JPS5750439A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5750439A
JPS5750439A JP12594880A JP12594880A JPS5750439A JP S5750439 A JPS5750439 A JP S5750439A JP 12594880 A JP12594880 A JP 12594880A JP 12594880 A JP12594880 A JP 12594880A JP S5750439 A JPS5750439 A JP S5750439A
Authority
JP
Japan
Prior art keywords
conductor
plate
intermediate buffer
buffer plate
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12594880A
Other languages
English (en)
Inventor
Tokuo Watanabe
Masami Naito
Nobutake Konishi
Tomoyuki Tanaka
Takeshi Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12594880A priority Critical patent/JPS5750439A/ja
Publication of JPS5750439A publication Critical patent/JPS5750439A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
JP12594880A 1980-09-12 1980-09-12 Semiconductor device Pending JPS5750439A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12594880A JPS5750439A (en) 1980-09-12 1980-09-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12594880A JPS5750439A (en) 1980-09-12 1980-09-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5750439A true JPS5750439A (en) 1982-03-24

Family

ID=14922930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12594880A Pending JPS5750439A (en) 1980-09-12 1980-09-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5750439A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042863A (ja) * 1983-08-17 1985-03-07 Mitsubishi Electric Corp 光駆動半導体装置
JPS6147668A (ja) * 1984-06-09 1986-03-08 セミクロン　エレクトロニク　ゲーエムベーハー 耐交番負荷性のスイツチング動作可能な半導体素子
JPS6142836U (ja) * 1984-08-21 1986-03-19 日本インター株式会社 半導体装置
JP2008084926A (ja) * 2006-09-26 2008-04-10 Mitsubishi Electric Corp 圧接型半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450268A (en) * 1977-09-28 1979-04-20 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450268A (en) * 1977-09-28 1979-04-20 Mitsubishi Electric Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042863A (ja) * 1983-08-17 1985-03-07 Mitsubishi Electric Corp 光駆動半導体装置
JPS6147668A (ja) * 1984-06-09 1986-03-08 セミクロン　エレクトロニク　ゲーエムベーハー 耐交番負荷性のスイツチング動作可能な半導体素子
JPS6142836U (ja) * 1984-08-21 1986-03-19 日本インター株式会社 半導体装置
JP2008084926A (ja) * 2006-09-26 2008-04-10 Mitsubishi Electric Corp 圧接型半導体装置
US8456001B2 (en) 2006-09-26 2013-06-04 Mitsubishi Electric Corporation Pressure-contact semiconductor device

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