JPS58166040U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS58166040U JPS58166040U JP1983026177U JP2617783U JPS58166040U JP S58166040 U JPS58166040 U JP S58166040U JP 1983026177 U JP1983026177 U JP 1983026177U JP 2617783 U JP2617783 U JP 2617783U JP S58166040 U JPS58166040 U JP S58166040U
- Authority
- JP
- Japan
- Prior art keywords
- lid member
- semiconductor element
- semiconductor equipment
- resin film
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
、 図は本考案による半導体装置の概略構造を示す
断面図である。 １・・・半導体素子収容容器１．２・・・半導体素子、
３・・・外部接続端子、４・・・壁部材、５・・・ボン
ディングワイヤ、６・・・蓋部材、７・・・α線遮蔽用
樹脂膜、８・・・封止材。
断面図である。 １・・・半導体素子収容容器１．２・・・半導体素子、
３・・・外部接続端子、４・・・壁部材、５・・・ボン
ディングワイヤ、６・・・蓋部材、７・・・α線遮蔽用
樹脂膜、８・・・封止材。
Claims (1)
- 半導体素子と、該半導体素子の収容容器と、該半導体素
子を該収容容器内に封止材を介して気密封止する蓋部材
とを備えた半導体装置に於て、前記蓋部材の内側表面に
放射線遮蔽用樹脂膜が接着され、且つ前記樹脂膜の端部
は前記収容容器と前記蓋部材との境界面接触しているこ
とを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983026177U JPS6028139Y2 (ja) | 1983-02-24 | 1983-02-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983026177U JPS6028139Y2 (ja) | 1983-02-24 | 1983-02-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58166040U true JPS58166040U (ja) | 1983-11-05 |
| JPS6028139Y2 JPS6028139Y2 (ja) | 1985-08-26 |
Family
ID=30038135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983026177U Expired JPS6028139Y2 (ja) | 1983-02-24 | 1983-02-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028139Y2 (ja) |
-
1983
- 1983-02-24 JP JP1983026177U patent/JPS6028139Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6028139Y2 (ja) | 1985-08-26 |
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