JPS6467346A - Marking method and apparatus - Google Patents

Marking method and apparatus

Info

Publication number
JPS6467346A
JPS6467346A JP62223911A JP22391187A JPS6467346A JP S6467346 A JPS6467346 A JP S6467346A JP 62223911 A JP62223911 A JP 62223911A JP 22391187 A JP22391187 A JP 22391187A JP S6467346 A JPS6467346 A JP S6467346A
Authority
JP
Japan
Prior art keywords
mask
marking
high speed
polishing agent
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62223911A
Other languages
Japanese (ja)
Inventor
Chiharu Tsuchiko
Kazunao Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62223911A priority Critical patent/JPS6467346A/en
Publication of JPS6467346A publication Critical patent/JPS6467346A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dot-Matrix Printers And Others (AREA)

Abstract

PURPOSE:To reduce marking cost, by injecting particles to the surface of an article to be marked partially at a high speed to provide a desired mark. CONSTITUTION:A mask 5 is arranged to the surface of the package 2 of a semiconductor device 1, that is, the marking surface 4 thereof so as to cover said marking surface 4 and a particle, for example, a polishing agent 7 is sprayed to the surface of the mask 5 at a high speed from the nozzle 6 of the jet mechanism arranged above the mask 5. Transmitting patterns 8 permitting the passage of the polishing agent 7 are preliminarily provided to the mask 5. Therefore, a part of the polishing agent 7 injected at a high speed passes through the transmitting patterns 8 of the mask 5 to violently collide with the marking surface and, therefore, the surface part of the package 2 is abraded to appear as shallow cavities.
JP62223911A 1987-09-09 1987-09-09 Marking method and apparatus Pending JPS6467346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62223911A JPS6467346A (en) 1987-09-09 1987-09-09 Marking method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62223911A JPS6467346A (en) 1987-09-09 1987-09-09 Marking method and apparatus

Publications (1)

Publication Number Publication Date
JPS6467346A true JPS6467346A (en) 1989-03-14

Family

ID=16805641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62223911A Pending JPS6467346A (en) 1987-09-09 1987-09-09 Marking method and apparatus

Country Status (1)

Country Link
JP (1) JPS6467346A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602430B1 (en) * 2000-08-18 2003-08-05 Micron Technology, Inc. Methods for finishing microelectronic device packages
CN104802531A (en) * 2015-04-16 2015-07-29 苏州盛达织带有限公司 Novel braid marking machine with polishing function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602430B1 (en) * 2000-08-18 2003-08-05 Micron Technology, Inc. Methods for finishing microelectronic device packages
CN104802531A (en) * 2015-04-16 2015-07-29 苏州盛达织带有限公司 Novel braid marking machine with polishing function

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