JPS5818285Y2 - 板状物の位置決め装置 - Google Patents

板状物の位置決め装置

Info

Publication number
JPS5818285Y2
JPS5818285Y2 JP1977082433U JP8243377U JPS5818285Y2 JP S5818285 Y2 JPS5818285 Y2 JP S5818285Y2 JP 1977082433 U JP1977082433 U JP 1977082433U JP 8243377 U JP8243377 U JP 8243377U JP S5818285 Y2 JPS5818285 Y2 JP S5818285Y2
Authority
JP
Japan
Prior art keywords
plate
positioning device
shaped
shaped notch
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977082433U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5411164U (enrdf_load_stackoverflow
Inventor
広志 堀江
喬 小嶋
護 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1977082433U priority Critical patent/JPS5818285Y2/ja
Publication of JPS5411164U publication Critical patent/JPS5411164U/ja
Application granted granted Critical
Publication of JPS5818285Y2 publication Critical patent/JPS5818285Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP1977082433U 1977-06-24 1977-06-24 板状物の位置決め装置 Expired JPS5818285Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977082433U JPS5818285Y2 (ja) 1977-06-24 1977-06-24 板状物の位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977082433U JPS5818285Y2 (ja) 1977-06-24 1977-06-24 板状物の位置決め装置

Publications (2)

Publication Number Publication Date
JPS5411164U JPS5411164U (enrdf_load_stackoverflow) 1979-01-24
JPS5818285Y2 true JPS5818285Y2 (ja) 1983-04-13

Family

ID=29003283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977082433U Expired JPS5818285Y2 (ja) 1977-06-24 1977-06-24 板状物の位置決め装置

Country Status (1)

Country Link
JP (1) JPS5818285Y2 (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5622139B2 (enrdf_load_stackoverflow) * 1972-07-12 1981-05-23
JPS5079273A (enrdf_load_stackoverflow) * 1973-11-12 1975-06-27

Also Published As

Publication number Publication date
JPS5411164U (enrdf_load_stackoverflow) 1979-01-24

Similar Documents

Publication Publication Date Title
DE69231785T2 (de) Verfahren zum herstellen integrierte schaltungsanordnungen
EP0678904A1 (en) Multicut wafer saw process
US3897627A (en) Method for manufacturing semiconductor devices
DE19753492A1 (de) Verbessertes Ritzen und Brechen von schwer zu ritzenden Materialien
JP3166122B2 (ja) ワークプレートを使用して結晶を切断する方法
DE4318463C2 (de) Verfahren zum Herstellen eines Metall-Keramik-Substrates
JPS5818285Y2 (ja) 板状物の位置決め装置
JPS60167351A (ja) 混成集積回路装置の製造方法
KR950012798B1 (ko) 동일 평면의 다이 대기판의 접착방법
US5240551A (en) Method of manufacturing ceramic circuit board
JPH03283637A (ja) 半導体装置
JPH0514513Y2 (enrdf_load_stackoverflow)
JPH01133703A (ja) 半導体ウエハおよびこれを用いた半導体装置
JPH06268060A (ja) 半導体装置の製造方法
JPH07120642B2 (ja) 半導体装置およびその製造方法
KR100598329B1 (ko) 반도체 패키지 및 그의 제작방법
JPH03139862A (ja) 半導体装置
JPS5815225A (ja) 半導体装置基板
JPS6226838A (ja) 半導体素子の製造方法
JPH02230790A (ja) セラミックス回路基板の製造方法
JPH0239436A (ja) 半導体装置の製造方法
JPS6089941A (ja) 半導体基板のダイシング方法
JPS59231835A (ja) 半導体ウエ−ハの分割方法
JPH0945637A (ja) 半導体装置の製造方法
JPS6074594A (ja) ハイブリッドｉｃ用小片基板の製造方法