JPS6351399B2 - - Google Patents

Info

Publication number
JPS6351399B2
JPS6351399B2 JP56098296A JP9829681A JPS6351399B2 JP S6351399 B2 JPS6351399 B2 JP S6351399B2 JP 56098296 A JP56098296 A JP 56098296A JP 9829681 A JP9829681 A JP 9829681A JP S6351399 B2 JPS6351399 B2 JP S6351399B2
Authority
JP
Japan
Prior art keywords
plate member
hole
small
forming
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56098296A
Other languages
English (en)
Japanese (ja)
Other versions
JPS582100A (ja
Inventor
Keijiro Orito
Kazuo Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP9829681A priority Critical patent/JPS582100A/ja
Publication of JPS582100A publication Critical patent/JPS582100A/ja
Publication of JPS6351399B2 publication Critical patent/JPS6351399B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP9829681A 1981-06-26 1981-06-26 印刷配線基板の製造方法 Granted JPS582100A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9829681A JPS582100A (ja) 1981-06-26 1981-06-26 印刷配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9829681A JPS582100A (ja) 1981-06-26 1981-06-26 印刷配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS582100A JPS582100A (ja) 1983-01-07
JPS6351399B2 true JPS6351399B2 (enExample) 1988-10-13

Family

ID=14215950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9829681A Granted JPS582100A (ja) 1981-06-26 1981-06-26 印刷配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS582100A (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52110472A (en) * 1976-03-11 1977-09-16 Takatsugu Komatsu Printed circuit substrate
JPS5355775A (en) * 1976-10-30 1978-05-20 Hitachi Chemical Co Ltd Method of producing through hole printed circuit board
JPS5629389A (en) * 1979-08-17 1981-03-24 Nippon Electric Co Printed board

Also Published As

Publication number Publication date
JPS582100A (ja) 1983-01-07

Similar Documents

Publication Publication Date Title
US4591411A (en) Method for forming a high density printed wiring board
US3778530A (en) Flatpack lead positioning device
US3400210A (en) Interlayer connection technique for multilayer printed wiring boards
JPH0213949B2 (enExample)
US6022466A (en) Process of plating selective areas on a printed circuit board
JP3289858B2 (ja) マルチチップモジュールの製造方法およびプリント配線板への実装方法
KR920007120B1 (ko) 표면장착용 배선기판의 제조방법
US3700443A (en) Flatpack lead positioning device
EP0127955B1 (en) Manufacture of printed circuit boards
EP1951012B1 (en) Method of manufacturing a wiring board including electroplating
JP3172509B2 (ja) 配線基板集合体の製造方法
JPH08107263A (ja) プリント配線板の製造方法
JPS6351399B2 (enExample)
JPH07235621A (ja) リードレスチップキャリア及びその製造方法
JPH1117315A (ja) 可撓性回路基板の製造法
JP2774183B2 (ja) 電磁シールドプリント基板の製造方法
US5340639A (en) Printed-wiring board
CN222484981U (zh) 一种具有侧壁图形的线路板
JPH0722735A (ja) プリント配線板
JPH1051094A (ja) プリント配線板及びその製造方法
KR100632559B1 (ko) 솔더 레지스트가 생략된 인쇄회로기판 그 제조방법
JPS5814626Y2 (ja) 多層プリント板
JP2795475B2 (ja) プリント配線板及びその製造方法
JPH06188534A (ja) 電子部品搭載用基板及びその製造方法
JPH04282887A (ja) プリント配線板の製造方法