JPS6224948B2 - - Google Patents

Info

Publication number
JPS6224948B2
JPS6224948B2 JP56171641A JP17164181A JPS6224948B2 JP S6224948 B2 JPS6224948 B2 JP S6224948B2 JP 56171641 A JP56171641 A JP 56171641A JP 17164181 A JP17164181 A JP 17164181A JP S6224948 B2 JPS6224948 B2 JP S6224948B2
Authority
JP
Japan
Prior art keywords
wiring
bump
ceramic substrate
circular
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56171641A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5871646A (ja
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56171641A priority Critical patent/JPS5871646A/ja
Publication of JPS5871646A publication Critical patent/JPS5871646A/ja
Publication of JPS6224948B2 publication Critical patent/JPS6224948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP56171641A 1981-10-24 1981-10-24 半導体装置 Granted JPS5871646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56171641A JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56171641A JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS5871646A JPS5871646A (ja) 1983-04-28
JPS6224948B2 true JPS6224948B2 (enrdf_load_stackoverflow) 1987-05-30

Family

ID=15926965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56171641A Granted JPS5871646A (ja) 1981-10-24 1981-10-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS5871646A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0516106U (ja) * 1991-08-05 1993-03-02 株式会社小松製作所 切粉処理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
JPS63102399A (ja) * 1986-10-20 1988-05-07 富士通株式会社 多層プリント配線基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5030474A (enrdf_load_stackoverflow) * 1973-07-17 1975-03-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0516106U (ja) * 1991-08-05 1993-03-02 株式会社小松製作所 切粉処理装置

Also Published As

Publication number Publication date
JPS5871646A (ja) 1983-04-28

Similar Documents

Publication Publication Date Title
EP1156705B1 (en) Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment
US5394303A (en) Semiconductor device
JPS5839048A (ja) フレキシブル領域接着テ−プ
JPH0658941B2 (ja) コンピュータシステム内への機能的サブシステム形成方法
JPH01167970A (ja) 絶縁テープを用いた相互接続方法
WO2003005445A1 (fr) Dispositif a semiconducteur et module a semiconducteur
JP2002057424A (ja) プリント配線板及びその製造方法
JP2001267490A (ja) 半導体モジュール
US6369331B1 (en) Printed circuit board for semiconductor package and method of making same
JPH0575014A (ja) 半導体チツプの実装構造
JPS6224948B2 (enrdf_load_stackoverflow)
CN110112113B (zh) 半导体封装件
JPS60105269A (ja) ハイブリツド回路の製造方法
JP2001015629A (ja) 半導体装置及びその製造方法
JPH0437585B2 (enrdf_load_stackoverflow)
TW557561B (en) Flip chip package structure
JPH02230749A (ja) 半導体チップ及び該チップを用いた半導体装置
JP5839503B2 (ja) 半導体装置、ＬＳＩ（ＬａｒｇｅＳｃａｌｅＩｎｔｅｇｒａｔｉｏｎ）及び電子機器
CN101673717B (zh) 半导体装置
JPH05343602A (ja) 高集積半導体装置及びそれを用いた半導体モジュール
JP2001085600A (ja) 半導体チップ、マルチチップパッケージ、半導体装置、並びに電子機器
JP2001332860A (ja) 多層配線基板、半導体装置、電子装置及びそれらの製造方法
JPH0314486A (ja) 電子部品用パッケージ
JPH0125228B2 (enrdf_load_stackoverflow)
JPH08186196A (ja) 半導体装置の実装構造