JPS5812445Y2 - 半導体集積回路容器 - Google Patents

半導体集積回路容器

Info

Publication number
JPS5812445Y2
JPS5812445Y2 JP1977136790U JP13679077U JPS5812445Y2 JP S5812445 Y2 JPS5812445 Y2 JP S5812445Y2 JP 1977136790 U JP1977136790 U JP 1977136790U JP 13679077 U JP13679077 U JP 13679077U JP S5812445 Y2 JPS5812445 Y2 JP S5812445Y2
Authority
JP
Japan
Prior art keywords
semiconductor integrated
integrated circuit
external lead
substrate
circuit container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977136790U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5464458U (cg-RX-API-DMAC10.html
Inventor
正 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP1977136790U priority Critical patent/JPS5812445Y2/ja
Publication of JPS5464458U publication Critical patent/JPS5464458U/ja
Application granted granted Critical
Publication of JPS5812445Y2 publication Critical patent/JPS5812445Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W90/753—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1977136790U 1977-10-14 1977-10-14 半導体集積回路容器 Expired JPS5812445Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977136790U JPS5812445Y2 (ja) 1977-10-14 1977-10-14 半導体集積回路容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977136790U JPS5812445Y2 (ja) 1977-10-14 1977-10-14 半導体集積回路容器

Publications (2)

Publication Number Publication Date
JPS5464458U JPS5464458U (cg-RX-API-DMAC10.html) 1979-05-08
JPS5812445Y2 true JPS5812445Y2 (ja) 1983-03-09

Family

ID=29108358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977136790U Expired JPS5812445Y2 (ja) 1977-10-14 1977-10-14 半導体集積回路容器

Country Status (1)

Country Link
JP (1) JPS5812445Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331409Y2 (cg-RX-API-DMAC10.html) * 1981-06-03 1988-08-22
JP2010278236A (ja) * 2009-05-28 2010-12-09 Murata Mfg Co Ltd 電子部品の製造方法

Also Published As

Publication number Publication date
JPS5464458U (cg-RX-API-DMAC10.html) 1979-05-08

Similar Documents

Publication Publication Date Title
KR970006533B1 (ko) 반도체장치 및 그 제조방법
US5805427A (en) Ball grid array electronic package standoff design
JP2939614B2 (ja) 積層型半導体パッケージ
US6181560B1 (en) Semiconductor package substrate and semiconductor package
JPH03108744A (ja) 樹脂封止型半導体装置
US5793613A (en) Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device
JPH0815165B2 (ja) 樹脂絶縁型半導体装置の製造方法
JPS5812445Y2 (ja) 半導体集積回路容器
GB2174538A (en) Semiconductor package
US7705437B2 (en) Semiconductor device
KR900001984B1 (ko) 수지봉합형 반도체장치
KR100201384B1 (ko) 투명창을구비한반도체패키지및그제조방법
JP2600617B2 (ja) 半導体装置およびその製造方法
JPH0472750A (ja) ガラス封止型半導体装置
JPS61168926A (ja) 樹脂基板
CN219917137U (zh) 一种半导体结构
JPS589585B2 (ja) デンシブヒンヨウリ−ドフレ−ム
JPH04188656A (ja) 混成集積回路の封止構造
KR100431501B1 (ko) 고전력 패키지 구조 및 제조 방법
JP2710207B2 (ja) 半導体装置およびその製造方法
JP2551349B2 (ja) 樹脂封止型半導体装置
JPH05198735A (ja) マルチチップモジュール
JP2552513Y2 (ja) リードフレーム
JP4688647B2 (ja) 半導体装置とその製造方法
KR0119730Y1 (ko) 버텀 리드형 반도체 패키지