JPS5750476A - High efficiency non-volatile eprom and eeprom - Google Patents

High efficiency non-volatile eprom and eeprom

Info

Publication number
JPS5750476A
JPS5750476A JP56109538A JP10953881A JPS5750476A JP S5750476 A JPS5750476 A JP S5750476A JP 56109538 A JP56109538 A JP 56109538A JP 10953881 A JP10953881 A JP 10953881A JP S5750476 A JPS5750476 A JP S5750476A
Authority
JP
Japan
Prior art keywords
eeprom
high efficiency
efficiency non
volatile eprom
eprom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56109538A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0130315B2 (en, 2012
Inventor
Harari Eriyaho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPS5750476A publication Critical patent/JPS5750476A/ja
Publication of JPH0130315B2 publication Critical patent/JPH0130315B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0425—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a merged floating gate and select transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H10D30/681—Floating-gate IGFETs having only two programming levels
    • H10D30/684—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
    • H10D30/685—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection from the channel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
JP56109538A 1980-09-08 1981-07-15 High efficiency non-volatile eprom and eeprom Granted JPS5750476A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/184,739 US4409723A (en) 1980-04-07 1980-09-08 Method of forming non-volatile EPROM and EEPROM with increased efficiency

Publications (2)

Publication Number Publication Date
JPS5750476A true JPS5750476A (en) 1982-03-24
JPH0130315B2 JPH0130315B2 (en, 2012) 1989-06-19

Family

ID=22678138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56109538A Granted JPS5750476A (en) 1980-09-08 1981-07-15 High efficiency non-volatile eprom and eeprom

Country Status (3)

Country Link
US (1) US4409723A (en, 2012)
JP (1) JPS5750476A (en, 2012)
DE (1) DE3117719A1 (en, 2012)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60148168A (ja) * 1984-01-13 1985-08-05 Seiko Instr & Electronics Ltd 半導体不揮発性メモリ
JPS6160997A (ja) * 1984-08-30 1986-03-28 石川島播磨重工業株式会社 シ−ルド掘削工法における細粒土の分級方法及び装置
JPH025573A (ja) * 1988-02-05 1990-01-10 Texas Instr Inc <Ti> 電気的に消去可能で、電気的にプログラム可能な、読出し専用メモリ・セル
JPH025574A (ja) * 1988-02-05 1990-01-10 Texas Instr Inc <Ti> 電気的に消去可能で、電気的にプログラム可能な、読出し専用メモリ
JPH08264668A (ja) * 1995-03-22 1996-10-11 Nec Corp 不揮発性半導体記憶装置およびその製造方法

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577162A (en) * 1980-06-17 1982-01-14 Toshiba Corp Nonvolatile semiconductor memory and manufacture therefor
JPS5857750A (ja) * 1981-10-01 1983-04-06 Seiko Instr & Electronics Ltd 不揮発性半導体メモリ
JPS5963763A (ja) * 1982-10-05 1984-04-11 Fujitsu Ltd 半導体装置の製造方法
US4949154A (en) * 1983-02-23 1990-08-14 Texas Instruments, Incorporated Thin dielectrics over polysilicon
USRE34535E (en) * 1983-02-23 1994-02-08 Texas Instruments Incorporated Floating gate memory with improved dielectric
US4697330A (en) * 1983-02-23 1987-10-06 Texas Instruments Incorporated Floating gate memory process with improved dielectric
JPS6038799A (ja) * 1983-08-11 1985-02-28 Seiko Instr & Electronics Ltd 半導体不揮発性メモリ用読み出し回路
US4517731A (en) * 1983-09-29 1985-05-21 Fairchild Camera & Instrument Corporation Double polysilicon process for fabricating CMOS integrated circuits
US4769340A (en) * 1983-11-28 1988-09-06 Exel Microelectronics, Inc. Method for making electrically programmable memory device by doping the floating gate by implant
US4639893A (en) * 1984-05-15 1987-01-27 Wafer Scale Integration, Inc. Self-aligned split gate EPROM
EP0164605B1 (en) * 1984-05-17 1990-02-28 Kabushiki Kaisha Toshiba Method of manufacturing nonvolatile semiconductor eeprom device
IT1213218B (it) * 1984-09-25 1989-12-14 Ates Componenti Elettron Processo per la fabbricazione di una cella di memoria non volatile con area di ossido sottile di dimensioni molto piccole, e cella ottenuta con il processo suddetto.
US5225719A (en) * 1985-03-29 1993-07-06 Advanced Micro Devices, Inc. Family of multiple segmented programmable logic blocks interconnected by a high speed centralized switch matrix
US4824795A (en) * 1985-12-19 1989-04-25 Siliconix Incorporated Method for obtaining regions of dielectrically isolated single crystal silicon
US4735919A (en) * 1986-04-15 1988-04-05 General Electric Company Method of making a floating gate memory cell
US4783766A (en) * 1986-05-30 1988-11-08 Seeq Technology, Inc. Block electrically erasable EEPROM
IT1191561B (it) * 1986-06-03 1988-03-23 Sgs Microelettrica Spa Dispositivo di memoria non labile a semiconduttore con porta non connessa (floating gate) alterabile elettricamente
IT1191566B (it) * 1986-06-27 1988-03-23 Sgs Microelettronica Spa Dispositivo di memoria non labile a semiconduttore del tipo a porta non connessa (floating gate) alterabile elettricamente con area di tunnel ridotta e procedimento di fabbricazione
US4758869A (en) * 1986-08-29 1988-07-19 Waferscale Integration, Inc. Nonvolatile floating gate transistor structure
US5034786A (en) * 1986-08-29 1991-07-23 Waferscale Integration, Inc. Opaque cover for preventing erasure of an EPROM
US4794565A (en) * 1986-09-15 1988-12-27 The Regents Of The University Of California Electrically programmable memory device employing source side injection
US5016215A (en) * 1987-09-30 1991-05-14 Texas Instruments Incorporated High speed EPROM with reverse polarity voltages applied to source and drain regions during reading and writing
US4905062A (en) * 1987-11-19 1990-02-27 Texas Instruments Incorporated Planar famos transistor with trench isolation
US5014097A (en) * 1987-12-24 1991-05-07 Waferscale Integration, Inc. On-chip high voltage generator and regulator in an integrated circuit
US4858185A (en) * 1988-01-28 1989-08-15 National Semiconductor Corporation Zero power, electrically alterable, nonvolatile latch
US4998220A (en) * 1988-05-03 1991-03-05 Waferscale Integration, Inc. EEPROM with improved erase structure
US5445980A (en) 1988-05-10 1995-08-29 Hitachi, Ltd. Method of making a semiconductor memory device
US5153144A (en) * 1988-05-10 1992-10-06 Hitachi, Ltd. Method of making tunnel EEPROM
US5268318A (en) * 1988-06-08 1993-12-07 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
US5198380A (en) * 1988-06-08 1993-03-30 Sundisk Corporation Method of highly compact EPROM and flash EEPROM devices
US5268319A (en) * 1988-06-08 1993-12-07 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
FR2634318B1 (fr) * 1988-07-13 1992-02-21 Commissariat Energie Atomique Procede de fabrication d'une cellule de memoire integree
US4958321A (en) * 1988-09-22 1990-09-18 Advanced Micro Devices, Inc. One transistor flash EPROM cell
US5016216A (en) * 1988-10-17 1991-05-14 Waferscale Integration, Inc. Decoder for a floating gate memory
JPH03209728A (ja) * 1989-10-11 1991-09-12 Mitsubishi Electric Corp 半導体装置
US5036378A (en) * 1989-11-01 1991-07-30 At&T Bell Laboratories Memory device
EP0495492B1 (en) * 1991-01-17 1999-04-14 Texas Instruments Incorporated Non-volatile memory cell structure and process for forming same
US5396459A (en) * 1992-02-24 1995-03-07 Sony Corporation Single transistor flash electrically programmable memory cell in which a negative voltage is applied to the nonselected word line
KR100475719B1 (ko) * 1997-06-30 2005-07-07 주식회사 하이닉스반도체 반도체장치의게이트전극
FR2769747B1 (fr) * 1997-10-15 2001-10-05 Sgs Thomson Microelectronics Perfectionnement aux memoires non volatiles programmables par effet dit "de porteurs chauds" et effacables par effet tunnel
KR100349768B1 (ko) * 1998-06-30 2002-08-24 샤프 가부시키가이샤 반도체 장치 및 그의 제조방법
JP2001093996A (ja) * 1999-09-27 2001-04-06 Toshiba Corp 半導体装置の製造方法
US6384448B1 (en) 2000-02-28 2002-05-07 Micron Technology, Inc. P-channel dynamic flash memory cells with ultrathin tunnel oxides
US6249460B1 (en) * 2000-02-28 2001-06-19 Micron Technology, Inc. Dynamic flash memory cells with ultrathin tunnel oxides
US6639835B2 (en) 2000-02-29 2003-10-28 Micron Technology, Inc. Static NVRAM with ultra thin tunnel oxides
US7064034B2 (en) * 2002-07-02 2006-06-20 Sandisk Corporation Technique for fabricating logic elements using multiple gate layers
US7015111B2 (en) * 2003-10-28 2006-03-21 Micron Technology, Inc. Use of selective oxidation to form asymmetrical oxide features during the manufacture of a semiconductor device
US7057931B2 (en) * 2003-11-07 2006-06-06 Sandisk Corporation Flash memory programming using gate induced junction leakage current
JP2006344809A (ja) * 2005-06-09 2006-12-21 Toshiba Corp 半導体装置及びその製造方法
US7374996B2 (en) 2005-11-14 2008-05-20 Charles Kuo Structured, electrically-formed floating gate for flash memories

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7907193L (sv) * 1978-09-28 1980-03-29 Rca Corp Bestendigt minne
US4342099A (en) * 1979-06-18 1982-07-27 Texas Instruments Incorporated Electrically erasable programmable MNOS read only memory
US4267632A (en) * 1979-10-19 1981-05-19 Intel Corporation Process for fabricating a high density electrically programmable memory array
US4328565A (en) * 1980-04-07 1982-05-04 Eliyahou Harari Non-volatile eprom with increased efficiency

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60148168A (ja) * 1984-01-13 1985-08-05 Seiko Instr & Electronics Ltd 半導体不揮発性メモリ
JPS6160997A (ja) * 1984-08-30 1986-03-28 石川島播磨重工業株式会社 シ−ルド掘削工法における細粒土の分級方法及び装置
JPH025573A (ja) * 1988-02-05 1990-01-10 Texas Instr Inc <Ti> 電気的に消去可能で、電気的にプログラム可能な、読出し専用メモリ・セル
JPH025574A (ja) * 1988-02-05 1990-01-10 Texas Instr Inc <Ti> 電気的に消去可能で、電気的にプログラム可能な、読出し専用メモリ
JPH08264668A (ja) * 1995-03-22 1996-10-11 Nec Corp 不揮発性半導体記憶装置およびその製造方法

Also Published As

Publication number Publication date
JPH0130315B2 (en, 2012) 1989-06-19
DE3117719C2 (en, 2012) 1988-04-28
US4409723A (en) 1983-10-18
DE3117719A1 (de) 1982-04-01

Similar Documents

Publication Publication Date Title
JPS5750476A (en) High efficiency non-volatile eprom and eeprom
GB2073484B (en) Non-volatile eprom cell
JPS56139368A (en) Fence
JPS57100971A (en) Construction material
JPS5727962A (en) Construction material
GB2078894B (en) Nails
DE3170670D1 (en) Nail
GB2081766B (en) Blastproof shelter
JPS57120712A (en) Staple
JPS576067A (en) Fence
DE3176713D1 (en) Nonvolatile memory
JPS56139336A (en) Building facing material
JPS576048A (en) Building material
JPS57100252A (en) Building material
JPS5744042A (en) Soundinsulating building material
JPS56153066A (en) Fence
JPS5740076A (en) Fence
JPS5781551A (en) Roofing material
JPS56115440A (en) Building
GB2085045B (en) Shelter
JPS5792255A (en) Building material
JPS5754653A (en) Building material
JPS5792257A (en) Building material
JPS5740077A (en) Fence
GB2081972B (en) Non-volatile ram element