JPS5750435A - Plasma etching device - Google Patents

Plasma etching device

Info

Publication number
JPS5750435A
JPS5750435A JP12633380A JP12633380A JPS5750435A JP S5750435 A JPS5750435 A JP S5750435A JP 12633380 A JP12633380 A JP 12633380A JP 12633380 A JP12633380 A JP 12633380A JP S5750435 A JPS5750435 A JP S5750435A
Authority
JP
Japan
Prior art keywords
electrode
etching
grounding
bias voltage
vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12633380A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0136247B2 (cs
Inventor
Takashi Yamazaki
Tetsuo Kurisaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Tokuda Seisakusho Co Ltd
Original Assignee
Toshiba Corp
Tokuda Seisakusho Co Ltd
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokuda Seisakusho Co Ltd, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12633380A priority Critical patent/JPS5750435A/ja
Publication of JPS5750435A publication Critical patent/JPS5750435A/ja
Publication of JPH0136247B2 publication Critical patent/JPH0136247B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
JP12633380A 1980-09-11 1980-09-11 Plasma etching device Granted JPS5750435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12633380A JPS5750435A (en) 1980-09-11 1980-09-11 Plasma etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12633380A JPS5750435A (en) 1980-09-11 1980-09-11 Plasma etching device

Publications (2)

Publication Number Publication Date
JPS5750435A true JPS5750435A (en) 1982-03-24
JPH0136247B2 JPH0136247B2 (cs) 1989-07-31

Family

ID=14932579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12633380A Granted JPS5750435A (en) 1980-09-11 1980-09-11 Plasma etching device

Country Status (1)

Country Link
JP (1) JPS5750435A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6214429A (ja) * 1985-07-12 1987-01-23 Hitachi Ltd 表面処理方法及び表面処理装置
JPH01170387A (ja) * 1987-12-22 1989-07-05 Yaskawa Electric Mfg Co Ltd 電動機の同期運転方式
US4897171A (en) * 1985-11-26 1990-01-30 Tadahiro Ohmi Wafer susceptor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368171A (en) * 1976-11-30 1978-06-17 Hitachi Ltd Method and apparatus for plasma treatment
JPS53114679A (en) * 1977-03-17 1978-10-06 Fujitsu Ltd Plasm etching unit
JPS5440079A (en) * 1977-09-05 1979-03-28 Fujitsu Ltd Plasma etching method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368171A (en) * 1976-11-30 1978-06-17 Hitachi Ltd Method and apparatus for plasma treatment
JPS53114679A (en) * 1977-03-17 1978-10-06 Fujitsu Ltd Plasm etching unit
JPS5440079A (en) * 1977-09-05 1979-03-28 Fujitsu Ltd Plasma etching method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6214429A (ja) * 1985-07-12 1987-01-23 Hitachi Ltd 表面処理方法及び表面処理装置
US4897171A (en) * 1985-11-26 1990-01-30 Tadahiro Ohmi Wafer susceptor
JPH01170387A (ja) * 1987-12-22 1989-07-05 Yaskawa Electric Mfg Co Ltd 電動機の同期運転方式

Also Published As

Publication number Publication date
JPH0136247B2 (cs) 1989-07-31

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