉、カーボンブラ
ック、金属フレーク、金属コートガラスフレ−ク、金属
繊維、炭素繊維、金属コート炭素繊維等の導電性充填材
を添加して成形する方法等がある。2. Description of the Related Art As a method for making a thermoplastic resin conductive, conductive paint, electromagnetic wave shielding plating, surface treatment such as zinc spraying, metal powder, carbon black, metal flakes, metal coated glass flakes in the thermoplastic resin are used. There is a method of adding and molding a conductive filler such as copper, metal fiber, carbon fiber, and metal-coated carbon fiber.
【０００３】しかしながら導電塗料、電磁波遮蔽メッ
キ、亜鉛溶射等による表面処理による方法は、成形され
た筐体成形品表面に導電処理する加工工程を必要とし、
更に導電層が剥離し易い等の欠点を有している。また、
導電性充填材を添加した樹脂組成物から成形する方法は
特殊な後加工を必要とせず、導電層が剥離する心配がな
いことから有利であるが、それでもなお種々の問題があ
る。例えばカーボンブラック、金属粉、金属フレーク等
の粒子状導電性充填材を添加した樹脂組成物は導電性が
不充分であり、しかも添加量が多量になるため機械的特
性が著しく低下する欠点を有している。また銅繊維、ス
テンレス繊維、炭素繊維、金属コート炭素繊維等の繊維
状導電性充填材を添加した樹脂組成物は機械的及び熱的
特性が向上し、導電性が良好で電磁波遮蔽用樹脂組成物
として有用であるが、溶融混練時に繊維が切断し易く、
必要量以上に添加量を多くしなければならず、比重の増
大や加工性の悪化とともにコスト高になるという欠点が
ある。このため少添加量の導電性繊維で優れた電磁波遮
蔽効果を有し且つ機械的特性の良好な電磁波遮蔽用樹脂
組成物の出現が要望されている。However, the method of surface treatment with conductive paint, electromagnetic wave shielding plating, zinc spraying, etc., requires a processing step of conducting the conductive treatment on the surface of the molded casing molded article,
Further, it has a defect that the conductive layer is easily peeled off. Also,
The method of molding from a resin composition to which a conductive filler is added is advantageous because it does not require special post-processing and there is no fear of peeling the conductive layer, but there are still various problems. For example, a resin composition to which a particulate conductive filler such as carbon black, metal powder, or metal flakes is added has insufficient conductivity and has a drawback that mechanical properties are significantly deteriorated due to a large amount of addition. is doing. Further, a resin composition containing a fibrous conductive filler such as copper fiber, stainless fiber, carbon fiber or metal-coated carbon fiber has improved mechanical and thermal characteristics, good conductivity, and electromagnetic wave shielding resin composition. It is useful as, but the fibers are easily cut during melt kneading,
It is necessary to increase the addition amount more than necessary amount, and there is a drawback that the specific gravity is increased, the workability is deteriorated, and the cost is increased. Therefore, there is a demand for the appearance of a resin composition for electromagnetic wave shielding which has an excellent electromagnetic wave shielding effect with a small amount of conductive fibers and has good mechanical properties.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、優れた電磁
波遮蔽効果を有し且つ機械的特性特に耐衝撃性の良好な
電磁波遮蔽用樹脂組成物を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide an electromagnetic wave shielding resin composition having an excellent electromagnetic wave shielding effect and good mechanical properties, especially impact resistance.
【０００５】本発明者は、上記目的を達成すべく鋭意検
討を重ねた結果、導電性繊維を含有する熱可塑性樹脂組
成物に、カルボン酸無水物グループ及び／又はカルボキ
シルグループを有するオレフィン系ワックスやオレフィ
ン系重合体を少量添加すると、上記目的に適う電磁波遮
蔽用樹脂組成物が得られることを見出し、本発明に到達
した。As a result of intensive studies to achieve the above object, the present inventor has found that a thermoplastic resin composition containing a conductive fiber has an olefinic wax containing a carboxylic acid anhydride group and / or a carboxyl group. The inventors have found that the addition of a small amount of an olefin-based polymer makes it possible to obtain a resin composition for electromagnetic wave shielding that meets the above-mentioned object, and arrived at the present invention.
【０００６】[0006]
【課題を解決するための手段】本発明は、導電性繊維を
含有する熱可塑性樹脂組成物１００重量部に、カルボン
酸無水物グループ及び／又はカルボキシルグループを有
するオレフィン系ワックス及びオレフィン系重合体より
選ばれる少くとも一種の化合物を０．０５〜３０重量部
配合してなる電磁波遮蔽用樹脂組成物に係るものであ
る。The present invention comprises an olefin wax and an olefin polymer having a carboxylic acid anhydride group and / or a carboxyl group in 100 parts by weight of a thermoplastic resin composition containing a conductive fiber. The present invention relates to an electromagnetic wave shielding resin composition containing 0.05 to 30 parts by weight of at least one selected compound.
【０００７】本発明で使用する熱可塑性樹脂は、基本的
に限定されるものではなく、特に電子機器の筐体に用い
られる熱可塑性樹脂が好ましく使用される。かかる熱可
塑性樹脂としては、例えばポリプロピレン樹脂、スチレ
ン系樹脂、変性ポリフェニレンオキサイド樹脂、ポリア
ミド樹脂、ポリカーボネート樹脂、ポリフェニレンスル
フィド樹脂、ポリエステル系樹脂等があげられる。特に
好ましものとしては例えば ABS樹脂、ポリカーボネート
樹脂、ポリエチレンテレフタレート樹脂、ポリブチレン
テレフタレート樹脂及びこれらの二種以上の混合物があ
げられる。The thermoplastic resin used in the present invention is not basically limited, and a thermoplastic resin used in the case of electronic equipment is preferably used. Examples of the thermoplastic resin include polypropylene resin, styrene resin, modified polyphenylene oxide resin, polyamide resin, polycarbonate resin, polyphenylene sulfide resin, polyester resin and the like. Particularly preferred are, for example, ABS resin, polycarbonate resin, polyethylene terephthalate resin, polybutylene terephthalate resin and mixtures of two or more thereof.
【０００８】本発明で使用する導電性繊維は、特に制限
する必要はなく、例えばステンレス繊維、アルミニウム
繊維、銅繊維、黄銅繊維等の金属繊維、炭素繊維、金属
コートガラス繊維、金属コート炭素繊維等があげられ、
これらは二種以上併用することもできる。なかでも特に
電磁波遮蔽効果の優れた導電性樹脂組成物が得られるも
のとしてステンレス繊維、銅繊維、金属コート炭素繊維
があげられる。金属繊維の直径は、６〜８０μm のもの
が好ましく、６〜６０μm のものが特に好ましい。炭素
繊維、金属コートガラス繊維、金属コート炭素繊維の直
径は、６〜２０μm のものが特に好ましい。かかる導電
性繊維はシランカップリング剤、チタネートカップリン
グ剤、アルミネートカップリング剤等で表面処理したも
のが好ましい。またオレフィン系樹脂、スチレン系樹
脂、ポリエステル系樹脂、エポキシ系樹脂、ウレタン系
樹脂等で集束処理したものが好ましく、特にエポキシ系
樹脂やウレタン系樹脂で集束処理したものが好ましい。
導電性繊維の添加量は、あまりに少いと電磁波遮蔽用樹
脂組成物として導電性が不充分になり、あまりに多くす
ると成形が困難になるので、熱可塑性樹脂と導電性繊維
の合計１００容量％に対し、通常０．５〜３０容量％、
好ましくは１〜２５容量％である。The conductive fiber used in the present invention is not particularly limited, for example, metal fiber such as stainless fiber, aluminum fiber, copper fiber, brass fiber, carbon fiber, metal-coated glass fiber, metal-coated carbon fiber, etc. Is given
Two or more of these may be used in combination. Among them, stainless fiber, copper fiber, and metal-coated carbon fiber are particularly preferable as the conductive resin composition having an excellent electromagnetic wave shielding effect. The metal fiber preferably has a diameter of 6 to 80 μm, more preferably 6 to 60 μm. The diameter of carbon fiber, metal-coated glass fiber, and metal-coated carbon fiber is particularly preferably 6 to 20 μm. Such conductive fibers are preferably surface-treated with a silane coupling agent, a titanate coupling agent, an aluminate coupling agent, or the like. Further, those treated with olefin resin, styrene resin, polyester resin, epoxy resin, urethane resin or the like are preferable, and those treated with epoxy resin or urethane resin are particularly preferable.
If the amount of the conductive fiber added is too small, the conductivity of the electromagnetic wave shielding resin composition will be insufficient, and if it is too large, molding will be difficult. , Usually 0.5 to 30% by volume,
It is preferably 1 to 25% by volume.
【０００９】本発明で使用するカルボン酸無水物グルー
プ及び／又はカルボキシルグループを有する（以下単に
カルボキシルグループを有すると略称する）オレフィン
系ワックスやオレフィン系重合体は、オレフィン系ワッ
クス又はオレフィン系重合体を酸処理して得られるワッ
クス又は重合体である。カルボキシルグループを有する
オレフィン系ワックスの好ましい例としては下記式The olefin wax or olefin polymer having a carboxylic acid anhydride group and / or a carboxyl group (hereinafter simply referred to as having a carboxyl group) used in the present invention is an olefin wax or an olefin polymer. It is a wax or polymer obtained by acid treatment. Preferred examples of the olefin wax having a carboxyl group include the following formulas.
【００１０】[0010]
【化１】 [Chemical 1]
【００１１】[0011]
【化２】 [Chemical 2]
【００１２】［式中、ｎは１２〜２０の整数である。］
のものがあげられる。カルボキシルグループを有するオ
レフィン系ワックスやオレフィン系重合体は二種以上併
用してもよく、その添加量は樹脂組成物１００重量部に
対して０．０５〜３０重量部である。この添加量が０．
０５重量部より少ないと電磁波遮蔽効果及び耐衝撃性の
向上効果が小さく、また３０重量部より多く添加しても
電磁波遮蔽効果及び衝撃値はそれ以上向上せず逆に押出
性の低下を起こすようになるので適当でない。[In the formula, n is an integer of 12 to 20. ]
I can give you one. Two or more kinds of olefin waxes and olefin polymers having a carboxyl group may be used in combination, and the addition amount thereof is 0.05 to 30 parts by weight with respect to 100 parts by weight of the resin composition. This addition amount is 0.
If it is less than 05 parts by weight, the electromagnetic wave shielding effect and the impact resistance improving effect are small, and even if it is added in an amount of more than 30 parts by weight, the electromagnetic wave shielding effect and the impact value are not further improved, and conversely the extrudability is lowered. Is not appropriate.
【００１３】本発明の樹脂組成物を製造するには、任意
の方法や装置が使用できる。例えば熱可塑性樹脂、導電
性繊維およびカルボキシルグループを有するオレフィン
系ワックスやオレフィン系重合体の混合物を単軸又は二
軸の押出機、バンバリーミキサー、加熱ロール等で混合
しペレット化する方法、射出成形等で直接成形する方
法、また先ず何れか二種を混合した後、残りの一種を混
合する方法、例えば先ず導電性繊維と熱可塑性樹脂を混
合した後カルボキシルグループを有するオレフィン系ワ
ックスやオレフィン系重合体を混合して使用する方法、
熱可塑性樹脂とカルボキシルグループを有するオレフィ
ン系ワックスやオレフィン系重合体からなるペレットに
導電性繊維を添加する方法、導電性繊維を高濃度に集束
処理したマスターを添加する所謂マスターバッチ方式等
があげられる。Any method and apparatus can be used for producing the resin composition of the present invention. For example, a method of mixing and pelletizing a mixture of an olefin wax or an olefin polymer having a thermoplastic resin, a conductive fiber and a carboxyl group with a single-screw or twin-screw extruder, a Banbury mixer, a heating roll, injection molding, etc. Or a method of first mixing any two of them and then mixing the remaining one, for example, an electrically conductive fiber and a thermoplastic resin are mixed, and then an olefin wax or an olefin polymer having a carboxyl group. How to mix and use,
Examples include a method of adding conductive fibers to a pellet made of an olefin wax or an olefin polymer having a thermoplastic resin and a carboxyl group, a so-called masterbatch method of adding a master in which conductive fibers are concentrated to a high concentration. .
【００１４】本発明の樹脂組成物には任意の添加剤、例
えば難燃剤、難燃助剤、熱安定剤、酸化防止剤、光安定
剤、離型剤、流動改質剤、着色剤、滑剤、発泡剤等を必
要に応じてその発現量添加してもさしつかえない。更に
他の導電性充填材、例えばカーボンブラック、金属粉、
金属フレーク等及び強化材や充填材、例えばガラス繊
維、ガラスフレーク、ウイスカー、アラミド繊維、タル
ク、マイカ、ワラストナイト、クレー、シリカ、ガラス
粉、炭酸カルシウム等を併用することもできる。また他
の熱可塑性樹脂や弾性体等を添加してもよい。The resin composition of the present invention contains optional additives such as flame retardants, flame retardant aids, heat stabilizers, antioxidants, light stabilizers, release agents, flow modifiers, colorants and lubricants. A foaming agent or the like may be added in an expression amount as needed. Still other conductive fillers such as carbon black, metal powder,
Metal flakes and the like and reinforcing materials and fillers such as glass fibers, glass flakes, whiskers, aramid fibers, talc, mica, wollastonite, clay, silica, glass powder, calcium carbonate and the like can be used together. Further, other thermoplastic resins, elastic bodies, etc. may be added.
【００１５】[0015]
【実施例】以下に実施例をあげて本発明を更に説明す
る。なお評価は下記の方法により行った。衝撃強さ：AS
TM D−２５６（アイゾットノッチ付き、厚み３．２mm）
により測定した。EXAMPLES The present invention will be further described with reference to the following examples. The evaluation was performed by the following method. Impact strength: AS
TM D-256 (with Izod notch, thickness 3.2mm)
It was measured by.
【００１６】電磁波遮蔽効果：一辺１５０mm、厚み３mm
の試験片を使用し、（株）アドバンテスト製の TR-１７
３０１ AとR ３３６１ Aを併用して磁界波（周波数３０
０MHz)について測定した。Electromagnetic wave shielding effect: side 150 mm, thickness 3 mm
TR-17 made by Advantest Co., Ltd.
A magnetic field wave (frequency 30
0 MHz).
【００１７】[0017]
【実施例１〜７及び比較例１〜８】表１に示すポリカー
ボネート樹脂、導電性繊維及び添加剤を表１に示す割合
でドライブレンドした後、スクリュー径３０mmのベント
付一軸押出機［ナカタニ機械（株）製：VSK-３０］によ
り、シリンダー温度３００℃で溶融混練し、ストランド
カットによりペレットを得、得られたペレットを１２０
℃で５時間熱風循環式乾燥機により乾燥した後、射出成
形機［住友重機械（株）製：ネスタールSYCAP ４８０／
１５０］によりシリンダー温度３１０℃、金型温度１０
０℃で衝撃試験片及び電磁波遮蔽試験片を得た。評価結
果を表１に示した。Examples 1 to 7 and Comparative Examples 1 to 8 Polycarbonate resins shown in Table 1, conductive fibers and additives were dry blended in the proportions shown in Table 1, and then a uniaxial extruder with a vent having a screw diameter of 30 mm [NAKATANI Machine Manufactured by VSK-30], and melt-kneaded at a cylinder temperature of 300 ° C. to obtain pellets by strand cutting.
After drying at ℃ for 5 hours with a hot air circulation dryer, injection molding machine [Sumitomo Heavy Industries, Ltd .: Nestal SYCAP 480 /
150], the cylinder temperature is 310 ° C., the mold temperature is 10
An impact test piece and an electromagnetic wave shielding test piece were obtained at 0 ° C. The evaluation results are shown in Table 1.
【００１８】[0018]
【実施例８、９及び比較例９、１０】表１に示す ABS樹
脂又はポリブチレンテレフタレート樹脂、導電性繊維及
び添加剤を表１に示す割合でドライブレンドした後、押
出温度２４０℃、成形温度２４０℃で評価用試験片を得
た。評価結果を表１に示した。Examples 8 and 9 and Comparative Examples 9 and 10 ABS resin or polybutylene terephthalate resin shown in Table 1, conductive fibers and additives were dry-blended at the ratio shown in Table 1, and then extruded at 240 ° C and molded at the molding temperature. A test piece for evaluation was obtained at 240 ° C. The evaluation results are shown in Table 1.
【００１９】表１における樹脂、導電性繊維及び添加剤
の記号は下記のものを示す。また、添加剤の添加量を示
す重量部は樹脂と導電性繊維の合計１００重量部に対す
る割合を示す。The symbols for resins, conductive fibers and additives in Table 1 are shown below. Further, the parts by weight showing the amount of addition of the additive shows the ratio to the total 100 parts by weight of the resin and the conductive fiber.
【００２０】PC ：ポリカーボネート樹脂［帝人化成
（株）製パンライト L−１２２５］ ABS ： ABS樹脂［三井東圧化学（株）製サンタック UT-
６１］ PBT ：ポリブチレンテレフタレート樹脂［帝人（株）製
TRB-K］ NiCF：ニッケルコート炭素繊維［東邦レーヨン（株）製
ベスファイト MC HTA-C ６-US(Ｉ) 、直径７．５μm 、
長さ６mm］ SUS ：ステンレス繊維［日本精線（株）製ナスロン SUS
３０４、直径８μm 、長さ６mm］ CF ：炭素繊維［東邦レーヨン（株）製ベスファイト H
TA-C６-U、直径７μm、長さ６mm］ Ａ：カルボキシルグループを有するオレフィン系ワック
ス［三菱化成（株）製ダイヤカルナ−３０、酸価７５ m
g KOH ／ g］ Ｂ：カルボキシルグループを有するオレフィン系ワック
ス［三井石油化学（株）製ハイワックス酸化タイプ２２
０３ A、酸価３０ mg KOH ／ g］ Ｃ：カルボキシルグループを有するオレフィン系重合体
［エクソン化学（株）製エグゼロ VA-１８０３ A、無水
マレイン酸量０．６５重量％］ Ｄ：無水マレイン酸［和光純薬工業（株）製；特級］ Ｅ：カルボキシルグループを有しないオレフィン系ワッ
クス［三井石油化学（株）製ハイワックス２００ P］ Ｆ：カルボキシルグループを有しないオレフィン系重合
体［三井石油化学（株）製ハイゼックスパウダー２１０
０ JP ］PC: Polycarbonate resin [Panlite L-1225 manufactured by Teijin Kasei Co., Ltd.] ABS: ABS resin [Santac UT- manufactured by Mitsui Toatsu Chemicals, Inc.]
61] PBT: polybutylene terephthalate resin [manufactured by Teijin Ltd.
TRB-K] NiCF: Nickel-coated carbon fiber [Besfight MC HTA-C 6-US (I) manufactured by Toho Rayon Co., Ltd., diameter 7.5 μm,
Length 6mm] SUS: Stainless fiber [Naslon SUS manufactured by Nippon Seisen Co., Ltd.]
304, diameter 8 μm, length 6 mm] CF: carbon fiber [Besfight H manufactured by Toho Rayon Co., Ltd.]
TA-C6-U, diameter 7 μm, length 6 mm] A: Olefin wax having a carboxyl group [Mitsubishi Kasei Co., Ltd. Diakarna-30, acid value 75 m]
g KOH / g] B: Olefin wax having carboxyl group [High wax oxidation type 22 manufactured by Mitsui Petrochemical Co., Ltd.]
03 A, acid value 30 mg KOH / g] C: olefin polymer having carboxyl group [Egzero VA-1803 A manufactured by Exxon Chemical Co., maleic anhydride amount 0.65% by weight] D: maleic anhydride [ Wako Pure Chemical Industries, Ltd .; Special grade] E: Olefin wax without carboxyl group [High Wax 200 P from Mitsui Petrochemical Co., Ltd.] F: Olefin polymer without carboxyl group [Mitsui Petrochemical ( Hi-Zex Powder 210 Co., Ltd.
0 JP]
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【発明の効果】本発明の組成物は、優れた電磁波遮蔽効
果を有し且つ機械的特性，特に耐衝撃性に優れており、
電子機器の筐体を始め電磁波遮蔽を必要とする幅広い産
業分野で好適であり、その奏する工業的効果は格別のも
のである。The composition of the present invention has an excellent electromagnetic wave shielding effect and excellent mechanical properties, especially impact resistance,
It is suitable for a wide range of industrial fields that require electromagnetic wave shielding, including housings of electronic devices, and the industrial effects produced by it are exceptional.
Claims (1)
物１００重量部に、カルボン酸無水物グループ及び／又
はカルボキシルグループを有するオレフィン系ワックス
及びオレフィン系重合体より選ばれる少くとも一種の化
合物を０．０５〜３０重量部配合してなる電磁波遮蔽用
樹脂組成物。1. 100 parts by weight of a thermoplastic resin composition containing a conductive fiber, and at least one compound selected from an olefin wax and an olefin polymer having a carboxylic acid anhydride group and / or a carboxyl group. A resin composition for electromagnetic wave shielding, which comprises 0.05 to 30 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4164859A JP2732986B2 (en) | 1992-06-23 | 1992-06-23 | Resin composition for shielding electromagnetic waves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4164859A JP2732986B2 (en) | 1992-06-23 | 1992-06-23 | Resin composition for shielding electromagnetic waves |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH069819A true JPH069819A (en) | 1994-01-18 |
| JP2732986B2 JP2732986B2 (en) | 1998-03-30 |
Family
ID=15801278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4164859A Expired - Lifetime JP2732986B2 (en) | 1992-06-23 | 1992-06-23 | Resin composition for shielding electromagnetic waves |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2732986B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001151962A (en) * | 1999-11-22 | 2001-06-05 | Daicel Chem Ind Ltd | Electromagnetic-wave-shielding resin composition |
| WO2003043028A3 (en) * | 2001-11-13 | 2003-12-18 | Dow Global Technologies Inc | Electrically conductive thermoplastic polymer composition |
| EP1409574A4 (en) * | 2001-06-08 | 2006-02-15 | Eikos Inc | Nanocomposite dielectrics |
| WO2007116973A1 (en) * | 2006-04-07 | 2007-10-18 | Nec Corporation | Thermally conductive resin material and molded body thereof |
| JP2015108108A (en) * | 2013-10-24 | 2015-06-11 | 三菱エンジニアリングプラスチックス株式会社 | Polybutylene terephthalate resin composition and molded article |
| US9957388B2 (en) | 2013-01-10 | 2018-05-01 | Mitsubishi Engineering-Plastics Corporation | Polybutylene terephthalate resin composition and molded article |
| CN110325595A (en) * | 2017-02-28 | 2019-10-11 | 三井化学株式会社 | Conductive resin composition, its manufacturing method and formed body therefrom |
| US10988613B2 (en) | 2015-12-10 | 2021-04-27 | Canon Kabushiki Kaisha | Resin composition, production process thereof and optical instrument |
| CN113402840A (en) * | 2021-07-02 | 2021-09-17 | 湖南国天电子科技有限公司 | Electromagnetic interference resistant shielding material for visibility meter and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195140A (en) * | 1985-02-26 | 1986-08-29 | Kishimoto Akira | Metallic fiber filled olefinic resin composition |
| JPH01203447A (en) * | 1988-02-09 | 1989-08-16 | Toray Ind Inc | Electromagnetic wave shielding resin composition |
-
1992
- 1992-06-23 JP JP4164859A patent/JP2732986B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195140A (en) * | 1985-02-26 | 1986-08-29 | Kishimoto Akira | Metallic fiber filled olefinic resin composition |
| JPH01203447A (en) * | 1988-02-09 | 1989-08-16 | Toray Ind Inc | Electromagnetic wave shielding resin composition |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001151962A (en) * | 1999-11-22 | 2001-06-05 | Daicel Chem Ind Ltd | Electromagnetic-wave-shielding resin composition |
| EP1409574A4 (en) * | 2001-06-08 | 2006-02-15 | Eikos Inc | Nanocomposite dielectrics |
| WO2003043028A3 (en) * | 2001-11-13 | 2003-12-18 | Dow Global Technologies Inc | Electrically conductive thermoplastic polymer composition |
| JP2005510009A (en) * | 2001-11-13 | 2005-04-14 | ダウ グローバル テクノロジーズ インコーポレーテッド | Conductive thermoplastic polymer composition |
| KR100858603B1 (en) * | 2001-11-13 | 2008-09-17 | 다우 글로벌 테크놀로지스 인크. | Electrically Conductive Thermoplastic Polymer Composition |
| WO2007116973A1 (en) * | 2006-04-07 | 2007-10-18 | Nec Corporation | Thermally conductive resin material and molded body thereof |
| EP2006334A4 (en) * | 2006-04-07 | 2010-09-22 | Nec Corp | Thermally conductive resin material and molded body thereof |
| JP5309989B2 (en) * | 2006-04-07 | 2013-10-09 | 日本電気株式会社 | Thermally conductive resin material and molded body thereof |
| US9957388B2 (en) | 2013-01-10 | 2018-05-01 | Mitsubishi Engineering-Plastics Corporation | Polybutylene terephthalate resin composition and molded article |
| JP2015108108A (en) * | 2013-10-24 | 2015-06-11 | 三菱エンジニアリングプラスチックス株式会社 | Polybutylene terephthalate resin composition and molded article |
| JP2017186576A (en) * | 2013-10-24 | 2017-10-12 | 三菱エンジニアリングプラスチックス株式会社 | Polybutylene terephthalate resin composition and molded article |
| US10988613B2 (en) | 2015-12-10 | 2021-04-27 | Canon Kabushiki Kaisha | Resin composition, production process thereof and optical instrument |
| CN110325595A (en) * | 2017-02-28 | 2019-10-11 | 三井化学株式会社 | Conductive resin composition, its manufacturing method and formed body therefrom |
| JPWO2018159483A1 (en) * | 2017-02-28 | 2019-11-07 | 三井化学株式会社 | Conductive resin composition, method for producing the same, and molded product obtained therefrom |
| US11396564B2 (en) | 2017-02-28 | 2022-07-26 | Mitsui Chemicals, Inc. | Electroconductive resin composition, method for manufacturing same and molded article obtained therefrom |
| CN113402840A (en) * | 2021-07-02 | 2021-09-17 | 湖南国天电子科技有限公司 | Electromagnetic interference resistant shielding material for visibility meter and preparation method thereof |
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|---|---|
| JP2732986B2 (en) | 1998-03-30 |
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