JPS5440079A - Plasma etching method - Google Patents

Plasma etching method

Info

Publication number
JPS5440079A
JPS5440079A JP10654477A JP10654477A JPS5440079A JP S5440079 A JPS5440079 A JP S5440079A JP 10654477 A JP10654477 A JP 10654477A JP 10654477 A JP10654477 A JP 10654477A JP S5440079 A JPS5440079 A JP S5440079A
Authority
JP
Japan
Prior art keywords
plasma etching
etching method
etching
undercut
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10654477A
Other languages
Japanese (ja)
Other versions
JPS597212B2 (en
Inventor
Masanao Itoga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP52106544A priority Critical patent/JPS597212B2/en
Publication of JPS5440079A publication Critical patent/JPS5440079A/en
Publication of JPS597212B2 publication Critical patent/JPS597212B2/en
Expired legal-status Critical Current

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  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To ensure an etching with an accurate pattern with no undercut by adjusting independently the voltage to be applied to the electrodes of the plasma etching devices provided oppositely to each other.
COPYRIGHT: (C)1979,JPO&Japio
JP52106544A 1977-09-05 1977-09-05 Plasma etching method Expired JPS597212B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52106544A JPS597212B2 (en) 1977-09-05 1977-09-05 Plasma etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52106544A JPS597212B2 (en) 1977-09-05 1977-09-05 Plasma etching method

Publications (2)

Publication Number Publication Date
JPS5440079A true JPS5440079A (en) 1979-03-28
JPS597212B2 JPS597212B2 (en) 1984-02-17

Family

ID=14436301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52106544A Expired JPS597212B2 (en) 1977-09-05 1977-09-05 Plasma etching method

Country Status (1)

Country Link
JP (1) JPS597212B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118637A (en) * 1979-03-06 1980-09-11 Chiyou Lsi Gijutsu Kenkyu Kumiai Plasma etching apparatus
JPS5750435A (en) * 1980-09-11 1982-03-24 Toshiba Corp Plasma etching device
JPS58158929A (en) * 1982-03-17 1983-09-21 Kokusai Electric Co Ltd Plasma generator
JPS60140723A (en) * 1983-12-28 1985-07-25 Oki Electric Ind Co Ltd Dry etching apparatus
JPS60187025A (en) * 1984-03-07 1985-09-24 Ulvac Corp Self-bias voltage controller in plasma discharge device
JPS61166028A (en) * 1985-01-17 1986-07-26 Anelva Corp Dry etching equipment
JPS62274725A (en) * 1986-05-23 1987-11-28 Tokuda Seisakusho Ltd Etching system
JPS63288021A (en) * 1986-10-17 1988-11-25 Hitachi Ltd Method and device for plasma processing
JPH0354825A (en) * 1989-07-21 1991-03-08 Tokyo Electron Ltd Plasma processor
JPH10321598A (en) * 1997-05-15 1998-12-04 Nec Kyushu Ltd Semiconductor device manufacturing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0216009Y2 (en) * 1985-08-31 1990-05-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5024079A (en) * 1973-06-29 1975-03-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5024079A (en) * 1973-06-29 1975-03-14

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55118637A (en) * 1979-03-06 1980-09-11 Chiyou Lsi Gijutsu Kenkyu Kumiai Plasma etching apparatus
JPS5750435A (en) * 1980-09-11 1982-03-24 Toshiba Corp Plasma etching device
JPH0136247B2 (en) * 1980-09-11 1989-07-31 Toshiba Kk
JPH0119261B2 (en) * 1982-03-17 1989-04-11 Kokusai Denki Kk
JPS58158929A (en) * 1982-03-17 1983-09-21 Kokusai Electric Co Ltd Plasma generator
JPS60140723A (en) * 1983-12-28 1985-07-25 Oki Electric Ind Co Ltd Dry etching apparatus
JPH0363806B2 (en) * 1983-12-28 1991-10-02 Oki Electric Ind Co Ltd
JPS60187025A (en) * 1984-03-07 1985-09-24 Ulvac Corp Self-bias voltage controller in plasma discharge device
JPS61166028A (en) * 1985-01-17 1986-07-26 Anelva Corp Dry etching equipment
JPH0527967B2 (en) * 1985-01-17 1993-04-22 Anelva Corp
JPS62274725A (en) * 1986-05-23 1987-11-28 Tokuda Seisakusho Ltd Etching system
JPS63288021A (en) * 1986-10-17 1988-11-25 Hitachi Ltd Method and device for plasma processing
JPH0354825A (en) * 1989-07-21 1991-03-08 Tokyo Electron Ltd Plasma processor
JPH10321598A (en) * 1997-05-15 1998-12-04 Nec Kyushu Ltd Semiconductor device manufacturing device

Also Published As

Publication number Publication date
JPS597212B2 (en) 1984-02-17

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