JPS54162965A - Resin sealing metal mold for semiconductor device - Google Patents
Resin sealing metal mold for semiconductor deviceInfo
- Publication number
- JPS54162965A JPS54162965A JP7254078A JP7254078A JPS54162965A JP S54162965 A JPS54162965 A JP S54162965A JP 7254078 A JP7254078 A JP 7254078A JP 7254078 A JP7254078 A JP 7254078A JP S54162965 A JPS54162965 A JP S54162965A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- metal mold
- runner
- resin sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To increase both the resin and injection efficiency and thus to enhance the working efficiency as well as the product quality by introducing the sealing resin to the cavity part via the runner and pot parts and then forming the film of the heat-resistance resin or the like on the surfaces of both the runner and pot parts.
CONSTITUTION: For die 1 of the metal mold, the semiconductor device is resin- sealed actually via cavity part 2 and the sealing resin is introduced to part 2 via runner part 3 and pot part 4. Then the film of the heat-resistant resin or the like is formed on the surfaces of part 3 and 4. As a result, the flow conditions can be made uniform for the sealing resin, and thus enhancing both the resin and injection efficiency, and furthermore increasing the working efficiency and the product quality.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7254078A JPS54162965A (en) | 1978-06-14 | 1978-06-14 | Resin sealing metal mold for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7254078A JPS54162965A (en) | 1978-06-14 | 1978-06-14 | Resin sealing metal mold for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54162965A true JPS54162965A (en) | 1979-12-25 |
Family
ID=13492279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7254078A Pending JPS54162965A (en) | 1978-06-14 | 1978-06-14 | Resin sealing metal mold for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54162965A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0653829U (en) * | 1992-12-26 | 1994-07-22 | 自動車部品工業株式会社 | Wet clutch drag prevention device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52115859A (en) * | 1976-03-25 | 1977-09-28 | Tokai Rika Co Ltd | Metal molds for molding resins |
-
1978
- 1978-06-14 JP JP7254078A patent/JPS54162965A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52115859A (en) * | 1976-03-25 | 1977-09-28 | Tokai Rika Co Ltd | Metal molds for molding resins |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0653829U (en) * | 1992-12-26 | 1994-07-22 | 自動車部品工業株式会社 | Wet clutch drag prevention device |
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