JPS5472981A - Checking method for characteristics of semiconductor element - Google Patents

Checking method for characteristics of semiconductor element

Info

Publication number
JPS5472981A
JPS5472981A JP13997177A JP13997177A JPS5472981A JP S5472981 A JPS5472981 A JP S5472981A JP 13997177 A JP13997177 A JP 13997177A JP 13997177 A JP13997177 A JP 13997177A JP S5472981 A JPS5472981 A JP S5472981A
Authority
JP
Japan
Prior art keywords
measuring
electrodes
conductors
checked unit
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13997177A
Other languages
Japanese (ja)
Other versions
JPS6047744B2 (en
Inventor
Shinaya Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52139971A priority Critical patent/JPS6047744B2/en
Publication of JPS5472981A publication Critical patent/JPS5472981A/en
Publication of JPS6047744B2 publication Critical patent/JPS6047744B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To automatize characteristic checking measurements by mounting a checked unit, composed of a plural number of semiconductor elements connected in series, on a flexible conductive board with metal foil on its surface and by measuring elements one after another by sliding the measuring terminal of an automatic measuring instrument on electrodes of elements.
CONSTITUTION: The checked unit composed of a plural number of semiconductor elements 2 linked mutually into a plate body via resin 5 is mounted, by being pressed, on flexible conductive plate 1 of resin-like rubber clay provided with metal foil such as Al on its surface. Then, jig 6 with conductors 8 at the same pitch as electrodes 4 of the checked unit on insulating plate 7 is mounted on the checked unit while electrodes 4 and conductors 8 are made in contact. Next, measuring terminals 19 of measuring runner 10 connected to automatic measuring instrument 15 are caused to touch electrodes 4 via conductors 8 to measure characteristics of each element one after another while moving. If a defective is found, the mark of defect display is recorded through the automatic operation of marking runner 20.
COPYRIGHT: (C)1979,JPO&Japio
JP52139971A 1977-11-24 1977-11-24 Method for testing characteristics of semiconductor devices Expired JPS6047744B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52139971A JPS6047744B2 (en) 1977-11-24 1977-11-24 Method for testing characteristics of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52139971A JPS6047744B2 (en) 1977-11-24 1977-11-24 Method for testing characteristics of semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5472981A true JPS5472981A (en) 1979-06-11
JPS6047744B2 JPS6047744B2 (en) 1985-10-23

Family

ID=15257926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52139971A Expired JPS6047744B2 (en) 1977-11-24 1977-11-24 Method for testing characteristics of semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6047744B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5465658A (en) * 1977-10-31 1979-05-26 Matsushita Electric Works Ltd Hair dryer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5465658A (en) * 1977-10-31 1979-05-26 Matsushita Electric Works Ltd Hair dryer

Also Published As

Publication number Publication date
JPS6047744B2 (en) 1985-10-23

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