JPS6480073A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6480073A
JPS6480073A JP23601087A JP23601087A JPS6480073A JP S6480073 A JPS6480073 A JP S6480073A JP 23601087 A JP23601087 A JP 23601087A JP 23601087 A JP23601087 A JP 23601087A JP S6480073 A JPS6480073 A JP S6480073A
Authority
JP
Japan
Prior art keywords
region
layer
depletion
junction
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23601087A
Other languages
Japanese (ja)
Inventor
Yoshinori Murakami
Naoki Kumagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP23601087A priority Critical patent/JPS6480073A/en
Publication of JPS6480073A publication Critical patent/JPS6480073A/en
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To assure the stable high dielectric breakdown voltage by a method wherein the growth of depletion layers is accelerated by the effects of field plate and research structure while the same conductivity type layer in high impurity concentration is provided below the end of said plate through the intermediary of an insulating layer. CONSTITUTION:A conductive layer wherein a contact hole 31 is in contact with a p<+>region 2 (the second region) becomes a field plate 4 while a depletion layer 10 extends from the rear side of the conductive layer. Besides, another depletion layer 20 formed in research structure extends in the side near a PN junction 52 between an n region 1 and a p layer 6 in low concentration in contact with the n region 1. The dielectric breakdown voltage is stabilized not affected by any surface state by the actions of these two depletion layers 10, 20 while the ends of depletion layers 10, 20 are kept away from the PN junction 51 to moderate the electric field impressed on the PN junction 51 under voltage in the reverse direction. Furthermore, an n<+>region 7 in impurity concentration higher than that in the n region 1 is formed below the end of the plate 4 while the depletion layer 10 stops in this n<+>region 7 so that the electric field may not concentrate in the region 7 in low resistance causing no dielectric breakdown in this part.
JP23601087A 1987-09-19 1987-09-19 Semiconductor device Pending JPS6480073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23601087A JPS6480073A (en) 1987-09-19 1987-09-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23601087A JPS6480073A (en) 1987-09-19 1987-09-19 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6480073A true JPS6480073A (en) 1989-03-24

Family

ID=16994444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23601087A Pending JPS6480073A (en) 1987-09-19 1987-09-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6480073A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04290223A (en) * 1990-11-26 1992-10-14 Motorola Inc Semiconductor device having buried contact for penetration prevention and manufacture thereof
US5750414A (en) * 1993-09-29 1998-05-12 Siemens Components, Inc. Method of fabricating a semiconductor device
JP2003060194A (en) * 2001-08-10 2003-02-28 Sanyo Electric Co Ltd Semiconductor device and manufacturing method therefor
US9917182B1 (en) 2016-09-09 2018-03-13 Kabushiki Kaisha Toshiba Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04290223A (en) * 1990-11-26 1992-10-14 Motorola Inc Semiconductor device having buried contact for penetration prevention and manufacture thereof
US5750414A (en) * 1993-09-29 1998-05-12 Siemens Components, Inc. Method of fabricating a semiconductor device
JP2003060194A (en) * 2001-08-10 2003-02-28 Sanyo Electric Co Ltd Semiconductor device and manufacturing method therefor
US9917182B1 (en) 2016-09-09 2018-03-13 Kabushiki Kaisha Toshiba Semiconductor device

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