JPS5588340A - Trimming method for resin-sealed electronic parts - Google Patents

Trimming method for resin-sealed electronic parts

Info

Publication number
JPS5588340A
JPS5588340A JP15987178A JP15987178A JPS5588340A JP S5588340 A JPS5588340 A JP S5588340A JP 15987178 A JP15987178 A JP 15987178A JP 15987178 A JP15987178 A JP 15987178A JP S5588340 A JPS5588340 A JP S5588340A
Authority
JP
Japan
Prior art keywords
nozzle
resin
burr
seal member
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15987178A
Other languages
Japanese (ja)
Inventor
Masuzo Ikumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15987178A priority Critical patent/JPS5588340A/en
Publication of JPS5588340A publication Critical patent/JPS5588340A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

PURPOSE: To keep a lead strip from breaking due to oscillations and thus to realize high-speed operation and automation by ejecting a high pressure fluid onto a product to treat an article fixed by a nozzle skirt 6 on the tip of a nozzle, which is shaped to correspond to the shape of a burr on the product to be treated.
CONSTITUTION: An electronic part 1 consisting of a lead strip 12 and a resin seal member 11 is fixed by a lead wire 12 between a nozzle 5 with its end 51 nearly similar but larger than the principal surface 111 of the resin seal member 11 and a nozzle skirt 6 arranged to move vertically as indicated by arrow B. Both principal surfaces 111, 112 of the electronic part 1 are arranged thereon with the same- shaped flow forming members 7, 8. A high-pressure mixed jet air current (that for which walnut powder is mixed in the air) 9 is circulated through the nozzle 5, and a burr is removed by the jet air current 9 applied selectively thereto.
COPYRIGHT: (C)1980,JPO&Japio
JP15987178A 1978-12-27 1978-12-27 Trimming method for resin-sealed electronic parts Pending JPS5588340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15987178A JPS5588340A (en) 1978-12-27 1978-12-27 Trimming method for resin-sealed electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15987178A JPS5588340A (en) 1978-12-27 1978-12-27 Trimming method for resin-sealed electronic parts

Publications (1)

Publication Number Publication Date
JPS5588340A true JPS5588340A (en) 1980-07-04

Family

ID=15703020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15987178A Pending JPS5588340A (en) 1978-12-27 1978-12-27 Trimming method for resin-sealed electronic parts

Country Status (1)

Country Link
JP (1) JPS5588340A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152028A (en) * 1984-12-26 1986-07-10 Hitachi Ltd Resin burr remover

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61152028A (en) * 1984-12-26 1986-07-10 Hitachi Ltd Resin burr remover
JPH0376780B2 (en) * 1984-12-26 1991-12-06 Hitachi Seisakusho Kk

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