JPS52122284A - Sputtering device having bias electrode - Google Patents

Sputtering device having bias electrode

Info

Publication number
JPS52122284A
JPS52122284A JP3827176A JP3827176A JPS52122284A JP S52122284 A JPS52122284 A JP S52122284A JP 3827176 A JP3827176 A JP 3827176A JP 3827176 A JP3827176 A JP 3827176A JP S52122284 A JPS52122284 A JP S52122284A
Authority
JP
Japan
Prior art keywords
sputtering device
bias electrode
electrode
substrate
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3827176A
Other languages
Japanese (ja)
Inventor
Yoshio Honma
Yukiyoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3827176A priority Critical patent/JPS52122284A/en
Publication of JPS52122284A publication Critical patent/JPS52122284A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:The above-mentioned device for carrying out the formation of thin membrane or the etching, by introducing the gas of low pressure into the vacuum chamber having the opposed (not necessarily parallel) two electrodes (the RF electrode and the substrate) and by carrying out the high frequency glow discharge between the RF electrode and the substrate.
JP3827176A 1976-04-07 1976-04-07 Sputtering device having bias electrode Pending JPS52122284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3827176A JPS52122284A (en) 1976-04-07 1976-04-07 Sputtering device having bias electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3827176A JPS52122284A (en) 1976-04-07 1976-04-07 Sputtering device having bias electrode

Publications (1)

Publication Number Publication Date
JPS52122284A true JPS52122284A (en) 1977-10-14

Family

ID=12520642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3827176A Pending JPS52122284A (en) 1976-04-07 1976-04-07 Sputtering device having bias electrode

Country Status (1)

Country Link
JP (1) JPS52122284A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538043A (en) * 1978-09-12 1980-03-17 Fujitsu Ltd Dry etching device
JPS6070170A (en) * 1983-09-23 1985-04-20 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Method and device for depositing metal layer
JPH01108371A (en) * 1987-10-20 1989-04-25 Fuji Electric Co Ltd Thin film forming device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538043A (en) * 1978-09-12 1980-03-17 Fujitsu Ltd Dry etching device
JPS6070170A (en) * 1983-09-23 1985-04-20 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Method and device for depositing metal layer
JPH0112831B2 (en) * 1983-09-23 1989-03-02 Intaanashonaru Bijinesu Mashiinzu Corp
JPH01108371A (en) * 1987-10-20 1989-04-25 Fuji Electric Co Ltd Thin film forming device
JPH0541703B2 (en) * 1987-10-20 1993-06-24 Fuji Electric Co Ltd

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