JPH0125228B2 - - Google Patents

Info

Publication number
JPH0125228B2
JPH0125228B2 JP56117072A JP11707281A JPH0125228B2 JP H0125228 B2 JPH0125228 B2 JP H0125228B2 JP 56117072 A JP56117072 A JP 56117072A JP 11707281 A JP11707281 A JP 11707281A JP H0125228 B2 JPH0125228 B2 JP H0125228B2
Authority
JP
Japan
Prior art keywords
wiring
board
wiring pattern
lsi
modified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56117072A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5818950A (ja
Inventor
Tatsuo Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11707281A priority Critical patent/JPS5818950A/ja
Publication of JPS5818950A publication Critical patent/JPS5818950A/ja
Publication of JPH0125228B2 publication Critical patent/JPH0125228B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP11707281A 1981-07-28 1981-07-28 多層配線基板 Granted JPS5818950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11707281A JPS5818950A (ja) 1981-07-28 1981-07-28 多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11707281A JPS5818950A (ja) 1981-07-28 1981-07-28 多層配線基板

Publications (2)

Publication Number Publication Date
JPS5818950A JPS5818950A (ja) 1983-02-03
JPH0125228B2 true JPH0125228B2 (enrdf_load_stackoverflow) 1989-05-16

Family

ID=14702711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11707281A Granted JPS5818950A (ja) 1981-07-28 1981-07-28 多層配線基板

Country Status (1)

Country Link
JP (1) JPS5818950A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6135578A (ja) * 1984-07-27 1986-02-20 Agency Of Ind Science & Technol 超電導回路の結線方法
US4782193A (en) * 1987-09-25 1988-11-01 Ibm Corp. Polygonal wiring for improved package performance
US5177594A (en) * 1991-01-09 1993-01-05 International Business Machines Corporation Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108797A (en) * 1979-02-13 1980-08-21 Hitachi Ltd Circuit board
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices

Also Published As

Publication number Publication date
JPS5818950A (ja) 1983-02-03

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