JPS5771131A - Formation of conductor for aluminum electrode - Google Patents
Formation of conductor for aluminum electrodeInfo
- Publication number
- JPS5771131A JPS5771131A JP14869080A JP14869080A JPS5771131A JP S5771131 A JPS5771131 A JP S5771131A JP 14869080 A JP14869080 A JP 14869080A JP 14869080 A JP14869080 A JP 14869080A JP S5771131 A JPS5771131 A JP S5771131A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electrode
- repeated
- al2o3
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000004020 conductor Substances 0.000 title 1
- 239000010408 film Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 229910052593 corundum Inorganic materials 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000005611 electricity Effects 0.000 abstract 1
- 230000005012 migration Effects 0.000 abstract 1
- 238000013508 migration Methods 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To suppress the progress with the passage of time of heat or electricity caused changes by a method wherein a process of vapor depositing 1/n of a prescribed thickness t of Al and of exposing the resultant thin film to air is repeated n times so that the Al layer is intentionally provided with oxide films. CONSTITUTION:A semiconductor substrate upon which Al is vapor deposited and exposed to air to provide a thin film of Al2O3. This process is repeated n times to acquire a film of prescribed thickness. Then photoetching is performed to complete an Al electrode. The Al2O3 film, constituting a barrier to migration, prevents the Al from recrystalizing into larger grains. The result is a highly reliable Al electrode that is thermally, electrically stable.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14869080A JPS5771131A (en) | 1980-10-22 | 1980-10-22 | Formation of conductor for aluminum electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14869080A JPS5771131A (en) | 1980-10-22 | 1980-10-22 | Formation of conductor for aluminum electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5771131A true JPS5771131A (en) | 1982-05-01 |
Family
ID=15458415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14869080A Pending JPS5771131A (en) | 1980-10-22 | 1980-10-22 | Formation of conductor for aluminum electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5771131A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61193441A (en) * | 1985-02-20 | 1986-08-27 | Mitsubishi Electric Corp | Method of forming metal thin film and therefor device |
JPS62133735A (en) * | 1985-12-05 | 1987-06-16 | Nec Corp | Manufacture of semiconductor device |
JPS6413740A (en) * | 1987-03-23 | 1989-01-18 | Toshiba Corp | Formation of wiring layer in semiconductor device |
-
1980
- 1980-10-22 JP JP14869080A patent/JPS5771131A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61193441A (en) * | 1985-02-20 | 1986-08-27 | Mitsubishi Electric Corp | Method of forming metal thin film and therefor device |
JPS62133735A (en) * | 1985-12-05 | 1987-06-16 | Nec Corp | Manufacture of semiconductor device |
JPS6413740A (en) * | 1987-03-23 | 1989-01-18 | Toshiba Corp | Formation of wiring layer in semiconductor device |
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