JPS582100A - 印刷配線基板の製造方法 - Google Patents
印刷配線基板の製造方法Info
- Publication number
- JPS582100A JPS582100A JP9829681A JP9829681A JPS582100A JP S582100 A JPS582100 A JP S582100A JP 9829681 A JP9829681 A JP 9829681A JP 9829681 A JP9829681 A JP 9829681A JP S582100 A JPS582100 A JP S582100A
- Authority
- JP
- Japan
- Prior art keywords
- plate member
- small hole
- manufacturing
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9829681A JPS582100A (ja) | 1981-06-26 | 1981-06-26 | 印刷配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9829681A JPS582100A (ja) | 1981-06-26 | 1981-06-26 | 印刷配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS582100A true JPS582100A (ja) | 1983-01-07 |
| JPS6351399B2 JPS6351399B2 (enExample) | 1988-10-13 |
Family
ID=14215950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9829681A Granted JPS582100A (ja) | 1981-06-26 | 1981-06-26 | 印刷配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS582100A (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5355775A (en) * | 1976-10-30 | 1978-05-20 | Hitachi Chemical Co Ltd | Method of producing through hole printed circuit board |
| JPS5629389A (en) * | 1979-08-17 | 1981-03-24 | Nippon Electric Co | Printed board |
-
1981
- 1981-06-26 JP JP9829681A patent/JPS582100A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5355775A (en) * | 1976-10-30 | 1978-05-20 | Hitachi Chemical Co Ltd | Method of producing through hole printed circuit board |
| JPS5629389A (en) * | 1979-08-17 | 1981-03-24 | Nippon Electric Co | Printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6351399B2 (enExample) | 1988-10-13 |
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