JPS58161755A - 金属箔のハンダ塗装方法 - Google Patents
金属箔のハンダ塗装方法Info
- Publication number
- JPS58161755A JPS58161755A JP4404782A JP4404782A JPS58161755A JP S58161755 A JPS58161755 A JP S58161755A JP 4404782 A JP4404782 A JP 4404782A JP 4404782 A JP4404782 A JP 4404782A JP S58161755 A JPS58161755 A JP S58161755A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- metal foil
- lip
- front lip
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/006—Pattern or selective deposits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating Apparatus (AREA)
- Coating With Molten Metal (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4404782A JPS58161755A (ja) | 1982-03-18 | 1982-03-18 | 金属箔のハンダ塗装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4404782A JPS58161755A (ja) | 1982-03-18 | 1982-03-18 | 金属箔のハンダ塗装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58161755A true JPS58161755A (ja) | 1983-09-26 |
| JPS6121306B2 JPS6121306B2 (enExample) | 1986-05-26 |
Family
ID=12680693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4404782A Granted JPS58161755A (ja) | 1982-03-18 | 1982-03-18 | 金属箔のハンダ塗装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58161755A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271055A (ja) * | 1985-05-27 | 1986-12-01 | Konishiroku Photo Ind Co Ltd | 写真材料塗布装置 |
| JP2005270875A (ja) * | 2004-03-25 | 2005-10-06 | Tokyo Ohka Kogyo Co Ltd | 塗膜形成方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459708U (enExample) * | 1990-10-01 | 1992-05-22 | ||
| JP3511984B2 (ja) * | 1991-09-02 | 2004-03-29 | 松下電器産業株式会社 | 塗布装置及び方法並びに印刷装置及び方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103429A (enExample) * | 1974-01-15 | 1975-08-15 | ||
| JPS50102964U (enExample) * | 1974-01-31 | 1975-08-25 |
-
1982
- 1982-03-18 JP JP4404782A patent/JPS58161755A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103429A (enExample) * | 1974-01-15 | 1975-08-15 | ||
| JPS50102964U (enExample) * | 1974-01-31 | 1975-08-25 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61271055A (ja) * | 1985-05-27 | 1986-12-01 | Konishiroku Photo Ind Co Ltd | 写真材料塗布装置 |
| JP2005270875A (ja) * | 2004-03-25 | 2005-10-06 | Tokyo Ohka Kogyo Co Ltd | 塗膜形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6121306B2 (enExample) | 1986-05-26 |
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