JPS6016453A - Package for integrated circuit device - Google Patents

Abstract

PURPOSE:To enable the increase in the number of lead terminals led out of a case without the enlargement of the case by a method wherein two lead terminals are formed into an integral body by electric isolation of each other and then led out of the case. CONSTITUTION:Internal wirings 2a and 2b construct a pair, and the lead terminals 3a and 3b connected to each of them become a pair and are formed into an integral body by sandwiching an insulation layer 5, thus forming a pin, which pins are led out of the case 1a. Therefore, since it is corresponding to one lead terminal of the IC package in appearance, the IC package by this construction can lead out the double number of lead terminals without the enlargement of the case. Accordingly, it becomes possible to contain the IC element increased in the number of lead out wires by the increase of density.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a pancage for an integrated circuit device, and more particularly to a structure of a pancage to accommodate higher integration of integrated circuit devices.

(bl Background of the Technology The form of lead terminal derivation in integrated circuit devices is the so-called D
It is called an IP type, and generally has a plurality of lead terminals led out from each of two opposing sides of a rectangular pan cage case of the integrated circuit device. As the number of lead terminals increases as the degree of integration of integrated devices progresses, the case of conventional DIP type is made larger to accommodate the lead terminals. becomes larger, and from the viewpoint of mounting density,
There is a regret that the high degree of integration has not been fully utilized, and from the viewpoint of high-speed operation, the length of wiring inside and outside the integrated circuit device becomes long, which is not desirable.

Under these circumstances, integrated circuit devices have appeared in which a plurality of lead terminals are led out from each of the four sides of a package case.

[C] Prior art and problems Figure 1 (Ml is a perspective view of an example of a conventional integrated circuit device package, Figure 1 (b) is a diagram showing the lead-out configuration of one of the lead terminals, and ■ is a perspective view of an example of a conventional integrated circuit device package. 2 indicates internal wiring, 3 indicates lead terminals, and 4 indicates connection points.

Figure 1(a) shows a typical integrated circuit device pancage in which a plurality of lead terminals are led out from each of the four sides of the case.
Case 1 made of an insulator (e.g. ceramic) as shown in
A plurality of internal wirings 2 inside the case 1 and connected to the integrated circuit elements are arranged on one plane, and a plurality of lead terminals 3 connected to each of them are led out in all directions from the four sides of the case 1. The structure of the connecting portion between the internal wiring 2 and the lead terminal 3 is as shown in FIG. 1 tb+, and 4 is the connecting point.

In the integrated circuit device pancase having this configuration, when the degree of integration of integrated circuit elements increases and the number of lead-out wires increases, it is relatively easy to miniaturize the internal wiring 2, but the lead terminals 3 Since it is led out from the case 1, there is a limit to making it thinner or narrowing the distance between the adjacent lead terminals 3, and if it exceeds this range, the case 1 must be made larger. This has the disadvantage of lowering the actual packaging density.

(dl) OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks of the prior art, it is an object of the present invention to provide a package for an integrated circuit device that makes it possible to increase the number of lead terminals led out from the case without increasing the size of the case.

(e) Structure of the Invention The above object is to combine two lead terminals, which are each independently connected to internal wiring of a case made of an insulator, into a pair and are electrically insulated from each other, This is achieved by the package for an integrated circuit device of the present invention, which is characterized in that it is led out from a single location.

The two lead terminals that are electrically insulated from each other and combined form a single pin shape, and thus correspond in appearance to one lead terminal of a conventional pancage for an integrated circuit device. Packages for circuit devices can have twice the number of lead terminals compared to conventional methods without increasing the size of the case, and can accommodate integrated circuit elements with a larger number of lead terminals due to higher integration. It becomes possible.

ff) Examples of the invention An embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 1al is a perspective view of an example of a pancase for an integrated circuit device according to the structure of the present invention, and FIG.
2b is internal wiring, 3a and 3b are lead terminals, 4a and 4b
5 indicates a connection point, and 5 indicates an insulating layer.

In FIG. 2(a), case 1a is, for example, FIG.
The size is the same as case 1 in case 1, but the internal wiring is narrowed and the two internal wirings 2a and 2b form a pair, and the projection on the wiring surface is similar to that of the conventional internal wiring 2.
It is housed in a space of

FIG. 2(b) shows a configuration in which these internal wirings 2a and 2b are led out to the outside through lead terminals 3a and 3b, respectively. The internal wiring 2a, which is arranged on a flat surface as in the past, and the internal wiring 2b, which is raised and arranged at a high position at the connection part with the lead terminal 3b, form a pair, and each of them has a connection point 4a. Lead terminals 3a and 3b connected by 4b form a pair and combine with an electrically insulating insulating layer 5 in between to form one pin.
It is derived from one part of the case.

Therefore, the lead terminals 3a and 3b are made into a pair, electrically insulated from each other, and combined into a single pin, although their individual thicknesses are thinner than conventional ones, and the width remains the same as before. This structure ensures sufficient lead terminal strength, and the appearance corresponds to one lead terminal of a conventional package for integrated circuit devices, so the pancage for integrated circuit devices with this configuration does not require an increase in the size of the case. In addition, it is possible to lead out twice as many lead terminals as in the past, and it is possible to accommodate integrated circuit elements with a large number of lead-out wires, which is good for high density.

(g) Effects of the Invention As explained above, the structure according to the present invention enables an increase in the number of lead terminals led out from the case without increasing the size of the case for an integrated circuit device. It is possible to provide a package, which has the effect of accommodating an integrated circuit element whose number of lead-out lines has increased due to high integration, and making it possible to improve the packaging density.

[Brief explanation of the drawing]

FIG. 1(a) is a perspective view of an example of a conventional bunkage for an integrated circuit device.
FIG. 2(a) is a perspective view of an example of a pancake for an integrated circuit device according to the structure of the present invention.
Figure (bl is a diagram showing the lead-out configuration of the pair of lead terminals. In the drawing, 1 and 1a are the case, 2, 2a, and 2b are internal wiring, 3, 3a, and 3b are lead terminals, and 4, 4a, and 4b
5 indicates a connection point, and 5 indicates an insulating layer.

Claims (1)

[Claims] It is characterized by two lead terminals that are each independently connected to the internal wiring of a case made of an insulating material, combined into a pair, electrically insulated from each other, and led out from one point of the case. Packages for integrated circuit devices.