JPS58112354A - Connection conductor for semiconductor device - Google Patents

Abstract

PURPOSE:To allow the internal connection and the external terminal leadout of a semiconductor by a single body and thus improve the workability by a method wherein external lead-out terminals is formed by bending one side of the opposite side of a peripheral frame vertically to a plane of extended projection, and separating it corresponding to the projection. CONSTITUTION:Since top ends of a cathode electrode 13 and an anode electrode 16 are on the same plane, the top ends are inserted into holes of terminals 24, 25, 27, 28, 29 and 32 of the connection conductor and can be brazed. The substrate 11 of a thyristor element is fixed on a bottom plate 42 of the vessel via an insulation plate 41, and, in the vessel constituted of the bottom plate 42 and a side wall 43, resin 44 is cast so as to bury the thyristor element. The projection (external lead-out terminal) 23 out of the resin 44 is further bent again at a right angle along the lid body 45 of the vessel, and is used for connection to the external conductor, together with a nut 46 dropped in the recess of the lid body 45. It is effective to provide a cut 33 on the external lead-out terminal 23 in a transverse direction. The cut 33 shows an effect to the compression and tensile stress due to the external stress.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for constructing a circuit by connecting the substrates of a plurality of semiconductor elements arranged on the same substrate and respective terminals on planes spaced apart from each other, and forming external lead-out terminals. This invention relates to a connecting conductor for a conductor device.

When configuring a three-phase rectifier circuit using thyristors as a semiconductor device, for example, as shown in Figure 1, the individual thyristor elements are individually attached to a cooling body, and each terminal is connected while insulating each element. Making connections is complex to implement and maintain. Therefore, if a composite product is used in which all or a portion of this circuit is housed in one container, the entire device becomes smaller and easier to implement and maintain. In contrast, conventionally, a plurality of connection conductors have been used to connect elements to each other or to form external lead-out terminals.

FIG. 2 shows an example of this, in which the thyristor element has an output terminal 1 on its anode side and a base 3 of an output side connecting conductor 2.
The cathode side is placed on the base 6 of three input side connection conductors 6 each having an input side end pre-weld, and the cathode side is placed on the protrusion piece 7 of the output side connection conductor 2 and the protrusion piece 8 of the input side connection conductor, respectively. Connected. As a result, the output terminal 1 becomes the D terminal in FIG. 1, and the input terminal 4 becomes the U, V, and W terminals in FIG.

In this case, the thyristor element has a semiconductor piece 12 fixed on a conductive substrate 11 as shown in FIG. 3, with the anode drawn out from the substrate 11 and the cathode drawn out from the cathode electrode 13. Gate lead wire 14 drawn out separately. Auxiliary cathode line 15 is externally connected to a control circuit. However, in this case, four connecting conductors are required, the number of parts is large, and alignment of each connecting conductor 2.5 is troublesome, resulting in poor workability.

In view of this, it is an object of the present invention to provide a connecting conductor that can be used alone to connect internally to a semiconductor device and lead out external terminals, and has good workability.

The purpose of this is that the semiconductor device connection conductor is formed from a single electrically conductive plate and has a rectangular peripheral frame and a plurality of protrusions extending inward from a pair of opposite sides of the frame on the same plane. The tip of the peripheral frame forms an internal connection terminal, and one side of the opposite side of the peripheral frame is bent perpendicularly to the plane in which the protrusion extends and is cut off corresponding to the protrusion to form an external lead-out terminal. achieved by

Embodiments of the present invention will be described below with reference to the drawings. The connection conductor shown in FIG. 4 is made by punching and bending a copper plate, for example, and has three protrusions 23 on one side 21 of the opposite sides 21 and 22 of the peripheral frame.
Each tip is divided into two to form terminals 24 and 25. There are still three protruding parts 26 from the other financial power side 22.
are provided with two terminals 27 and 28 in series at the tips of two of them, and one terminal 27 and 28 at the tip of one.
9 is formed. A protrusion 31 is also provided on the other opposite side -30, the tip of which forms a terminal 32. Opposite sides 21 and 22 of the peripheral frame are bent, and the bases of the protrusions 23, 26 as well as the respective terminals 24, 25, 2?
, 28, 29. A plane perpendicular to the plane where 32 are located is formed. The terminal 24 faces the terminal 28 or 32 connected to the other side 22 of the peripheral frame, and the terminal 25 faces the terminal 27 or 29 similarly connected to the other side 22. One of these opposing terminals, that is, terminal 2
For example, connect the anode of each thyristor to 4,2f2, and
i.e. terminal j! 5. Connect the cathode to 32, side 21
If you cut between each of the side protrusions 2B, both ends of the protrusion 23 will connect to the p terminal shown in Figure 1, and the inner three will connect to the U, V, and W terminals shown in Figure 1.
Acts as a terminal. Therefore, in this case, the tips of the anode and cathode terminals of the thyristor are preferably on the same plane because they are connected to the respective terminals on the same plane of the connecting conductor.

FIG. ε shows an example of such an element, in which an anode electrode 16 is provided on the substrate 11 on the γ node side of the element shown in FIG. Therefore, as shown in FIG. 6, the terminals 24, 25 . of the connecting conductor according to the present invention. J! '7.2
B, 2G, 31! The tip can be inserted into the hole and brazed. The substrate 11 of the thyristor element is connected to the bottom plate 4j of the container via the insulating plate 41! A resin 44 is injected into the interior of the container consisting of a bottom plate 42 and side walls 43 so as to fill the thyristor elements. The protrusion (external lead-out terminal) 23 protruding above the resin 44 is further bent at right angles again along the lid 45 of the container, and is connected to the external conductor together with the nut 46 dropped into the recess of the lid 45. used.

It is effective to provide the external lead terminal 23 with a notch 33 in the lateral direction as shown in FIG.

The cut portion 33 is effective against compressive and tensile stress caused by external stress. When the casting resin 44 enters the notch 33 and hardens, it exhibits a large resistance to the force that attempts to pull out the external lead-out terminal 23. Moreover, when the resin 44 does not enter, it becomes strong against forces acting in the lateral direction.

As shown in FIG. 8, grooves 36 are formed in the bent portion 34 shown in FIG. 4 and the bent portion 3I5 shown in FIG. 6 of the external lead-out terminal 23 to the extent that the strength of the terminal is not impaired. become. Of course, this groove may be provided in the bent portion 37 on the other side 22 side of the peripheral frame shown in FIG.

As described above, the connecting conductor according to the present invention is integrally formed from a single electrically conductive plate and has an internal connecting terminal and an external lead-out terminal, and in particular, connects a three-phase rectifier circuit composed of anti-parallel connected thyristors. Not only can this method be effectively applied to a semiconductor device housed in a single container, but it can also be easily assembled into an economical semiconductor device when configuring a circuit from other semiconductor elements, so its effects are extremely large.

[Brief explanation of the drawing]

FIG. 1 is a circuit diagram of a three-phase rectifier circuit as an example of a circuit in which the connecting conductor according to the present invention is used, FIG. 2 is a perspective view of a conventional example of the connecting conductor used in the circuit of FIG. 1, and FIG. 4 is a perspective view of an embodiment of a connecting conductor according to the present invention; FIG. 5 is a perspective view of an example of a thyristor element connected thereby; FIG. 6 is a perspective view of an example of a thyristor element connected thereby;
The figure is a front sectional view of a semiconductor device assembled using the connecting conductor shown in FIG. 4, FIG. 7 is a side sectional view of a portion of the same device, and FIG. 8 is an enlarged front view of a portion of the connecting conductor according to the present invention. It is a diagram. 21.22! Peripheral frame, 23: Projection (external lead-out terminal)
, 24.25.2? , ! ! 8.297 internal connection terminal,
26: Projection, 33: Notch, 36: Groove.

Claims (1)

[Claims] 1) It is formed from a single electrically conductive plate, and has a rectangular peripheral frame and a plurality of protrusions extending inward from a pair of opposite sides of the frame on the same plane, and The tip forms an internal connection terminal, and one side of the opposite side of the peripheral frame is perpendicular to the plane in which the protrusion extends. A connecting conductor for a semiconductor device, characterized in that it is directly bent and cut to correspond to a protruding portion to form an external lead-out terminal. 2. A connecting conductor for a semiconductor device according to claim 1, characterized in that a notch is formed in the external lead terminal in the lateral direction. 3) A connecting conductor for a semiconductor device according to claim 1 or 2, characterized in that a groove is formed in the bent portion of the external lead terminal.