JPS58182841A - モノリシツク集積回路 - Google Patents

モノリシツク集積回路

Info

Publication number
JPS58182841A
JPS58182841A JP57066823A JP6682382A JPS58182841A JP S58182841 A JPS58182841 A JP S58182841A JP 57066823 A JP57066823 A JP 57066823A JP 6682382 A JP6682382 A JP 6682382A JP S58182841 A JPS58182841 A JP S58182841A
Authority
JP
Japan
Prior art keywords
chip
connection
pads
corner
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57066823A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364054B2 (cg-RX-API-DMAC10.html
Inventor
Hiroyuki Misawa
三沢　弘行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57066823A priority Critical patent/JPS58182841A/ja
Publication of JPS58182841A publication Critical patent/JPS58182841A/ja
Publication of JPS6364054B2 publication Critical patent/JPS6364054B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/50—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP57066823A 1982-04-21 1982-04-21 モノリシツク集積回路 Granted JPS58182841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57066823A JPS58182841A (ja) 1982-04-21 1982-04-21 モノリシツク集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57066823A JPS58182841A (ja) 1982-04-21 1982-04-21 モノリシツク集積回路

Publications (2)

Publication Number Publication Date
JPS58182841A true JPS58182841A (ja) 1983-10-25
JPS6364054B2 JPS6364054B2 (cg-RX-API-DMAC10.html) 1988-12-09

Family

ID=13326943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57066823A Granted JPS58182841A (ja) 1982-04-21 1982-04-21 モノリシツク集積回路

Country Status (1)

Country Link
JP (1) JPS58182841A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098645A (ja) * 1983-11-02 1985-06-01 Mitsubishi Electric Corp 集積回路パツケ−ジの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098645A (ja) * 1983-11-02 1985-06-01 Mitsubishi Electric Corp 集積回路パツケ−ジの製造方法

Also Published As

Publication number Publication date
JPS6364054B2 (cg-RX-API-DMAC10.html) 1988-12-09

Similar Documents

Publication Publication Date Title
US6674177B2 (en) Apparatus for implementing selected functionality on an integrated circuit device
US6278616B1 (en) Modifying memory device organization in high density packages
JPS61222148A (ja) １チツプマイクロコンピユ−タの製造方法
JPH01225137A (ja) 半導体集積回路装置
JPS58182841A (ja) モノリシツク集積回路
JPH02244755A (ja) Ｌｓｉ
JPH02267947A (ja) 半導体装置
US6465891B2 (en) Integrated-circuit package with a quick-to-count finger layout design on substrate
JPH04361538A (ja) 大規模集積回路
JPS6393125A (ja) 半導体集積回路
JPS61225845A (ja) 半導体装置
JP2533810B2 (ja) 半導体装置
JPS59145542A (ja) 大規模集積回路
JPH02306650A (ja) 半導体装置
JPH023259A (ja) マスタスライス型半導体装置の製造方法
JP4229086B2 (ja) 半導体装置
JPH01290242A (ja) 半導体集積回路装置
JPH04171844A (ja) 半導体集積回路
JPS6081852A (ja) 半導体装置
JPS6278848A (ja) 大規模半導体集積回路
JPH04368175A (ja) マスタスライスｌｓｉ
JPH06151592A (ja) スタンダードセル方式の半導体集積回路
JPH08264673A (ja) 集積回路装置
JPH02267946A (ja) 半導体装置用パッケージ
JPS59124151A (ja) 半導体集積回路装置