JPS57156155A - Grinding method - Google Patents

Grinding method

Info

Publication number
JPS57156155A
JPS57156155A JP3769981A JP3769981A JPS57156155A JP S57156155 A JPS57156155 A JP S57156155A JP 3769981 A JP3769981 A JP 3769981A JP 3769981 A JP3769981 A JP 3769981A JP S57156155 A JPS57156155 A JP S57156155A
Authority
JP
Japan
Prior art keywords
work
wire
hole
coated
grinding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3769981A
Other languages
Japanese (ja)
Inventor
Takashi Miyatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3769981A priority Critical patent/JPS57156155A/en
Publication of JPS57156155A publication Critical patent/JPS57156155A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/36—Single-purpose machines or devices
    • B24B5/48—Single-purpose machines or devices for grinding walls of very fine holes, e.g. in drawing-dies
    • B24B5/485—Single-purpose machines or devices for grinding walls of very fine holes, e.g. in drawing-dies using grinding wires or ropes

Abstract

PURPOSE:To remove the bulges around the through holes in a work coated with a layer of sprayed metal by passing a wire with a grinding material through the through hole and moving the wire in relation to the work. CONSTITUTION:After a coated layer 3 has been formed on a work 2 having through holes 1, a wire 7 with a grinding material is passed through a through hole 1 and moved in relation to the work so that the bulges 5 of the coated material formed on the inside circumference of the through hole 1 are removed by the grinding material.
JP3769981A 1981-03-16 1981-03-16 Grinding method Pending JPS57156155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3769981A JPS57156155A (en) 1981-03-16 1981-03-16 Grinding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3769981A JPS57156155A (en) 1981-03-16 1981-03-16 Grinding method

Publications (1)

Publication Number Publication Date
JPS57156155A true JPS57156155A (en) 1982-09-27

Family

ID=12504780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3769981A Pending JPS57156155A (en) 1981-03-16 1981-03-16 Grinding method

Country Status (1)

Country Link
JP (1) JPS57156155A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010135063A1 (en) * 2009-05-20 2010-11-25 Gentex Optics, Inc. Rimless spectacle lens bore polishing method and apparatus
WO2013023309A1 (en) * 2011-08-16 2013-02-21 Soutec Ag Method for removing a coating by means of a carrier material, and use of the method
CN106312739A (en) * 2016-11-01 2017-01-11 天津恒瑜晶体材料股份有限公司 Quartz capillary center hole fillet machining equipment
CN106392875A (en) * 2016-11-01 2017-02-15 天津恒瑜晶体材料股份有限公司 Linear carrier stretching mechanism for quartz capillary tube center hole round corner machining equipment
CN106475892A (en) * 2016-11-01 2017-03-08 天津恒瑜晶体材料股份有限公司 Using linear carrier machining of non-metallic inorganic capillary tube centre bore fillet process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010135063A1 (en) * 2009-05-20 2010-11-25 Gentex Optics, Inc. Rimless spectacle lens bore polishing method and apparatus
CN102574258A (en) * 2009-05-20 2012-07-11 金特克斯光学公司 Rimless spectacle lens bore polishing method and apparatus
WO2013023309A1 (en) * 2011-08-16 2013-02-21 Soutec Ag Method for removing a coating by means of a carrier material, and use of the method
CN106312739A (en) * 2016-11-01 2017-01-11 天津恒瑜晶体材料股份有限公司 Quartz capillary center hole fillet machining equipment
CN106392875A (en) * 2016-11-01 2017-02-15 天津恒瑜晶体材料股份有限公司 Linear carrier stretching mechanism for quartz capillary tube center hole round corner machining equipment
CN106475892A (en) * 2016-11-01 2017-03-08 天津恒瑜晶体材料股份有限公司 Using linear carrier machining of non-metallic inorganic capillary tube centre bore fillet process

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