JPS5818950A - 多層配線基板 - Google Patents

多層配線基板

Info

Publication number
JPS5818950A
JPS5818950A JP11707281A JP11707281A JPS5818950A JP S5818950 A JPS5818950 A JP S5818950A JP 11707281 A JP11707281 A JP 11707281A JP 11707281 A JP11707281 A JP 11707281A JP S5818950 A JPS5818950 A JP S5818950A
Authority
JP
Japan
Prior art keywords
wiring
wirings
substrate
pads
lsi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11707281A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0125228B2 (enrdf_load_stackoverflow
Inventor
Tatsuo Inoue
龍雄 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11707281A priority Critical patent/JPS5818950A/ja
Publication of JPS5818950A publication Critical patent/JPS5818950A/ja
Publication of JPH0125228B2 publication Critical patent/JPH0125228B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP11707281A 1981-07-28 1981-07-28 多層配線基板 Granted JPS5818950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11707281A JPS5818950A (ja) 1981-07-28 1981-07-28 多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11707281A JPS5818950A (ja) 1981-07-28 1981-07-28 多層配線基板

Publications (2)

Publication Number Publication Date
JPS5818950A true JPS5818950A (ja) 1983-02-03
JPH0125228B2 JPH0125228B2 (enrdf_load_stackoverflow) 1989-05-16

Family

ID=14702711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11707281A Granted JPS5818950A (ja) 1981-07-28 1981-07-28 多層配線基板

Country Status (1)

Country Link
JP (1) JPS5818950A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6135578A (ja) * 1984-07-27 1986-02-20 Agency Of Ind Science & Technol 超電導回路の結線方法
JPH0196953A (ja) * 1987-09-25 1989-04-14 Internatl Business Mach Corp <Ibm> 配線構造体
US5177594A (en) * 1991-01-09 1993-01-05 International Business Machines Corporation Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108797A (en) * 1979-02-13 1980-08-21 Hitachi Ltd Circuit board
JPS567457A (en) * 1979-06-29 1981-01-26 Ibm Package for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108797A (en) * 1979-02-13 1980-08-21 Hitachi Ltd Circuit board
JPS567457A (en) * 1979-06-29 1981-01-26 Ibm Package for semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6135578A (ja) * 1984-07-27 1986-02-20 Agency Of Ind Science & Technol 超電導回路の結線方法
JPH0196953A (ja) * 1987-09-25 1989-04-14 Internatl Business Mach Corp <Ibm> 配線構造体
US5177594A (en) * 1991-01-09 1993-01-05 International Business Machines Corporation Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance

Also Published As

Publication number Publication date
JPH0125228B2 (enrdf_load_stackoverflow) 1989-05-16

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