JPS58182858A - リ−ドフレ−ム - Google Patents
リ−ドフレ−ムInfo
- Publication number
- JPS58182858A JPS58182858A JP6682282A JP6682282A JPS58182858A JP S58182858 A JPS58182858 A JP S58182858A JP 6682282 A JP6682282 A JP 6682282A JP 6682282 A JP6682282 A JP 6682282A JP S58182858 A JPS58182858 A JP S58182858A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- coining
- inner lead
- leads
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910001111 Fine metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6682282A JPS58182858A (ja) | 1982-04-21 | 1982-04-21 | リ−ドフレ−ム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6682282A JPS58182858A (ja) | 1982-04-21 | 1982-04-21 | リ−ドフレ−ム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58182858A true JPS58182858A (ja) | 1983-10-25 |
JPS6347272B2 JPS6347272B2 (enrdf_load_stackoverflow) | 1988-09-21 |
Family
ID=13326920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6682282A Granted JPS58182858A (ja) | 1982-04-21 | 1982-04-21 | リ−ドフレ−ム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58182858A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62135447U (enrdf_load_stackoverflow) * | 1986-02-21 | 1987-08-26 | ||
JPH03187252A (ja) * | 1989-12-15 | 1991-08-15 | Sanyo Electric Co Ltd | リードフレームの製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501658A (enrdf_load_stackoverflow) * | 1973-05-07 | 1975-01-09 | ||
JPS5666061A (en) * | 1979-11-05 | 1981-06-04 | Hitachi Ltd | Lead frame |
JPS56167549U (enrdf_load_stackoverflow) * | 1981-01-16 | 1981-12-11 |
-
1982
- 1982-04-21 JP JP6682282A patent/JPS58182858A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501658A (enrdf_load_stackoverflow) * | 1973-05-07 | 1975-01-09 | ||
JPS5666061A (en) * | 1979-11-05 | 1981-06-04 | Hitachi Ltd | Lead frame |
JPS56167549U (enrdf_load_stackoverflow) * | 1981-01-16 | 1981-12-11 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62135447U (enrdf_load_stackoverflow) * | 1986-02-21 | 1987-08-26 | ||
JPH03187252A (ja) * | 1989-12-15 | 1991-08-15 | Sanyo Electric Co Ltd | リードフレームの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6347272B2 (enrdf_load_stackoverflow) | 1988-09-21 |
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