JPS6364054B2 - - Google Patents
Info
- Publication number
- JPS6364054B2 JPS6364054B2 JP57066823A JP6682382A JPS6364054B2 JP S6364054 B2 JPS6364054 B2 JP S6364054B2 JP 57066823 A JP57066823 A JP 57066823A JP 6682382 A JP6682382 A JP 6682382A JP S6364054 B2 JPS6364054 B2 JP S6364054B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- connection
- pins
- pads
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/90—
-
- H10W72/50—
-
- H10W72/5449—
-
- H10W72/5473—
-
- H10W72/932—
-
- H10W90/756—
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57066823A JPS58182841A (ja) | 1982-04-21 | 1982-04-21 | モノリシツク集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57066823A JPS58182841A (ja) | 1982-04-21 | 1982-04-21 | モノリシツク集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58182841A JPS58182841A (ja) | 1983-10-25 |
| JPS6364054B2 true JPS6364054B2 (cg-RX-API-DMAC10.html) | 1988-12-09 |
Family
ID=13326943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57066823A Granted JPS58182841A (ja) | 1982-04-21 | 1982-04-21 | モノリシツク集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58182841A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6098645A (ja) * | 1983-11-02 | 1985-06-01 | Mitsubishi Electric Corp | 集積回路パツケ−ジの製造方法 |
-
1982
- 1982-04-21 JP JP57066823A patent/JPS58182841A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58182841A (ja) | 1983-10-25 |
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