JPS5588340A - Trimming method for resin-sealed electronic parts - Google Patents
Trimming method for resin-sealed electronic partsInfo
- Publication number
- JPS5588340A JPS5588340A JP15987178A JP15987178A JPS5588340A JP S5588340 A JPS5588340 A JP S5588340A JP 15987178 A JP15987178 A JP 15987178A JP 15987178 A JP15987178 A JP 15987178A JP S5588340 A JPS5588340 A JP S5588340A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- resin
- burr
- seal member
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
PURPOSE: To keep a lead strip from breaking due to oscillations and thus to realize high-speed operation and automation by ejecting a high pressure fluid onto a product to treat an article fixed by a nozzle skirt 6 on the tip of a nozzle, which is shaped to correspond to the shape of a burr on the product to be treated.
CONSTITUTION: An electronic part 1 consisting of a lead strip 12 and a resin seal member 11 is fixed by a lead wire 12 between a nozzle 5 with its end 51 nearly similar but larger than the principal surface 111 of the resin seal member 11 and a nozzle skirt 6 arranged to move vertically as indicated by arrow B. Both principal surfaces 111, 112 of the electronic part 1 are arranged thereon with the same- shaped flow forming members 7, 8. A high-pressure mixed jet air current (that for which walnut powder is mixed in the air) 9 is circulated through the nozzle 5, and a burr is removed by the jet air current 9 applied selectively thereto.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15987178A JPS5588340A (en) | 1978-12-27 | 1978-12-27 | Trimming method for resin-sealed electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15987178A JPS5588340A (en) | 1978-12-27 | 1978-12-27 | Trimming method for resin-sealed electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5588340A true JPS5588340A (en) | 1980-07-04 |
Family
ID=15703020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15987178A Pending JPS5588340A (en) | 1978-12-27 | 1978-12-27 | Trimming method for resin-sealed electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5588340A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152028A (en) * | 1984-12-26 | 1986-07-10 | Hitachi Ltd | Resin burr remover |
-
1978
- 1978-12-27 JP JP15987178A patent/JPS5588340A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61152028A (en) * | 1984-12-26 | 1986-07-10 | Hitachi Ltd | Resin burr remover |
JPH0376780B2 (en) * | 1984-12-26 | 1991-12-06 | Hitachi Seisakusho Kk |
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