JPS5771145A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5771145A
JPS5771145A JP56055324A JP5532481A JPS5771145A JP S5771145 A JPS5771145 A JP S5771145A JP 56055324 A JP56055324 A JP 56055324A JP 5532481 A JP5532481 A JP 5532481A JP S5771145 A JPS5771145 A JP S5771145A
Authority
JP
Japan
Prior art keywords
film
opening
region
diffused layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56055324A
Other languages
Japanese (ja)
Inventor
Shigeru Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56055324A priority Critical patent/JPS5771145A/en
Publication of JPS5771145A publication Critical patent/JPS5771145A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE:To reduce mask work in fabrication of an MOSIC and to improve yield by such a configuration that two FETs connected in series with a common region which is side of regions of a reverse conduction type, are surrounded by an insulated isolation region having a channel stopping layer. CONSTITUTION:For example on a P type substrate 6 an alumina film 7 of a thickness around 2,000Angstrom is attached, an opening is prepared, and a diffused layer 5 and a thick oxide film 8 is selectively formed on the opening. Next after an N type diffused layer 3-3'' is formed, through forming an opening on a source and drain region of the film 7, a gate film 9, 9' is formed by selective removal of the film 7 with a chromate solution. Continuously an opening is formed on a contacting region, a wiring layer 10-10' for electrode is formed, and a configuration in which FET1 and FET2 are connected in series having a common diffused layer 3' is taken. By this constitution a mask process in a gate film formation can be made unnecessary, and one of optical processes can be eliminated on the whole. In addition an Si nitrate film or the like can be utilized as a mask for selective diffusion and oxidation.
JP56055324A 1981-04-13 1981-04-13 Semiconductor integrated circuit device Pending JPS5771145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56055324A JPS5771145A (en) 1981-04-13 1981-04-13 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56055324A JPS5771145A (en) 1981-04-13 1981-04-13 Semiconductor integrated circuit device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1517971A Division JPS5528229B1 (en) 1971-03-19 1971-03-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58147063A Division JPS5963740A (en) 1983-08-10 1983-08-10 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5771145A true JPS5771145A (en) 1982-05-01

Family

ID=12995357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56055324A Pending JPS5771145A (en) 1981-04-13 1981-04-13 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5771145A (en)

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