JPS58153356A - 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金 - Google Patents

耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金

Info

Publication number
JPS58153356A
JPS58153356A JP3462782A JP3462782A JPS58153356A JP S58153356 A JPS58153356 A JP S58153356A JP 3462782 A JP3462782 A JP 3462782A JP 3462782 A JP3462782 A JP 3462782A JP S58153356 A JPS58153356 A JP S58153356A
Authority
JP
Japan
Prior art keywords
alloy
lead material
strength
component
heat resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3462782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6245299B2 (enrdf_load_stackoverflow
Inventor
Masaki Morikawa
正樹 森川
Hideaki Yoshida
秀昭 吉田
Kunio Kishida
岸田　邦雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP3462782A priority Critical patent/JPS58153356A/ja
Publication of JPS58153356A publication Critical patent/JPS58153356A/ja
Publication of JPS6245299B2 publication Critical patent/JPS6245299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP3462782A 1982-03-05 1982-03-05 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金 Granted JPS58153356A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3462782A JPS58153356A (ja) 1982-03-05 1982-03-05 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3462782A JPS58153356A (ja) 1982-03-05 1982-03-05 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金

Publications (2)

Publication Number Publication Date
JPS58153356A true JPS58153356A (ja) 1983-09-12
JPS6245299B2 JPS6245299B2 (enrdf_load_stackoverflow) 1987-09-25

Family

ID=12419626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3462782A Granted JPS58153356A (ja) 1982-03-05 1982-03-05 耐酸化性のすぐれた半導体装置のリ−ド材用Ｃｕ合金

Country Status (1)

Country Link
JP (1) JPS58153356A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60105259A (ja) * 1983-11-11 1985-06-10 Hitachi Cable Ltd 半導体機器用リ−ドフレ−ム材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60105259A (ja) * 1983-11-11 1985-06-10 Hitachi Cable Ltd 半導体機器用リ−ドフレ−ム材

Also Published As

Publication number Publication date
JPS6245299B2 (enrdf_load_stackoverflow) 1987-09-25

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