JPH0439231B2 - - Google Patents

Info

Publication number
JPH0439231B2
JPH0439231B2 JP57007588A JP758882A JPH0439231B2 JP H0439231 B2 JPH0439231 B2 JP H0439231B2 JP 57007588 A JP57007588 A JP 57007588A JP 758882 A JP758882 A JP 758882A JP H0439231 B2 JPH0439231 B2 JP H0439231B2
Authority
JP
Japan
Prior art keywords
chip
substrate
wiring
board
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57007588A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58125859A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP758882A priority Critical patent/JPS58125859A/ja
Publication of JPS58125859A publication Critical patent/JPS58125859A/ja
Publication of JPH0439231B2 publication Critical patent/JPH0439231B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP758882A 1982-01-22 1982-01-22 半導体装置 Granted JPS58125859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP758882A JPS58125859A (ja) 1982-01-22 1982-01-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP758882A JPS58125859A (ja) 1982-01-22 1982-01-22 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5213738A Division JPH0810738B2 (ja) 1993-08-30 1993-08-30 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS58125859A JPS58125859A (ja) 1983-07-27
JPH0439231B2 true JPH0439231B2 (enrdf_load_stackoverflow) 1992-06-26

Family

ID=11669969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP758882A Granted JPS58125859A (ja) 1982-01-22 1982-01-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS58125859A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2762705B2 (ja) * 1990-05-28 1998-06-04 松下電工株式会社 半導体装置実装用回路基板の構造
JP2868167B2 (ja) * 1991-08-05 1999-03-10 インターナショナル・ビジネス・マシーンズ・コーポレイション 多重レベル高密度相互接続構造体及び高密度相互接続構造体
US6696765B2 (en) 2001-11-19 2004-02-24 Hitachi, Ltd. Multi-chip module
JP3967108B2 (ja) 2001-10-26 2007-08-29 富士通株式会社 半導体装置およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473564A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Circuit device
JPS552738A (en) * 1978-06-20 1980-01-10 Nippon Giken:Kk Sheltering system of gas generated during electrolytic treatment and catching and collecting apparatus of gas
EP0007993A1 (de) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Leiterplatte zur Halterung und elektrischen Verbindung von Halbleiterchips
JPS5571091A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Multilayer circuit board

Also Published As

Publication number Publication date
JPS58125859A (ja) 1983-07-27

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