JPH0496357A - Semiconductor device and mounting method thereof - Google Patents

Abstract

PURPOSE:To realize high density packaging, by which chips are controlled easily, by forming structure, in which each outer lead terminal makes a round of a sealing structure in the same direction and surrounds the sealing structure, and projecting chip control terminals in the vertical direction. CONSTITUTION:A plurality of outer lead terminals 1 are formed in structure, in which the outer lead terminals 1 make rounds in sealing structures 3, in which semiconductor chips 14 are sealed, in the same direction and surround the sealing structures 3. A chip control terminal 2 is projected from the sealing structure 3 in the vertical direction to the outer lead terminal 1. Consequently, when a package is mounted, a plurality of the packages are bundled and can be mounted. Since the chip control terminal is projected in the vertical direction, a chip control signal is input easily, and the chips are controlled readily when a plurality of the packages are bundled and mounted.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor device such as a package that is easy to control a chip (and occupies a small area on a mounting board) and a method for mounting the same.

BACKGROUND OF THE INVENTION In recent years, mounting density of mounting boards has been increasing.

Hereinafter, the structure of a semiconductor device (hereinafter referred to as a package) including a conventional semiconductor chip, a sealing structure that seals the semiconductor chip, and a plurality of external lead terminals and chip control terminals protruding from the sealing structure. Explain.

FIG. 4(a) is a structural diagram of a conventional package.

In the figure, 11 is an external lead terminal, 12 is a tip control terminal, and 13 is a sealing structure.
The chip control terminals 12 both protrude from the sealing structure 13 in the same direction.

FIG. 4(b) is a sectional view taken along line DD' in FIG. 4(a). In the figure, 14 is a semiconductor chip.

Next, FIG. 5(a) shows a conventional method for mounting the package shown in FIG. 4 on a mounting board. In the figure, 1
5 is a mounting board.

FIG. 5(b) is a sectional view taken along line EE' in FIG. 5(a). That is, conventionally, packages were arranged and mounted on the mounting board 15 in a two-dimensional manner without stacking them.

Problems to be Solved by the Invention In such conventional semiconductor devices and their mounting methods,
Since the package is mounted horizontally on the surface of the mounting board, the area occupied by each package is large.

The present invention solves the above-mentioned conventional problems, and aims to provide a semiconductor device and its mounting method that can reduce the area occupied by one package during packaging and realize high-density packaging.

Means for Solving the Problems In order to achieve the above object, the present invention has the following configuration.

(1) Each external lead terminal has a structure in which each external lead terminal wraps around the sealing structure in the same direction.

(2) The chip control terminal has a structure in which it protrudes perpendicularly to the external lead terminal.

(3) Mount multiple packages by stacking them vertically and horizontally.

(Multiple packages are bundled and mounted perpendicularly to the mounting board.

Effect of the Invention With the above-described configuration, the present invention can establish conduction through contact with each external lead terminal that surrounds the sealing structure in the same direction. It can be installed by leaning against it. Furthermore, when mounted, the chip control terminals protrude perpendicularly to the external lead terminals, which improves work efficiency.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1(a) is a perspective view of an embodiment of the present invention.

In the figure, 1 is an external lead terminal, 2 is a chip control terminal, and 3 is a sealing structure.

FIG. 1(b) is a sectional view taken along line AA' in FIG. 1(a). In the figure, 4 is a semiconductor chip.

This embodiment has a structure in which a plurality of external lead terminals 1 surround a sealing structure 3 in which a semiconductor chip 4 is sealed in one direction. Further, the chip control terminal 2 protrudes from the sealing structure 3 in a direction perpendicular to the external lead terminal 1.

Fig. 2<a) is a perspective view for explaining the method of mounting the embodiment shown in Fig. 1 on a printed wiring board, and Fig. 2(b) is a line BB' in Fig. 2(a). FIG.

In the figure, 5 is a mounting board, and 6 is a wiring on the mounting board 5, which is connected to the wiring 6 on each external lead terminal surrounding the sealing structure 3 with packages stacked vertically and horizontally.

3(a) is a perspective view for explaining another method of mounting the package of FIG. 1 on a mounting board, and FIG. 3(b) is a perspective view taken along line c-c' in FIG. 3(a). FIG.

That is, a plurality of packages are brought into contact with opposing external lead terminals and mounted vertically against the mounting board 5.

As described above, according to this embodiment, each external lead terminal is
By making the sealing structure go around in the same direction,
When mounting packages, multiple packages can be bundled together and the chip control terminals protrude perpendicularly to the external lead terminals of the sealing structure, making it easy to input chip control signals. When mounted individually, chip control becomes easier.

By stacking and mounting as described above, the area per package is reduced, and high-density packaging can be realized with easy chip control. In addition, in FIG. 2 of this embodiment, the case where three semiconductor devices are lined up is described, but there is no need to particularly limit the number as long as there is a plurality of semiconductor devices. Similarly, in the case of FIG. 3, there is no need to limit the number to two.

Effects of the Invention As is clear from the following description, according to the present invention, by forming a structure in which each external lead terminal surrounds the sealing structure in the same direction, the semiconductor device can be mounted easily. Multiple pieces can be bundled together and mounted, and the chip control terminals protrude perpendicularly to the external lead terminals of the encapsulation structure, making it easy to input chip control signals and reducing the area occupied by each semiconductor device. It is possible to provide a semiconductor device and its mounting method that can realize high-density packaging that is easy to perform.

[Brief explanation of the drawing]

FIG. 1(a) is a perspective view of one embodiment of the present invention, and FIG. 1(b) is a perspective view of an embodiment of the present invention.
) is a sectional view taken along line A-A' in FIG. 1(a),
Fig. 2(a) is a perspective view for explaining the method of mounting the embodiment shown in Fig. 1 on a printed wiring board, and Fig. 2(b) is a line BB' in Fig. 2(a). 3rd cross-sectional view along
Figure (a) is a perspective view for explaining another method of mounting the package shown in Figure 1 on a mounting board, and Figure 3 (b) is a cross section taken along line c-c' in Figure 3 (a). Figure 4 (a
) is a perspective view of a conventional package, FIG. 4(b) is a sectional view taken along line DD' in FIG. 4(a), and FIG.
) is a perspective view for explaining the conventional method of mounting the package shown in FIG. 4 on a mounting board, and FIG.
) is a sectional view taken along the line E-E°. 1...External lead terminal,...Sealing structure, 4.Old...Semiconductor chip.

Claims (4)

[Claims] (1) A semiconductor chip, a sealing structure that seals the semiconductor chip, a plurality of external lead terminals protruding from the sealing structure, and a chip control terminal, wherein the plurality of external lead terminals are connected to the sealing structure. A semiconductor device that has a structure in which a stop structure is encircled in the same direction. (2) The semiconductor device according to claim 1, wherein the chip control terminal extends perpendicularly to the external lead terminal. (3) a semiconductor chip, a sealing structure that seals the semiconductor chip, a plurality of external lead terminals surrounding the sealing structure in the same direction, and a plurality of external lead terminals that surround the sealing structure in a direction perpendicular to the external lead terminals; A semiconductor device mounting method in which a plurality of semiconductor devices having chip control terminals protruding from a sealing structure are stacked vertically and horizontally. (4) a semiconductor chip, a sealing structure that seals the semiconductor chip, a plurality of external lead terminals surrounding the sealing structure in the same direction, and a direction perpendicular to the external lead terminals; A method for mounting a semiconductor device, in which a plurality of semiconductor devices having chip control terminals protruding from the sealing structure are vertically mounted on a mounting substrate with the opposing external lead terminals in contact with each other.