JPS58122457U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58122457U
JPS58122457U JP1836082U JP1836082U JPS58122457U JP S58122457 U JPS58122457 U JP S58122457U JP 1836082 U JP1836082 U JP 1836082U JP 1836082 U JP1836082 U JP 1836082U JP S58122457 U JPS58122457 U JP S58122457U
Authority
JP
Japan
Prior art keywords
lead piece
semiconductor equipment
exposed
resin part
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1836082U
Other languages
English (en)
Japanese (ja)
Other versions
JPS635239Y2 (enrdf_load_stackoverflow
Inventor
川口　晃充
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1836082U priority Critical patent/JPS58122457U/ja
Publication of JPS58122457U publication Critical patent/JPS58122457U/ja
Application granted granted Critical
Publication of JPS635239Y2 publication Critical patent/JPS635239Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1836082U 1982-02-12 1982-02-12 半導体装置 Granted JPS58122457U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1836082U JPS58122457U (ja) 1982-02-12 1982-02-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1836082U JPS58122457U (ja) 1982-02-12 1982-02-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS58122457U true JPS58122457U (ja) 1983-08-20
JPS635239Y2 JPS635239Y2 (enrdf_load_stackoverflow) 1988-02-12

Family

ID=30030615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1836082U Granted JPS58122457U (ja) 1982-02-12 1982-02-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS58122457U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774277A (ja) * 1994-07-11 1995-03-17 Matsushita Electron Corp 半導体装置
JP2011003935A (ja) * 2006-04-17 2011-01-06 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージ及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659U (enrdf_load_stackoverflow) * 1977-07-01 1979-01-30
JPS5572065A (en) * 1978-11-25 1980-05-30 Mitsubishi Electric Corp Plastic-molded type semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414659U (enrdf_load_stackoverflow) * 1977-07-01 1979-01-30
JPS5572065A (en) * 1978-11-25 1980-05-30 Mitsubishi Electric Corp Plastic-molded type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774277A (ja) * 1994-07-11 1995-03-17 Matsushita Electron Corp 半導体装置
JP2011003935A (ja) * 2006-04-17 2011-01-06 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージ及びその製造方法

Also Published As

Publication number Publication date
JPS635239Y2 (enrdf_load_stackoverflow) 1988-02-12

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