JPS5793533A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5793533A
JPS5793533A JP17042180A JP17042180A JPS5793533A JP S5793533 A JPS5793533 A JP S5793533A JP 17042180 A JP17042180 A JP 17042180A JP 17042180 A JP17042180 A JP 17042180A JP S5793533 A JPS5793533 A JP S5793533A
Authority
JP
Japan
Prior art keywords
burr
lead
resin
block
root
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17042180A
Other languages
Japanese (ja)
Inventor
Yasuo Seki
Shoji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17042180A priority Critical patent/JPS5793533A/en
Publication of JPS5793533A publication Critical patent/JPS5793533A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To simply remove a resin burr projected at the root of a lead led externally from a resin block by spraying high temperature steam to the burr. CONSTITUTION:A resin burr 4 is produced at the root of each lead 3 of a lead frame 2 projected from the side face of a sealing resin block 1, and high temperature steam being higher than 190 deg.C is sprayed from a nozzle 5 toward the burr 4, thereby embrittling and spraying out the burr 4. In this manner, the burr can be readily removed without damaging the lead 3 and the block 1.
JP17042180A 1980-12-03 1980-12-03 Manufacture of semiconductor device Pending JPS5793533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17042180A JPS5793533A (en) 1980-12-03 1980-12-03 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17042180A JPS5793533A (en) 1980-12-03 1980-12-03 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5793533A true JPS5793533A (en) 1982-06-10

Family

ID=15904604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17042180A Pending JPS5793533A (en) 1980-12-03 1980-12-03 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5793533A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168508A (en) * 2016-03-14 2017-09-21 富士電機株式会社 Removal method and manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168508A (en) * 2016-03-14 2017-09-21 富士電機株式会社 Removal method and manufacturing method

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