JPS58155741A - 多層配線構造の製造方法 - Google Patents

多層配線構造の製造方法

Info

Publication number
JPS58155741A
JPS58155741A JP3799182A JP3799182A JPS58155741A JP S58155741 A JPS58155741 A JP S58155741A JP 3799182 A JP3799182 A JP 3799182A JP 3799182 A JP3799182 A JP 3799182A JP S58155741 A JPS58155741 A JP S58155741A
Authority
JP
Japan
Prior art keywords
layer
wiring
wiring layer
film
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3799182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0568853B2 (enrdf_load_stackoverflow
Inventor
Ryoji Oritsuki
折付　良二
Susumu Saito
進 斉藤
Hiromi Kanai
紘美 金井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3799182A priority Critical patent/JPS58155741A/ja
Publication of JPS58155741A publication Critical patent/JPS58155741A/ja
Publication of JPH0568853B2 publication Critical patent/JPH0568853B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP3799182A 1982-03-12 1982-03-12 多層配線構造の製造方法 Granted JPS58155741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3799182A JPS58155741A (ja) 1982-03-12 1982-03-12 多層配線構造の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3799182A JPS58155741A (ja) 1982-03-12 1982-03-12 多層配線構造の製造方法

Publications (2)

Publication Number Publication Date
JPS58155741A true JPS58155741A (ja) 1983-09-16
JPH0568853B2 JPH0568853B2 (enrdf_load_stackoverflow) 1993-09-29

Family

ID=12513030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3799182A Granted JPS58155741A (ja) 1982-03-12 1982-03-12 多層配線構造の製造方法

Country Status (1)

Country Link
JP (1) JPS58155741A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961147A (ja) * 1982-09-30 1984-04-07 Toshiba Corp 半導体装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640260A (en) * 1979-09-11 1981-04-16 Mitsubishi Electric Corp Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640260A (en) * 1979-09-11 1981-04-16 Mitsubishi Electric Corp Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961147A (ja) * 1982-09-30 1984-04-07 Toshiba Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0568853B2 (enrdf_load_stackoverflow) 1993-09-29

Similar Documents

Publication Publication Date Title
KR100445286B1 (ko) 액정 표시 장치 및 그 제조 방법
JPH10190192A (ja) 印刷回路板製造プロセス
JPH0786230A (ja) テーパエッチング方法
KR0124644B1 (ko) 반도체소자의 다층금속배선의 형성방법
JPS58213450A (ja) 半導体装置の多層配線構造
JPS58155741A (ja) 多層配線構造の製造方法
JPH0713962B2 (ja) 多層配線構造を有する半導体装置
US12379817B2 (en) Touch panel and touch panel manufacturing method
JPH08185978A (ja) Ｅｌ表示器とその製造方法
JPH04320049A (ja) 多層配線構造体およびその製造方法
JPS5867043A (ja) 半導体装置の装造方法
JP3336802B2 (ja) リードフレーム用クラッド材とリードフレームの製造方法
JPH01241118A (ja) アライメント・マーク
JPS6097691A (ja) 厚膜薄膜配線基板の製造方法
JPH0720491A (ja) 液晶表示装置とその製造方法
JPH0455556B2 (enrdf_load_stackoverflow)
JPS58142546A (ja) 多層配線の形成方法
JPS58199523A (ja) 半導体装置の製造方法
KR940005609B1 (ko) 단차가 없는 도전층 패턴 제조방법
JPH0646348B2 (ja) 表示素子
JPS6278855A (ja) 半導体装置
JPS60124950A (ja) 多層配線構造を有する半導体装置
JPS58210168A (ja) 二層膜のエツチング方法
JPH01117329A (ja) 薄膜装置の絶縁膜製造方法
JPS59207692A (ja) 多層配線基板の製造方法