JPS5812445Y2 - 半導体集積回路容器 - Google Patents

半導体集積回路容器

Info

Publication number
JPS5812445Y2
JPS5812445Y2 JP1977136790U JP13679077U JPS5812445Y2 JP S5812445 Y2 JPS5812445 Y2 JP S5812445Y2 JP 1977136790 U JP1977136790 U JP 1977136790U JP 13679077 U JP13679077 U JP 13679077U JP S5812445 Y2 JPS5812445 Y2 JP S5812445Y2
Authority
JP
Japan
Prior art keywords
semiconductor integrated
integrated circuit
external lead
substrate
circuit container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977136790U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5464458U (enrdf_load_stackoverflow
Inventor
正 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP1977136790U priority Critical patent/JPS5812445Y2/ja
Publication of JPS5464458U publication Critical patent/JPS5464458U/ja
Application granted granted Critical
Publication of JPS5812445Y2 publication Critical patent/JPS5812445Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1977136790U 1977-10-14 1977-10-14 半導体集積回路容器 Expired JPS5812445Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977136790U JPS5812445Y2 (ja) 1977-10-14 1977-10-14 半導体集積回路容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977136790U JPS5812445Y2 (ja) 1977-10-14 1977-10-14 半導体集積回路容器

Publications (2)

Publication Number Publication Date
JPS5464458U JPS5464458U (enrdf_load_stackoverflow) 1979-05-08
JPS5812445Y2 true JPS5812445Y2 (ja) 1983-03-09

Family

ID=29108358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977136790U Expired JPS5812445Y2 (ja) 1977-10-14 1977-10-14 半導体集積回路容器

Country Status (1)

Country Link
JP (1) JPS5812445Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331409Y2 (enrdf_load_stackoverflow) * 1981-06-03 1988-08-22
JP2010278236A (ja) * 2009-05-28 2010-12-09 Murata Mfg Co Ltd 電子部品の製造方法

Also Published As

Publication number Publication date
JPS5464458U (enrdf_load_stackoverflow) 1979-05-08

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