JPS5878638U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS5878638U JPS5878638U JP17435481U JP17435481U JPS5878638U JP S5878638 U JPS5878638 U JP S5878638U JP 17435481 U JP17435481 U JP 17435481U JP 17435481 U JP17435481 U JP 17435481U JP S5878638 U JPS5878638 U JP S5878638U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- chip fixing
- lead
- semiconductor device
- semiconductor equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本考案半導体装置の構造斜視図、第２図ａ”−
ｄは本考案半導体装置の製造工程図である。 １は樹脂部、２は半導体チップ固着部、３はコネクタ接
続部、４は半導体チップ、５はコネクタ線１、Ｅ、Ｂ、
Ｃはリード片をしめす。
ｄは本考案半導体装置の製造工程図である。 １は樹脂部、２は半導体チップ固着部、３はコネクタ接
続部、４は半導体チップ、５はコネクタ線１、Ｅ、Ｂ、
Ｃはリード片をしめす。
Claims (2)
- （１）半導体チップ固着部を有するリード片及びコネク
タ接続部を有するリード片を夫々１又は複数個並置し、
相隣る上記リード片間を結合し、且つ該半導体チップ固
着部及び該コネクタ接続部を含んで封止するごとく樹脂
部を設け、該樹脂部を上記リード片の厚さ及び長さとほ
ぼ等しい範囲に形成したことを特徴とする半導体装置。 - （２）各リード片に凹部を設け、半導体チップ固着部又
はコネクタ接続部とした実用新案登録請求の範囲第１項
記載の半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17435481U JPS5878638U (ja) | 1981-11-24 | 1981-11-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17435481U JPS5878638U (ja) | 1981-11-24 | 1981-11-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5878638U true JPS5878638U (ja) | 1983-05-27 |
| JPS6339970Y2 JPS6339970Y2 (ja) | 1988-10-19 |
Family
ID=29966331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17435481U Granted JPS5878638U (ja) | 1981-11-24 | 1981-11-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5878638U (ja) |
-
1981
- 1981-11-24 JP JP17435481U patent/JPS5878638U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6339970Y2 (ja) | 1988-10-19 |
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