JPS5516255A - Measuring device of semiconductor device - Google Patents

Measuring device of semiconductor device

Info

Publication number
JPS5516255A
JPS5516255A JP8904878A JP8904878A JPS5516255A JP S5516255 A JPS5516255 A JP S5516255A JP 8904878 A JP8904878 A JP 8904878A JP 8904878 A JP8904878 A JP 8904878A JP S5516255 A JPS5516255 A JP S5516255A
Authority
JP
Japan
Prior art keywords
semiconductor chip
film substrate
substrate
pressure rubber
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8904878A
Other languages
Japanese (ja)
Inventor
Yukio Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8904878A priority Critical patent/JPS5516255A/en
Publication of JPS5516255A publication Critical patent/JPS5516255A/en
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE: To accurately measure the various characteristics of a semiconductor chip, by using an insulating substrate forming peripheral circuits, and by directly contacting the measuring terminals of a film substrate made up to a portion lower than the substrate with the electrodes of the semiconductor chip.
CONSTITUTION: When moving an insulating substrate 4, to which a film substrate 11, a spacer 10, a pressure rubber support plate 9, pressure rubber 8, other various electric parts 5, etc. are mounted, in the arrow head direction, terminals 7 installed to the film substrate 11 contact with the electrodes 3 of a semiconductor chip 1 through the fixed pressure of the pressure rubber 8. Thus, this condition becomes equivalent to the mounting of the semiconductor chip 1 to peripheral circuits, and the semiconductor chip can accurately be measured. High-frequency at the semiconductor chip and a wafer can be measured at low cost in the film substrate because the lead length of a conductor of the film substrate 11 can particularly be formed in several mm per one lead.
COPYRIGHT: (C)1980,JPO&Japio
JP8904878A 1978-07-20 1978-07-20 Measuring device of semiconductor device Pending JPS5516255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8904878A JPS5516255A (en) 1978-07-20 1978-07-20 Measuring device of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8904878A JPS5516255A (en) 1978-07-20 1978-07-20 Measuring device of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5516255A true JPS5516255A (en) 1980-02-04

Family

ID=13959991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8904878A Pending JPS5516255A (en) 1978-07-20 1978-07-20 Measuring device of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5516255A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60214276A (en) * 1984-04-11 1985-10-26 Hitachi Ltd Probing device for integrated circuit component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60214276A (en) * 1984-04-11 1985-10-26 Hitachi Ltd Probing device for integrated circuit component

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