JPS5797970U - - Google Patents

Info

Publication number
JPS5797970U
JPS5797970U JP1980175739U JP17573980U JPS5797970U JP S5797970 U JPS5797970 U JP S5797970U JP 1980175739 U JP1980175739 U JP 1980175739U JP 17573980 U JP17573980 U JP 17573980U JP S5797970 U JPS5797970 U JP S5797970U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980175739U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980175739U priority Critical patent/JPS5797970U/ja
Priority to EP19810903226 priority patent/EP0067231A4/en
Priority to KR2019810008286U priority patent/KR880000673Y1/ko
Priority to DE19813152603 priority patent/DE3152603T/de
Priority to US06/670,912 priority patent/US4528064A/en
Priority to GB08222523A priority patent/GB2104297B/en
Priority to PCT/JP1981/000371 priority patent/WO1982002138A1/ja
Priority to NL8120453A priority patent/NL8120453A/nl
Publication of JPS5797970U publication Critical patent/JPS5797970U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP1980175739U 1980-12-08 1980-12-08 Pending JPS5797970U (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP1980175739U JPS5797970U (ja) 1980-12-08 1980-12-08
EP19810903226 EP0067231A4 (en) 1980-12-08 1981-12-08 SUBSTRATE WITH MULTILAYER WIRING.
KR2019810008286U KR880000673Y1 (ko) 1980-12-08 1981-12-08 다층 배선 기판
DE19813152603 DE3152603T (de) 1980-12-08 1981-12-08 Mehrschicht-Leiterplatte
US06/670,912 US4528064A (en) 1980-12-08 1981-12-08 Method of making multilayer circuit board
GB08222523A GB2104297B (en) 1980-12-08 1981-12-08 Multilayer wiring substrate
PCT/JP1981/000371 WO1982002138A1 (en) 1980-12-08 1981-12-08 Multilayer wiring substrate
NL8120453A NL8120453A (nl) 1980-12-08 1981-12-08 Plaat met meerlaagse bedrading.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980175739U JPS5797970U (ja) 1980-12-08 1980-12-08

Publications (1)

Publication Number Publication Date
JPS5797970U true JPS5797970U (ja) 1982-06-16

Family

ID=16001397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980175739U Pending JPS5797970U (ja) 1980-12-08 1980-12-08

Country Status (8)

Country Link
US (1) US4528064A (ja)
EP (1) EP0067231A4 (ja)
JP (1) JPS5797970U (ja)
KR (1) KR880000673Y1 (ja)
DE (1) DE3152603T (ja)
GB (1) GB2104297B (ja)
NL (1) NL8120453A (ja)
WO (1) WO1982002138A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021599A (ja) * 1983-07-15 1985-02-02 松下電工株式会社 多層配線基板の製造方法
JPS6021598A (ja) * 1983-07-15 1985-02-02 松下電工株式会社 多層配線基板の製造方法
JPS6223198A (ja) * 1985-07-23 1987-01-31 ダイソー株式会社 多層配線板の製法
WO2000001209A1 (fr) * 1998-06-26 2000-01-06 Ibiden Co., Ltd. Carte imprimee multicouche et son procede de production

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US4658332A (en) * 1983-04-04 1987-04-14 Raytheon Company Compliant layer printed circuit board
GB2150360B (en) * 1983-11-21 1987-08-12 Casio Computer Co Ltd A method of manufacturing a small electronic device
US4554229A (en) * 1984-04-06 1985-11-19 At&T Technologies, Inc. Multilayer hybrid integrated circuit
DE3434672C2 (de) * 1984-09-21 1986-09-11 Fa. Carl Freudenberg, 6940 Weinheim Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung
US4651417A (en) * 1984-10-23 1987-03-24 New West Technology Corporation Method for forming printed circuit board
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
JPS62265796A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス セラミツク多層配線基板およびその製造法
KR900007231B1 (ko) * 1986-09-16 1990-10-05 가부시키가이샤 도시바 반도체집적회로장치
DE3735959A1 (de) * 1987-10-23 1989-05-03 Bbc Brown Boveri & Cie Mehrlagige duennschichtschaltung sowie verfahren zu deren herstellung
US4967314A (en) * 1988-03-28 1990-10-30 Prime Computer Inc. Circuit board construction
US4933045A (en) * 1989-06-02 1990-06-12 International Business Machines Corporation Thin film multilayer laminate interconnection board assembly method
JPH0377393A (ja) * 1989-08-21 1991-04-02 Ok Print:Kk 配線基板装置
JPH045844A (ja) * 1990-04-23 1992-01-09 Nippon Mektron Ltd Ｉｃ搭載用多層回路基板及びその製造法
US5195238A (en) * 1990-07-20 1993-03-23 Nippon Cmk Corp. Method of manufacturing a printed circuit board
US5194933A (en) * 1990-10-05 1993-03-16 Fuji Electric Co., Ltd. Semiconductor device using insulation coated metal substrate
AT398876B (de) * 1991-10-31 1995-02-27 Philips Nv Zwei- oder mehrlagige leiterplatte
DE4135839A1 (de) * 1991-10-31 1993-05-06 Huels Troisdorf Ag, 5210 Troisdorf, De Verfahren zur herstellung einer mehrlagigen gedruckten schaltung sowie mehrlagige gedruckte schaltung
AT398877B (de) * 1991-10-31 1995-02-27 Philips Nv Zwei- oder mehrlagige leiterplatte, verfahren zum herstellen einer solchen leiterplatte und laminat für die herstellung einer solchen leiterplatte nach einem solchen verfahren
JPH05327192A (ja) * 1992-05-15 1993-12-10 Cmk Corp フレキシブルプリント配線板の製造方法
US5670750A (en) * 1995-04-27 1997-09-23 International Business Machines Corporation Electric circuit card having a donut shaped land
US5806177A (en) * 1995-10-31 1998-09-15 Sumitomo Bakelite Company Limited Process for producing multilayer printed circuit board
US6162365A (en) * 1998-03-04 2000-12-19 International Business Machines Corporation Pd etch mask for copper circuitization
JP2000100985A (ja) * 1998-09-17 2000-04-07 Nitto Denko Corp 半導体素子実装用基板およびその製造方法と用途
US20020139668A1 (en) * 1999-11-03 2002-10-03 Raghbir Singh Bhullar Embedded metallic deposits
US6664482B1 (en) * 2000-05-01 2003-12-16 Hewlett-Packard Development Company, L.P. Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges
US6740246B2 (en) * 2000-05-26 2004-05-25 Visteon Global Tech., Inc. Circuit board and a method for making the same
JP3760731B2 (ja) * 2000-07-11 2006-03-29 ソニーケミカル株式会社 バンプ付き配線回路基板及びその製造方法
US6841263B2 (en) * 2002-05-03 2005-01-11 The John Hopkins University Method of adhering a solid polymer to a substrate and resulting article
US7140531B2 (en) * 2003-09-03 2006-11-28 Hewlett-Packard Development Company, L.P. Method of fabricating a substantially zero signal degradation electrical connection on a printed circuit broad
US7377032B2 (en) * 2003-11-21 2008-05-27 Mitsui Mining & Smelting Co., Ltd. Process for producing a printed wiring board for mounting electronic components
JP4467300B2 (ja) * 2003-12-26 2010-05-26 株式会社日立製作所 配線基板
US20080029298A1 (en) * 2006-08-07 2008-02-07 Roger Allen Booth Method and Structures for Implementing EMI Shielding for Rigid Cards and Flexible Circuits
US8238114B2 (en) * 2007-09-20 2012-08-07 Ibiden Co., Ltd. Printed wiring board and method for manufacturing same
US8649183B2 (en) * 2011-02-10 2014-02-11 Mulpin Research Laboratories, Ltd. Electronic assembly
CN103298247A (zh) * 2012-02-24 2013-09-11 宏恒胜电子科技（淮安）有限公司 电路板及其制作方法
JP6027372B2 (ja) * 2012-08-29 2016-11-16 住友電工プリントサーキット株式会社 両面プリント配線板及びその製造方法
KR101753225B1 (ko) * 2015-06-02 2017-07-19 에더트로닉스코리아 (주) Ｌｄｓ 공법을 이용한 적층 회로 제작 방법
DE102015212692B3 (de) * 2015-07-07 2016-11-10 Osram Gmbh Verbundbauteil und Verfahren zum Herstellen eines Verbundbauteils
CN109548322A (zh) * 2017-09-21 2019-03-29 鹤山市得润电子科技有限公司 一种多层软性电路板的制造方法及生产设备
CN108401383A (zh) * 2018-02-07 2018-08-14 广州兴森快捷电路科技有限公司 刚挠结合板的制作方法及其刚挠结合板
JP2023043862A (ja) * 2021-09-16 2023-03-29 方略電子股▲ふん▼有限公司 電子装置

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US2447541A (en) * 1945-01-29 1948-08-24 Sabee Method of making plastic structure
US3311966A (en) * 1962-09-24 1967-04-04 North American Aviation Inc Method of fabricating multilayer printed-wiring boards
US3374129A (en) * 1963-05-02 1968-03-19 Sanders Associates Inc Method of producing printed circuits
JPS5144871B2 (ja) * 1971-09-25 1976-12-01
JPS51660A (ja) * 1974-06-21 1976-01-06 Tokyo Shibaura Electric Co Tasopurintohaisenbannoseizohoho
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board
US4420364A (en) * 1976-11-02 1983-12-13 Sharp Kabushiki Kaisha High-insulation multi-layer device formed on a metal substrate
DE2716545A1 (de) * 1977-04-14 1978-10-19 Siemens Ag Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen
DE2739494B2 (de) * 1977-08-30 1980-10-16 Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen Verfahren zum Herstellen elektrischer Leiterplatten
US4383363A (en) * 1977-09-01 1983-05-17 Sharp Kabushiki Kaisha Method of making a through-hole connector
JPS5515240A (en) * 1978-07-18 1980-02-02 Matsushita Electric Ind Co Ltd Method of connecting printed circuit board
US4388136A (en) * 1980-09-26 1983-06-14 Sperry Corporation Method of making a polyimide/glass hybrid printed circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021599A (ja) * 1983-07-15 1985-02-02 松下電工株式会社 多層配線基板の製造方法
JPS6021598A (ja) * 1983-07-15 1985-02-02 松下電工株式会社 多層配線基板の製造方法
JPS6223198A (ja) * 1985-07-23 1987-01-31 ダイソー株式会社 多層配線板の製法
WO2000001209A1 (fr) * 1998-06-26 2000-01-06 Ibiden Co., Ltd. Carte imprimee multicouche et son procede de production

Also Published As

Publication number Publication date
DE3152603T (de) 1983-02-10
WO1982002138A1 (en) 1982-06-24
EP0067231A1 (en) 1982-12-22
NL8120453A (nl) 1982-11-01
KR880000673Y1 (ko) 1988-03-14
GB2104297A (en) 1983-03-02
GB2104297B (en) 1985-07-24
EP0067231A4 (en) 1985-02-28
US4528064A (en) 1985-07-09
KR830002498U (ko) 1983-11-21

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