JPS5650587A - Manufacture of light emitting diode - Google Patents

Manufacture of light emitting diode

Info

Publication number
JPS5650587A
JPS5650587A JP12760679A JP12760679A JPS5650587A JP S5650587 A JPS5650587 A JP S5650587A JP 12760679 A JP12760679 A JP 12760679A JP 12760679 A JP12760679 A JP 12760679A JP S5650587 A JPS5650587 A JP S5650587A
Authority
JP
Japan
Prior art keywords
resin
manufacture
spherical shape
bonding surface
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12760679A
Other languages
Japanese (ja)
Inventor
Hideo Sakamoto
Akinori Numata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12760679A priority Critical patent/JPS5650587A/en
Publication of JPS5650587A publication Critical patent/JPS5650587A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00019—Production of simple or compound lenses with non-spherical faces, e.g. toric faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To manufacture resin sealing of spherical shape at the end in mass production by supplying resin from downward direction with the bonding surface thereof placed upside down. CONSTITUTION:A stem 1 is so fixed that the bonding surface is disposed at down side, and resin is supplied from down side toward the bonding surface using a quantitatively exhausting device 5. As the amount of resin supplied is increased, a nozzle lowers so that the resin may become spherical shape, and the resin is thus cured. Thus, resin seal of spherical shape having large lens effect can be manufactured in mass production with small radius of curvature.
JP12760679A 1979-10-02 1979-10-02 Manufacture of light emitting diode Pending JPS5650587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12760679A JPS5650587A (en) 1979-10-02 1979-10-02 Manufacture of light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12760679A JPS5650587A (en) 1979-10-02 1979-10-02 Manufacture of light emitting diode

Publications (1)

Publication Number Publication Date
JPS5650587A true JPS5650587A (en) 1981-05-07

Family

ID=14964239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12760679A Pending JPS5650587A (en) 1979-10-02 1979-10-02 Manufacture of light emitting diode

Country Status (1)

Country Link
JP (1) JPS5650587A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19631736A1 (en) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Method and device for manufacturing lenses of micro-optical systems and light transmitter / light receiver system
JP2008288410A (en) * 2007-05-18 2008-11-27 Toshiba Corp Semiconductor light-emitting device, and manufacturing method thereof
JP2008288409A (en) * 2007-05-18 2008-11-27 Toshiba Corp Light-emitting device, and manufacturing method thereof
WO2016180816A1 (en) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Method for producing a lens for an optoelectronic lighting device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19631736A1 (en) * 1996-08-06 1998-02-12 Stm Sensor Technologie Muenche Method and device for manufacturing lenses of micro-optical systems and light transmitter / light receiver system
EP0827214A1 (en) * 1996-08-06 1998-03-04 STM Sensor Technologie München GmbH Procedure and apparatus used to manufacture lenses of micro-optical systems and light transmitter/receiver systems
US5945041A (en) * 1996-08-06 1999-08-31 Stm Sensor Technologie Munchen Gmbh Method and device for producing lenses of microoptical systems and optical emitter/receiver system
JP2008288410A (en) * 2007-05-18 2008-11-27 Toshiba Corp Semiconductor light-emitting device, and manufacturing method thereof
JP2008288409A (en) * 2007-05-18 2008-11-27 Toshiba Corp Light-emitting device, and manufacturing method thereof
US8419497B2 (en) 2007-05-18 2013-04-16 Kabushiki Kaisha Toshiba Light emitting device and method of manufacturing the same
WO2016180816A1 (en) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Method for producing a lens for an optoelectronic lighting device

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