JPS58170045A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58170045A
JPS58170045A JP57053092A JP5309282A JPS58170045A JP S58170045 A JPS58170045 A JP S58170045A JP 57053092 A JP57053092 A JP 57053092A JP 5309282 A JP5309282 A JP 5309282A JP S58170045 A JPS58170045 A JP S58170045A
Authority
JP
Japan
Prior art keywords
lead
cap
lead frame
semiconductor
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57053092A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347269B2 (enExample
Inventor
Marehide Yamauchi
山内 希英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57053092A priority Critical patent/JPS58170045A/ja
Publication of JPS58170045A publication Critical patent/JPS58170045A/ja
Publication of JPS6347269B2 publication Critical patent/JPS6347269B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/429
    • H10W72/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57053092A 1982-03-31 1982-03-31 半導体装置の製造方法 Granted JPS58170045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57053092A JPS58170045A (ja) 1982-03-31 1982-03-31 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57053092A JPS58170045A (ja) 1982-03-31 1982-03-31 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58170045A true JPS58170045A (ja) 1983-10-06
JPS6347269B2 JPS6347269B2 (enExample) 1988-09-21

Family

ID=12933133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57053092A Granted JPS58170045A (ja) 1982-03-31 1982-03-31 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58170045A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5325360A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5325360A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Production of semiconductor device

Also Published As

Publication number Publication date
JPS6347269B2 (enExample) 1988-09-21

Similar Documents

Publication Publication Date Title
JPS58170045A (ja) 半導体装置の製造方法
JP2517691B2 (ja) 半導体装置及びその製造方法
KR940016723A (ko) 반도체 리이드 프레임
JPH0233961A (ja) リードフレーム
JPH0135478Y2 (enExample)
KR200183066Y1 (ko) 반도체 패키지 제조용 히트싱크구조
JPH04137553A (ja) 半導体装置用リードフレーム
JPH02222166A (ja) リードフレームおよび放熱板および半導体装置
JPS6234445Y2 (enExample)
JPH02253646A (ja) リードフレーム
JP3095194U (ja) 半導体素子のパッケージ構造
JPS61276245A (ja) 半導体集積回路装置
JPH02142545U (enExample)
JPS5923553A (ja) 半導体装置の製造方法
JPS58197862A (ja) 半導体装置用気密容器
KR970024106A (ko) 업셋 조정된 리드 프레임 및 그를 이용한 반도체 칩 패키지
JPH02197151A (ja) 樹脂封止型半導体装置及びその製造方法
JPH0318046A (ja) 半導体装置
JPS6114660U (ja) 半導体装置のテ−ピング包装
JPH04274333A (ja) Icパッケージ
JPS6117750U (ja) 半導体装置用フレ−ム
KR980006200A (ko) 상 · 하면에 이격된 레이져 헤드를 갖는 레이져 마킹장치 및 레이져 해드 배치방법
JPH02305456A (ja) リードフレームとその加工方法、および半導体装置の製法
JPS61253838A (ja) 半導体装置用パツケ−ジ
JPH06232314A (ja) 半導体装置用リードフレーム、それを用いた樹脂封止型半導体装置及びその製造方法