JPS58210920A - 熱硬化性エポキシ樹脂組成物 - Google Patents

熱硬化性エポキシ樹脂組成物

Info

Publication number
JPS58210920A
JPS58210920A JP57092414A JP9241482A JPS58210920A JP S58210920 A JPS58210920 A JP S58210920A JP 57092414 A JP57092414 A JP 57092414A JP 9241482 A JP9241482 A JP 9241482A JP S58210920 A JPS58210920 A JP S58210920A
Authority
JP
Japan
Prior art keywords
epoxy resin
component
organic
resin composition
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57092414A
Other languages
English (en)
Japanese (ja)
Other versions
JPS636084B2 (enrdf_load_stackoverflow
Inventor
Kunio Ito
邦雄 伊藤
Toru Takamura
融 高村
Toshio Shiobara
利夫 塩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP57092414A priority Critical patent/JPS58210920A/ja
Publication of JPS58210920A publication Critical patent/JPS58210920A/ja
Publication of JPS636084B2 publication Critical patent/JPS636084B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP57092414A 1982-05-31 1982-05-31 熱硬化性エポキシ樹脂組成物 Granted JPS58210920A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57092414A JPS58210920A (ja) 1982-05-31 1982-05-31 熱硬化性エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57092414A JPS58210920A (ja) 1982-05-31 1982-05-31 熱硬化性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58210920A true JPS58210920A (ja) 1983-12-08
JPS636084B2 JPS636084B2 (enrdf_load_stackoverflow) 1988-02-08

Family

ID=14053751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57092414A Granted JPS58210920A (ja) 1982-05-31 1982-05-31 熱硬化性エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58210920A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225120A (ja) * 1982-06-25 1983-12-27 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS61221220A (ja) * 1985-03-27 1986-10-01 Toshiba Corp 樹脂封止型半導体装置
JPS61285243A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd 電子部品用成形材料
JPS61285244A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd 電子部品用成形材料
JPS61285215A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd 電子部品用成形材料
JPS62141018A (ja) * 1985-12-16 1987-06-24 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
US5043211A (en) * 1987-03-31 1991-08-27 Kabushiki Kaisha Toshiba Epoxy resin composition and a resin-sealed semiconductor device
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
US6582824B1 (en) 1998-10-02 2003-06-24 3M Innovative Properties Company Sealant composition, article and method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899249A (enrdf_load_stackoverflow) * 1972-03-29 1973-12-15
JPS4997052A (enrdf_load_stackoverflow) * 1972-12-21 1974-09-13
JPS5030997A (enrdf_load_stackoverflow) * 1973-07-19 1975-03-27
JPS51109941A (ja) * 1975-03-25 1976-09-29 Matsushita Electric Works Ltd Taimamoseinoyoikokabutsuoataeru kokaseijushisoseibutsu
JPS5426845A (en) * 1977-08-01 1979-02-28 Yokohama Rubber Co Ltd:The Epoxy resin composition
JPS5463152A (en) * 1977-10-29 1979-05-21 Denki Kagaku Kogyo Kk Flexible epoxy resin composition
JPS5590549A (en) * 1978-12-29 1980-07-09 Nitto Electric Ind Co Ltd Adhesive resin molding
JPS56122857A (en) * 1980-02-29 1981-09-26 Nitto Electric Ind Co Ltd Preparation of epoxy resin composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899249A (enrdf_load_stackoverflow) * 1972-03-29 1973-12-15
JPS4997052A (enrdf_load_stackoverflow) * 1972-12-21 1974-09-13
JPS5030997A (enrdf_load_stackoverflow) * 1973-07-19 1975-03-27
JPS51109941A (ja) * 1975-03-25 1976-09-29 Matsushita Electric Works Ltd Taimamoseinoyoikokabutsuoataeru kokaseijushisoseibutsu
JPS5426845A (en) * 1977-08-01 1979-02-28 Yokohama Rubber Co Ltd:The Epoxy resin composition
JPS5463152A (en) * 1977-10-29 1979-05-21 Denki Kagaku Kogyo Kk Flexible epoxy resin composition
JPS5590549A (en) * 1978-12-29 1980-07-09 Nitto Electric Ind Co Ltd Adhesive resin molding
JPS56122857A (en) * 1980-02-29 1981-09-26 Nitto Electric Ind Co Ltd Preparation of epoxy resin composition

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58225120A (ja) * 1982-06-25 1983-12-27 Mitsubishi Gas Chem Co Inc 半導体封止用エポキシ樹脂組成物
JPS61221220A (ja) * 1985-03-27 1986-10-01 Toshiba Corp 樹脂封止型半導体装置
JPS61285243A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd 電子部品用成形材料
JPS61285244A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd 電子部品用成形材料
JPS61285215A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd 電子部品用成形材料
JPS62141018A (ja) * 1985-12-16 1987-06-24 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
US5043211A (en) * 1987-03-31 1991-08-27 Kabushiki Kaisha Toshiba Epoxy resin composition and a resin-sealed semiconductor device
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
US6582824B1 (en) 1998-10-02 2003-06-24 3M Innovative Properties Company Sealant composition, article and method

Also Published As

Publication number Publication date
JPS636084B2 (enrdf_load_stackoverflow) 1988-02-08

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