JPS58101429A - ドライエツチング方法 - Google Patents
ドライエツチング方法Info
- Publication number
- JPS58101429A JPS58101429A JP56200315A JP20031581A JPS58101429A JP S58101429 A JPS58101429 A JP S58101429A JP 56200315 A JP56200315 A JP 56200315A JP 20031581 A JP20031581 A JP 20031581A JP S58101429 A JPS58101429 A JP S58101429A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- gas
- dry etching
- atoms
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P50/246—
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56200315A JPS58101429A (ja) | 1981-12-12 | 1981-12-12 | ドライエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56200315A JPS58101429A (ja) | 1981-12-12 | 1981-12-12 | ドライエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58101429A true JPS58101429A (ja) | 1983-06-16 |
| JPH03769B2 JPH03769B2 (cg-RX-API-DMAC10.html) | 1991-01-08 |
Family
ID=16422259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56200315A Granted JPS58101429A (ja) | 1981-12-12 | 1981-12-12 | ドライエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58101429A (cg-RX-API-DMAC10.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288429A (ja) * | 1985-06-16 | 1986-12-18 | Nec Corp | ガリウムヒ素結晶の気相エツチング方法 |
| JPH02267936A (ja) * | 1989-04-07 | 1990-11-01 | Seiko Epson Corp | 化合物半導体のエッチング方法 |
| JPH02267938A (ja) * | 1989-04-07 | 1990-11-01 | Seiko Epson Corp | 化合物半導体のエッチング方法 |
| JPH02283018A (ja) * | 1989-01-31 | 1990-11-20 | Matsushita Electric Ind Co Ltd | 半導体基体の処理方法及び半導体の製造方法 |
| US5133830A (en) * | 1989-04-07 | 1992-07-28 | Seiko Epson Corporation | Method of pretreatment and anisotropic dry etching of thin film semiconductors |
| US5194119A (en) * | 1989-05-15 | 1993-03-16 | Seiko Epson Corporation | Method of anisotropic dry etching of thin film semiconductors |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856598A (cg-RX-API-DMAC10.html) * | 1971-11-22 | 1973-08-08 | ||
| JPS5515290A (en) * | 1978-07-20 | 1980-02-02 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device |
-
1981
- 1981-12-12 JP JP56200315A patent/JPS58101429A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4856598A (cg-RX-API-DMAC10.html) * | 1971-11-22 | 1973-08-08 | ||
| JPS5515290A (en) * | 1978-07-20 | 1980-02-02 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288429A (ja) * | 1985-06-16 | 1986-12-18 | Nec Corp | ガリウムヒ素結晶の気相エツチング方法 |
| JPH02283018A (ja) * | 1989-01-31 | 1990-11-20 | Matsushita Electric Ind Co Ltd | 半導体基体の処理方法及び半導体の製造方法 |
| JPH02267936A (ja) * | 1989-04-07 | 1990-11-01 | Seiko Epson Corp | 化合物半導体のエッチング方法 |
| JPH02267938A (ja) * | 1989-04-07 | 1990-11-01 | Seiko Epson Corp | 化合物半導体のエッチング方法 |
| US5133830A (en) * | 1989-04-07 | 1992-07-28 | Seiko Epson Corporation | Method of pretreatment and anisotropic dry etching of thin film semiconductors |
| US5194119A (en) * | 1989-05-15 | 1993-03-16 | Seiko Epson Corporation | Method of anisotropic dry etching of thin film semiconductors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03769B2 (cg-RX-API-DMAC10.html) | 1991-01-08 |
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