JPS54162965A - Resin sealing metal mold for semiconductor device - Google Patents

Resin sealing metal mold for semiconductor device

Info

Publication number
JPS54162965A
JPS54162965A JP7254078A JP7254078A JPS54162965A JP S54162965 A JPS54162965 A JP S54162965A JP 7254078 A JP7254078 A JP 7254078A JP 7254078 A JP7254078 A JP 7254078A JP S54162965 A JPS54162965 A JP S54162965A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
metal mold
runner
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7254078A
Other languages
Japanese (ja)
Inventor
Osamu Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7254078A priority Critical patent/JPS54162965A/en
Publication of JPS54162965A publication Critical patent/JPS54162965A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To increase both the resin and injection efficiency and thus to enhance the working efficiency as well as the product quality by introducing the sealing resin to the cavity part via the runner and pot parts and then forming the film of the heat-resistance resin or the like on the surfaces of both the runner and pot parts.
CONSTITUTION: For die 1 of the metal mold, the semiconductor device is resin- sealed actually via cavity part 2 and the sealing resin is introduced to part 2 via runner part 3 and pot part 4. Then the film of the heat-resistant resin or the like is formed on the surfaces of part 3 and 4. As a result, the flow conditions can be made uniform for the sealing resin, and thus enhancing both the resin and injection efficiency, and furthermore increasing the working efficiency and the product quality.
COPYRIGHT: (C)1979,JPO&Japio
JP7254078A 1978-06-14 1978-06-14 Resin sealing metal mold for semiconductor device Pending JPS54162965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7254078A JPS54162965A (en) 1978-06-14 1978-06-14 Resin sealing metal mold for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7254078A JPS54162965A (en) 1978-06-14 1978-06-14 Resin sealing metal mold for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54162965A true JPS54162965A (en) 1979-12-25

Family

ID=13492279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7254078A Pending JPS54162965A (en) 1978-06-14 1978-06-14 Resin sealing metal mold for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54162965A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653829U (en) * 1992-12-26 1994-07-22 自動車部品工業株式会社 Wet clutch drag prevention device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52115859A (en) * 1976-03-25 1977-09-28 Tokai Rika Co Ltd Metal molds for molding resins

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52115859A (en) * 1976-03-25 1977-09-28 Tokai Rika Co Ltd Metal molds for molding resins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653829U (en) * 1992-12-26 1994-07-22 自動車部品工業株式会社 Wet clutch drag prevention device

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