JPS56122857A - Preparation of epoxy resin composition - Google Patents
Preparation of epoxy resin compositionInfo
- Publication number
- JPS56122857A JPS56122857A JP2591980A JP2591980A JPS56122857A JP S56122857 A JPS56122857 A JP S56122857A JP 2591980 A JP2591980 A JP 2591980A JP 2591980 A JP2591980 A JP 2591980A JP S56122857 A JPS56122857 A JP S56122857A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- miscible
- curing agent
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prepare the titled composition with stabilized adhesion, insulation resistance, etc. by homogeneously dispersing a mixt. of a thermoplastic resin miscible with an epoxy resin, a curing agent and a cure accelerator into an epoxy resin.
CONSTITUTION: A thermoplastic resin (e.g., PE or polyester resin) of MI 50W400, miscible with an epoxy resin is compounded with a curing agent and a cure accelerator, and the resulting compound is heated, molten, mixed and pelletized after cooled, to obtain a resin (B). Then 30pts.wt. or less said component (B) are homogeneously dispersed into 100pts.wt. epoxy resin (A) by dry-blending and kneading the both at 60W150°C.
EFFECT: It is possible to obtain a cured product excellent in adhesion, chemical resistance, flexibility, insulation resistance, etc., without causing gelation or incomplete dispersion of the epoxy resin due to heating.
USE: Powder paint, etc.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2591980A JPS56122857A (en) | 1980-02-29 | 1980-02-29 | Preparation of epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2591980A JPS56122857A (en) | 1980-02-29 | 1980-02-29 | Preparation of epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56122857A true JPS56122857A (en) | 1981-09-26 |
Family
ID=12179180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2591980A Pending JPS56122857A (en) | 1980-02-29 | 1980-02-29 | Preparation of epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56122857A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58210920A (en) * | 1982-05-31 | 1983-12-08 | Shin Etsu Chem Co Ltd | Thermosetting epoxy resin composition |
| JPS58225120A (en) * | 1982-06-25 | 1983-12-27 | Mitsubishi Gas Chem Co Inc | Epoxy resin composition for sealing of semiconductor |
| JPS6281445A (en) * | 1985-10-03 | 1987-04-14 | Toyo Tire & Rubber Co Ltd | Bondable epoxy composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423700A (en) * | 1977-07-23 | 1979-02-22 | Toho Tennen Gas Kk | Oneepack type epoxy resin and adhesiveebacked tape impregnated with it |
-
1980
- 1980-02-29 JP JP2591980A patent/JPS56122857A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423700A (en) * | 1977-07-23 | 1979-02-22 | Toho Tennen Gas Kk | Oneepack type epoxy resin and adhesiveebacked tape impregnated with it |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58210920A (en) * | 1982-05-31 | 1983-12-08 | Shin Etsu Chem Co Ltd | Thermosetting epoxy resin composition |
| JPS636084B2 (en) * | 1982-05-31 | 1988-02-08 | Shinetsu Chem Ind Co | |
| JPS58225120A (en) * | 1982-06-25 | 1983-12-27 | Mitsubishi Gas Chem Co Inc | Epoxy resin composition for sealing of semiconductor |
| JPH0160163B2 (en) * | 1982-06-25 | 1989-12-21 | Mitsubishi Gas Chemical Co | |
| JPS6281445A (en) * | 1985-10-03 | 1987-04-14 | Toyo Tire & Rubber Co Ltd | Bondable epoxy composition |
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