JPS58112354A - サイリスタ用接続導体 - Google Patents
サイリスタ用接続導体Info
- Publication number
- JPS58112354A JPS58112354A JP21046281A JP21046281A JPS58112354A JP S58112354 A JPS58112354 A JP S58112354A JP 21046281 A JP21046281 A JP 21046281A JP 21046281 A JP21046281 A JP 21046281A JP S58112354 A JPS58112354 A JP S58112354A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- connecting conductor
- external lead
- semiconductor device
- thyristor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Thyristors (AREA)
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21046281A JPS58112354A (ja) | 1981-12-25 | 1981-12-25 | サイリスタ用接続導体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21046281A JPS58112354A (ja) | 1981-12-25 | 1981-12-25 | サイリスタ用接続導体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58112354A true JPS58112354A (ja) | 1983-07-04 |
| JPS6347266B2 JPS6347266B2 (enrdf_load_stackoverflow) | 1988-09-21 |
Family
ID=16589728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21046281A Granted JPS58112354A (ja) | 1981-12-25 | 1981-12-25 | サイリスタ用接続導体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58112354A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110146A (ja) * | 1982-12-16 | 1984-06-26 | Toshiba Corp | パツケ−ジ形モジユ−ルの外部引出し端子 |
| JPH04171754A (ja) * | 1990-11-02 | 1992-06-18 | Mitsubishi Electric Corp | インテリジェントパワーモジュールの製造方法 |
| EP0791961A3 (en) * | 1996-02-22 | 1998-11-18 | Hitachi, Ltd. | Power semiconductor module |
| US6262474B1 (en) | 1998-06-01 | 2001-07-17 | Fuji Electric Co., Ltd. | Semiconductor device |
| EP1336990A1 (de) * | 2002-02-14 | 2003-08-20 | Abb Research Ltd. | Gehäuse für ein hochspannungsfestes Leistungshalbleitermodul |
-
1981
- 1981-12-25 JP JP21046281A patent/JPS58112354A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110146A (ja) * | 1982-12-16 | 1984-06-26 | Toshiba Corp | パツケ−ジ形モジユ−ルの外部引出し端子 |
| JPH04171754A (ja) * | 1990-11-02 | 1992-06-18 | Mitsubishi Electric Corp | インテリジェントパワーモジュールの製造方法 |
| EP0791961A3 (en) * | 1996-02-22 | 1998-11-18 | Hitachi, Ltd. | Power semiconductor module |
| US6262474B1 (en) | 1998-06-01 | 2001-07-17 | Fuji Electric Co., Ltd. | Semiconductor device |
| EP1336990A1 (de) * | 2002-02-14 | 2003-08-20 | Abb Research Ltd. | Gehäuse für ein hochspannungsfestes Leistungshalbleitermodul |
| WO2003069968A3 (de) * | 2002-02-14 | 2003-11-13 | Abb Research Ltd | Gehäuse für ein hochspannungsfestes leistungshalbleitermodul |
| JP2005522022A (ja) * | 2002-02-14 | 2005-07-21 | アーベーベー・リサーチ・リミテッド | 高電圧に耐えるパワー半導体モジュール用パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6347266B2 (enrdf_load_stackoverflow) | 1988-09-21 |
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