JPS5414659U - - Google Patents

Info

Publication number
JPS5414659U
JPS5414659U JP8799777U JP8799777U JPS5414659U JP S5414659 U JPS5414659 U JP S5414659U JP 8799777 U JP8799777 U JP 8799777U JP 8799777 U JP8799777 U JP 8799777U JP S5414659 U JPS5414659 U JP S5414659U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8799777U
Other languages
Japanese (ja)
Other versions
JPS6116702Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977087997U priority Critical patent/JPS6116702Y2/ja
Publication of JPS5414659U publication Critical patent/JPS5414659U/ja
Application granted granted Critical
Publication of JPS6116702Y2 publication Critical patent/JPS6116702Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1977087997U 1977-07-01 1977-07-01 Expired JPS6116702Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977087997U JPS6116702Y2 (enrdf_load_stackoverflow) 1977-07-01 1977-07-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977087997U JPS6116702Y2 (enrdf_load_stackoverflow) 1977-07-01 1977-07-01

Publications (2)

Publication Number Publication Date
JPS5414659U true JPS5414659U (enrdf_load_stackoverflow) 1979-01-30
JPS6116702Y2 JPS6116702Y2 (enrdf_load_stackoverflow) 1986-05-22

Family

ID=29014052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977087997U Expired JPS6116702Y2 (enrdf_load_stackoverflow) 1977-07-01 1977-07-01

Country Status (1)

Country Link
JP (1) JPS6116702Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122457U (ja) * 1982-02-12 1983-08-20 新電元工業株式会社 半導体装置
JPS58162642U (ja) * 1982-04-22 1983-10-29 新電元工業株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132177A (ja) * 1974-09-11 1976-03-18 Matsushita Electric Ind Co Ltd Riidoresumoorudotoranjisuta

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132177A (ja) * 1974-09-11 1976-03-18 Matsushita Electric Ind Co Ltd Riidoresumoorudotoranjisuta

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122457U (ja) * 1982-02-12 1983-08-20 新電元工業株式会社 半導体装置
JPS58162642U (ja) * 1982-04-22 1983-10-29 新電元工業株式会社 半導体装置

Also Published As

Publication number Publication date
JPS6116702Y2 (enrdf_load_stackoverflow) 1986-05-22

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