JPS57187964A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS57187964A
JPS57187964A JP7225781A JP7225781A JPS57187964A JP S57187964 A JPS57187964 A JP S57187964A JP 7225781 A JP7225781 A JP 7225781A JP 7225781 A JP7225781 A JP 7225781A JP S57187964 A JPS57187964 A JP S57187964A
Authority
JP
Japan
Prior art keywords
rubber
chip
substrate
sheet
approximately
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7225781A
Other languages
Japanese (ja)
Inventor
Nobuo Iwase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7225781A priority Critical patent/JPS57187964A/en
Publication of JPS57187964A publication Critical patent/JPS57187964A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To make connection between electrodes of elements and conductors under the electrodes easily by a method wherein the surface of a substrate is covered by anisotropic conductive rubber which is conductive in the perpendicular direction to the sheet surface and is insulating in the parallel direction to the sheet surface and element chips are mounted at a certain position on the rubber. CONSTITUTION:Conductors 2 and insulators 3 are formed on one side of an alumina substrate 1. This circuit substrate is covered by an anisotropic rubber sheet 7 which is approximately same size as the substrate. At that time, both sides of the rubber sheet is coated by thin Si rubber as main adhision agent. Then a passive element chip 4 and on active element chip 5 are mounted on a certain position on the rubber. Immediately after the mounting of one chip, the chip is compressed by pressure approximately 30kg/cm<2> at the temperature approximately 70-80 deg.C and those three, namely the electrode of the element, the anisotropic conductive rubber 7 and the conductor 2, are fused and made contact. Other chips are also processed successively in the same way.
JP7225781A 1981-05-15 1981-05-15 Hybrid integrated circuit Pending JPS57187964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7225781A JPS57187964A (en) 1981-05-15 1981-05-15 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7225781A JPS57187964A (en) 1981-05-15 1981-05-15 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS57187964A true JPS57187964A (en) 1982-11-18

Family

ID=13484054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7225781A Pending JPS57187964A (en) 1981-05-15 1981-05-15 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS57187964A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186061A (en) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd Device for driving contact type image sensor or thermal head or the like

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61186061A (en) * 1985-02-13 1986-08-19 Fuji Xerox Co Ltd Device for driving contact type image sensor or thermal head or the like

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